GB1188451A - Improvements relating to methods of making Connections to Small Components - Google Patents

Improvements relating to methods of making Connections to Small Components

Info

Publication number
GB1188451A
GB1188451A GB4192/68A GB419268A GB1188451A GB 1188451 A GB1188451 A GB 1188451A GB 4192/68 A GB4192/68 A GB 4192/68A GB 419268 A GB419268 A GB 419268A GB 1188451 A GB1188451 A GB 1188451A
Authority
GB
United Kingdom
Prior art keywords
frame
finer
fingers
methods
improvements relating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4192/68A
Inventor
Martin Peter Diment
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB4192/68A priority Critical patent/GB1188451A/en
Publication of GB1188451A publication Critical patent/GB1188451A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

1,188,451. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. 22 Jan., 1969 [26 Jan., 1968], No. 4192/68. Heading H1K. In making connection to a semi-conductor or integrated circuit device two frame-lead assemblies are used, one being a fairly large structure and the other being a finer one which is used to connect the ends of the fingers of the large one to bonding pads on the device. The device 4 may be carried by the fingers of the finer frame 7<SP>1</SP>, as shown, or may be carried by a relatively massive finger (acting as a heat sink) of the large frame 1<SP>11</SP>. In the finished structure the fingers of the finer frame may be substantially in the plane of the frame itself or may be looped from that plane. The finer frame has no backing substrate but the large frame may be constituted by tracks on a printed circuit.
GB4192/68A 1968-01-26 1968-01-26 Improvements relating to methods of making Connections to Small Components Expired GB1188451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4192/68A GB1188451A (en) 1968-01-26 1968-01-26 Improvements relating to methods of making Connections to Small Components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4192/68A GB1188451A (en) 1968-01-26 1968-01-26 Improvements relating to methods of making Connections to Small Components

Publications (1)

Publication Number Publication Date
GB1188451A true GB1188451A (en) 1970-04-15

Family

ID=9772450

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4192/68A Expired GB1188451A (en) 1968-01-26 1968-01-26 Improvements relating to methods of making Connections to Small Components

Country Status (1)

Country Link
GB (1) GB1188451A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2124489A1 (en) * 1971-02-05 1972-09-22 Philips Nv
FR2219406A1 (en) * 1973-02-22 1974-09-20 Rca Corp
EP0086724A2 (en) * 1982-02-16 1983-08-24 FAIRCHILD CAMERA &amp; INSTRUMENT CORPORATION Integrated circuit lead frame with improved power dissipation
US4815595A (en) * 1986-12-03 1989-03-28 Sgs-Thomson Microelectronics, Inc. Uniform leadframe carrier
US5111935A (en) * 1986-12-03 1992-05-12 Sgs-Thomson Microelectronics, Inc. Universal leadframe carrier

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2124489A1 (en) * 1971-02-05 1972-09-22 Philips Nv
FR2219406A1 (en) * 1973-02-22 1974-09-20 Rca Corp
EP0086724A2 (en) * 1982-02-16 1983-08-24 FAIRCHILD CAMERA &amp; INSTRUMENT CORPORATION Integrated circuit lead frame with improved power dissipation
EP0086724A3 (en) * 1982-02-16 1985-04-24 FAIRCHILD CAMERA &amp; INSTRUMENT CORPORATION Integrated circuit lead frame with improved power dissipation
US4815595A (en) * 1986-12-03 1989-03-28 Sgs-Thomson Microelectronics, Inc. Uniform leadframe carrier
US5111935A (en) * 1986-12-03 1992-05-12 Sgs-Thomson Microelectronics, Inc. Universal leadframe carrier

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PLNP Patent lapsed through nonpayment of renewal fees