GB1148352A - Improvements in or relating to processes for providing electrical components with connecting leads - Google Patents

Improvements in or relating to processes for providing electrical components with connecting leads

Info

Publication number
GB1148352A
GB1148352A GB4175667A GB4175667A GB1148352A GB 1148352 A GB1148352 A GB 1148352A GB 4175667 A GB4175667 A GB 4175667A GB 4175667 A GB4175667 A GB 4175667A GB 1148352 A GB1148352 A GB 1148352A
Authority
GB
United Kingdom
Prior art keywords
sheet
components
cut
electrical components
sept
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4175667A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1148352A publication Critical patent/GB1148352A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for devices being provided for in H01L29/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

1,148,352. Semi-conductor devices; capacitors. SIEMENS A.G. 13 Sept., 1967 [14 Sept., 1966], No. 41756/67. Headings H1K and H1M. Each of a plurality of electrical components 8-particularly semi-conductor components, though capacitors and resistors are also mentioned-is sandwiched between a portion 6 of a suitably cut-out metal sheet and a second portion 8 which is bent over from an initial position shown in section A of Fig. 1 to a final position shown in section B of Fig. 1. The components are thus held on the sheet and may be transported on it through processing stages, such as etching. Ultimately the sheet, which may be solder-coated for the purpose, is bonded to the components by soldering; alternatively, a thermo-compression bonding technique may be employed. Then each device is individually encapsulated by a moulding process and finally the portions of the sheet to which the components have been bonded are cut from the sheet and serve as the component terminals. For components required to have more than two terminals, such as the transistor depicted in Fig. 3 (not shown), the pattern of cut-outs in the original sheet is appropriately modified.
GB4175667A 1966-09-14 1967-09-13 Improvements in or relating to processes for providing electrical components with connecting leads Expired GB1148352A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0105860 1966-09-14

Publications (1)

Publication Number Publication Date
GB1148352A true GB1148352A (en) 1969-04-10

Family

ID=7526918

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4175667A Expired GB1148352A (en) 1966-09-14 1967-09-13 Improvements in or relating to processes for providing electrical components with connecting leads

Country Status (7)

Country Link
AT (1) AT270752B (en)
CH (1) CH466436A (en)
DE (1) DE1564708A1 (en)
FR (1) FR1536697A (en)
GB (1) GB1148352A (en)
NL (1) NL6710083A (en)
SE (1) SE351519B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999955A (en) * 1975-07-15 1976-12-28 Allegheny Ludlum Industries, Inc. Strip for lead frames
JPS58108761A (en) * 1981-12-23 1983-06-28 Toshiba Corp Electronic component part

Also Published As

Publication number Publication date
CH466436A (en) 1968-12-15
NL6710083A (en) 1968-03-15
AT270752B (en) 1969-05-12
FR1536697A (en) 1968-08-16
SE351519B (en) 1972-11-27
DE1564708A1 (en) 1970-02-12

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