GB971775A - Electrical terminal board - Google Patents

Electrical terminal board

Info

Publication number
GB971775A
GB971775A GB2587461A GB2587461A GB971775A GB 971775 A GB971775 A GB 971775A GB 2587461 A GB2587461 A GB 2587461A GB 2587461 A GB2587461 A GB 2587461A GB 971775 A GB971775 A GB 971775A
Authority
GB
United Kingdom
Prior art keywords
rims
terminals
insulating material
solidified
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2587461A
Inventor
Temple Nieter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borg Warner Corp
Original Assignee
Borg Warner Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borg Warner Corp filed Critical Borg Warner Corp
Priority to GB2587461A priority Critical patent/GB971775A/en
Publication of GB971775A publication Critical patent/GB971775A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0152Temporary metallic carrier, e.g. for transferring material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025Abrading, e.g. grinding or sand blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

971,775. Printed circuits. BORG-WARNER CORPORATION. July 17, 1961, No. 25874/61. Heading H1R. An electric wiring board is made by forming on metal sheets 12 (Fig. 2) and 38 (Fig. 3) terminals such as 13, 14, 16 and 40, 41, 42, leads 15, 18, 23 and 53, 55, and rims 22 and 54 of similar configuration; the rims and terminals of the wiring assemblies thus formed are welded or soldered together; a hardenable liquid insulating material is poured into the cavity between the sheets 12, 38, through an opening formed by the juxtaposition of complementary rebates 37, 56 in rims 22, 54, and solidified; finally the metal sheets 12, 38 are removed, as by cutting or grinding, to produce a wiring board as shown in Fig. 1, in which 65 is the solidified insulating material. The terminals and the rims are recessed so that, in the finished state, openings are provided therethrough.
GB2587461A 1961-07-17 1961-07-17 Electrical terminal board Expired GB971775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2587461A GB971775A (en) 1961-07-17 1961-07-17 Electrical terminal board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2587461A GB971775A (en) 1961-07-17 1961-07-17 Electrical terminal board

Publications (1)

Publication Number Publication Date
GB971775A true GB971775A (en) 1964-10-07

Family

ID=10234779

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2587461A Expired GB971775A (en) 1961-07-17 1961-07-17 Electrical terminal board

Country Status (1)

Country Link
GB (1) GB971775A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0857010A1 (en) * 1997-01-31 1998-08-05 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Manufacturing process for printed circuits
EP0923278A1 (en) * 1997-12-05 1999-06-16 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Manufacturing process for printed circuits
US6182359B1 (en) 1997-01-31 2001-02-06 Lear Automotive Dearborn, Inc. Manufacturing process for printed circuits

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0857010A1 (en) * 1997-01-31 1998-08-05 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Manufacturing process for printed circuits
WO1998034444A1 (en) * 1997-01-31 1998-08-06 Ut Automotive Dearborn, Inc. A manufacturing process for printed circuits
US6182359B1 (en) 1997-01-31 2001-02-06 Lear Automotive Dearborn, Inc. Manufacturing process for printed circuits
EP0923278A1 (en) * 1997-12-05 1999-06-16 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Manufacturing process for printed circuits

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