GB1059211A - Improvements in methods of manufacturing electrical circuits - Google Patents
Improvements in methods of manufacturing electrical circuitsInfo
- Publication number
- GB1059211A GB1059211A GB3207163A GB3207163A GB1059211A GB 1059211 A GB1059211 A GB 1059211A GB 3207163 A GB3207163 A GB 3207163A GB 3207163 A GB3207163 A GB 3207163A GB 1059211 A GB1059211 A GB 1059211A
- Authority
- GB
- United Kingdom
- Prior art keywords
- methods
- electrical circuits
- manufacturing electrical
- terminals
- magnetic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
1,059,211. Terminals. GLOBE-UNION Inc. Aug. 14, 1963, No. 32071/63. Heading H2E. [Also in Divisions B3 and H1] An electrical component for use in the automatic manufacture of an electrical circuit has at least one of its terminals made of a magnetic material, e.g. copper clad steel and the other terminal or terminals made of non-magnetic material. The components specified are a transistor, a capacitor and a circuit nodule.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3207163A GB1059211A (en) | 1963-08-14 | 1963-08-14 | Improvements in methods of manufacturing electrical circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3207163A GB1059211A (en) | 1963-08-14 | 1963-08-14 | Improvements in methods of manufacturing electrical circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1059211A true GB1059211A (en) | 1967-02-15 |
Family
ID=10332741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3207163A Expired GB1059211A (en) | 1963-08-14 | 1963-08-14 | Improvements in methods of manufacturing electrical circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1059211A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3855505A (en) * | 1972-04-03 | 1974-12-17 | Nat Components Ind Inc | Solid electrolyte capacitor |
DE102009006871A1 (en) * | 2009-01-30 | 2010-08-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Component carrier for use with positioning aid for supporting placement of component of system in target area on surface of component carrier, has pole shoe which is arranged in or on component carrier at distance from surface |
-
1963
- 1963-08-14 GB GB3207163A patent/GB1059211A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3855505A (en) * | 1972-04-03 | 1974-12-17 | Nat Components Ind Inc | Solid electrolyte capacitor |
DE102009006871A1 (en) * | 2009-01-30 | 2010-08-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Component carrier for use with positioning aid for supporting placement of component of system in target area on surface of component carrier, has pole shoe which is arranged in or on component carrier at distance from surface |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB696185A (en) | Improvements in the construction of electric circuit components | |
GB1276526A (en) | Method of making a metal core printed circuit board | |
GB1087862A (en) | Improvements in or relating to electrical contacts | |
ES327935A1 (en) | A bobina de nucleo toroidal impresa. (Machine-translation by Google Translate, not legally binding) | |
GB1059211A (en) | Improvements in methods of manufacturing electrical circuits | |
GB1490827A (en) | Contact spring for an electrical socket connector | |
GB1236498A (en) | Improvements in or relating to adjustable inductors | |
JPS5255412A (en) | Line collection equipment | |
GB1035592A (en) | An improved printed circuit panel and a method of making same | |
ES281648A1 (en) | Method for making a printed circuit structure (Machine-translation by Google Translate, not legally binding) | |
GB971775A (en) | Electrical terminal board | |
GB757967A (en) | Improvements in or relating to electric tag blocks and a method of manufacturing thesame | |
GB1311236A (en) | Support for an electrical component | |
JPS52144253A (en) | Flip-flop circuit | |
GB1030677A (en) | Electrical assembly | |
GB778287A (en) | Improvements in or relating to electrical clamping screws | |
JPS51111015A (en) | Magnetic core memory equipment | |
GB759322A (en) | Improvements in or relating to electrical components to be connected to printed circuits | |
GB1163344A (en) | Improvements in or relating to Electrical Terminal Blocks | |
GB774979A (en) | Improvements in or relating to methods of forming electrical terminals on a terminalboard or strip | |
GB1021320A (en) | Microminiature electrical connection | |
Butt | Choice of New Copper Alloys for Use in Miniaturization of Electrical and Electronic Terminals and Connectors, Paper Presented at the 1971 Western Metal and Tool Conference and Exposition, Los Angeles, CA | |
ES91330U (en) | Electronic coil perfected (Machine-translation by Google Translate, not legally binding) | |
DELFS | The thin-film hybrid circuit has prospects(Thin film and thick metal film technology comparison and production cost analysis, emphasizing thin film resistors application in hybrid circuits) | |
ES209826A2 (en) | A magnetºmetro device (Machine-translation by Google Translate, not legally binding) |