JPS552735B1 - - Google Patents

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Publication number
JPS552735B1
JPS552735B1 JP5226467A JP5226467A JPS552735B1 JP S552735 B1 JPS552735 B1 JP S552735B1 JP 5226467 A JP5226467 A JP 5226467A JP 5226467 A JP5226467 A JP 5226467A JP S552735 B1 JPS552735 B1 JP S552735B1
Authority
JP
Japan
Prior art keywords
chip
assembly
printed circuit
encapsulated
plastics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5226467A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS552735B1 publication Critical patent/JPS552735B1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/19043—Component type being a resistor

Abstract

1,185,857. Electric couplings. SIGNETICS CORP. 15 Aug., 1967 [16 Aug., 1966; 27 Feb., 1967], No. 37486/67. Heading H2E. [Also in Division H1] In an integrated circuit assembly a semiconductor chip or die 11 (Figs. 9, 10) has printed circuit leads 14 on one face and terminating in contact pads 16, which pads on assembly are soldered or welded to ends 33a of printed circuit connecting elements 33 on a rigid plastics member 31. The chip is then encapsulated to the member 31 by a plastics block 36 (Fig. 10). The member 31 is then laid on a printed circuit board 41 so that the chip lies in a recess 46 and the connecting elements 33 engage a printed circuit pattern 43, to which they are subsequently bonded by soldering or welding. The assembly is then encapsulated in plastics 48. There may be a plurality of chip assemblies on one circuit board. In another embodiment (Fig. 2, not shown) the chip is connected and bonded to a pattern of free-standing metal leads by thin film connecting elements on a flexible plastics sheet, the free standing leads being subsequently bent downwards to form connecting pins and the assembly encapsulated as Fig. 8.
JP5226467A 1966-08-16 1967-08-16 Pending JPS552735B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57272066A 1966-08-16 1966-08-16
US61897367A 1967-02-27 1967-02-27

Publications (1)

Publication Number Publication Date
JPS552735B1 true JPS552735B1 (en) 1980-01-22

Family

ID=27075925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5226467A Pending JPS552735B1 (en) 1966-08-16 1967-08-16

Country Status (3)

Country Link
JP (1) JPS552735B1 (en)
DE (1) DE1614575A1 (en)
GB (1) GB1185857A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58145297U (en) * 1982-03-26 1983-09-30 ヤンマーディーゼル株式会社 Stern bearing device for small inboard motors
JPS58145295U (en) * 1982-03-26 1983-09-30 ヤンマーディーゼル株式会社 Intermediate shaft of propeller shaft for small inboard motors
JPS58145298U (en) * 1982-03-26 1983-09-30 ヤンマーディーゼル株式会社 Stern bearing device for small inboard motors
JPH0465693U (en) * 1990-10-15 1992-06-08

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2151765C2 (en) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Method for contacting integrated circuits with beam lead connections
FR2498814B1 (en) * 1981-01-26 1985-12-20 Burroughs Corp HOUSING FOR INTEGRATED CIRCUIT, MEANS FOR MOUNTING AND MANUFACTURING METHOD
GB2124433B (en) * 1982-07-07 1986-05-21 Int Standard Electric Corp Electronic component assembly
US4843188A (en) * 1986-03-25 1989-06-27 Western Digital Corporation Integrated circuit chip mounting and packaging assembly
US4843695A (en) * 1987-07-16 1989-07-04 Digital Equipment Corporation Method of assembling tab bonded semiconductor chip package
GB2247104A (en) * 1990-08-15 1992-02-19 Emi Plc Thorn Connections for semiconductor chips
CN101356633B (en) * 2005-11-01 2011-03-23 Nxp股份有限公司 Methods of packaging a semiconductor die and package formed by the methods
CN111446227A (en) * 2020-05-19 2020-07-24 华进半导体封装先导技术研发中心有限公司 Packaging structure and packaging method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58145297U (en) * 1982-03-26 1983-09-30 ヤンマーディーゼル株式会社 Stern bearing device for small inboard motors
JPS58145295U (en) * 1982-03-26 1983-09-30 ヤンマーディーゼル株式会社 Intermediate shaft of propeller shaft for small inboard motors
JPS58145298U (en) * 1982-03-26 1983-09-30 ヤンマーディーゼル株式会社 Stern bearing device for small inboard motors
JPH0465693U (en) * 1990-10-15 1992-06-08

Also Published As

Publication number Publication date
GB1185857A (en) 1970-03-25
DE1614575A1 (en) 1970-05-27

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