DE1564708A1 - Method for contacting electrical components, in particular diode, transistor systems and integrated systems - Google Patents

Description

7 "

Siemens Aktiengesellschaft Munich 2, ² r ^ ^{9 MAJ &}

Wittelsbacherplatz

PA 66/2856

Method for contacting electrical components, especially diode, transistor systems and integrated systems!

The invention relates to a method of contacting of electrical components in series construction, in particular of micro-semiconductor components.

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The object of the invention is to provide an efficient method which enables cc to produce a large number of components, in particular from llikro components, such as Hikre ^ txi Planar transistors and diodes to contact. The application of the Bar.dmontageprinzips prepares, however, due to the low mechanical stability of such components is considerable Trouble. This was the case with the previously known methods not possible without special aids, such as Hordes, expensive brackets or prefabricated housings for the contact of the outer electrodes. Also emerged when using the mostly between the system arrangements and electrical leads required contacting wires due to the often difficult fixation instabilities that lead to Fluctuations in the physical properties of the finished components resulted in their application being considerable Caused disturbances.

It should now be within the scope of the present invention Specify a method that makes it possible to do without contacting wires and without special aids such as shelves or holders. Han does it like this that as a contacting material an al3 conveyor belt during Individual work processes suitable carrier body is used, which is adapted to the component to be produced The grid is provided with incisions in such a way that the outer electrodes of the component to be manufactured are connected in ventilated geometric arrangement results, co that through

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Deform at least one of the initially lying in one plane

Electrodes between the one or those in the starting position Electrodes and the deformed electrode or electrodes, a mechanical bias is created that then between the biased electrodes, the component order provided for contacting is inserted in an oriented manner and then the electrodes made of contacting material connected to the component to be contacted.

It is also within the scope of the invention, at the same time more than to contact two electrodes with the component design.

In a further development of the concept of the invention it is provided that the electrode assembly by soldering especially in a protective gas atmosphere. It However, a thermal configuration process can also be used. With a particularly favorable execution of the process becomes one with a silver-tin alloy Copper tape used as a contacting material. It is expedient to first apply about 10 / un to the copper strip thick silver layer and then about 5 / UU thick layer of tin to be deposited electrolytically. The silver-tin layer but can also be vapor-deposited or rolled on. ·

The method according to the invention is suitable for contacting of all semiconductor components that are made according to the alloy and Diffusion technology are made. However, it can also be used to advantage in the assembly of planar transistors

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and diodes and integrated circuits, where the number the electrodes to be deformed can be selected as desired.

Another possible application arises from contacting of multi-pole electrical components, e.g. of capacitors and resistors.

In the following, the invention is intended to be based on two exemplary embodiments, from which further details and advantages of the method emerge, are explained in more detail.

In Fig. 1 and 2, the contacting and completion is a Diode shown. 3 shows the process steps on which the invention is based, using a transistor as an example.

A copper strip 1 provided with a silver-tin alloy, as in Piß. 1 in section A) is used. Since this band is also used as conveyor belt Vorwondung while still following operations, there is provided in the region of its upper edge with circular Ausstenzungcn 2, as a receptacle for Automated, beicpielctveicc at Ätzprozeooon, injection molding ö & 9 * i elektriechen UcoDungen serve. The ait 5 bezel / des Sandte t is after the erfiöduii ^ cgeaäßcn Te ^

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the direction indicated by the arrow 5 so deformed, ie bent so far upwards, until the area 3 comes to rest on the area 6 of the metal bandeo with a certain mechanical prestress, which is indicated by the dashed line 7 i ⁿ i * ig · 1 im Section A) shows coil. As shown in section B) of FIG , rests against the two tongues .. Then the metal contacts 3 and 6 with the component 8 bsv /. 9 connected by a short luting process in a protective gas atmosphere. «■

As shown in Fig. 2, after wrapping the Contacted component arrangement by an injection molding process or transfer molding process using a low-melting, at the operating temperature of the component to be produced solid potting compound 14, for example epoxy resin, with 1o, 11 and 12, to stabilize the metal band existing webs punched out. By separating dec with the area of the metal band 1 provided with the punched-out 2 on the dash-dotted line 13 can then be completed in this way Diode, for example, can be used directly for installation in circuits.

FIG. 3 shows in an analogous way the structure of a transistor according to the method according to the invention

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denotes additional electrode required for a translator, which is soldered to the Kontaktfleckcn 2o. Ano-soldering The same terms apply as in Piß. 1. The potting of the semiconductor component and da3 removal of the webs and the rest of the metal band provided with the punched holes takes place analogously to the description in Pig. 2.

It goes without saying that the method described is based on any number of embodiments of the contacting material existing conveyor belt is applicable. The to be deformed Metal tongues can go upwards, backwards and backwards can be folded over to the side.

9 claims 3 Piguren

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Claims (1)

PA 9/493/016 - 7 - c_h e 1, method for contacting electrical components in series construction, especially from llikrohalbleiterbaueler.cntcn, characterized in that as Kontakticrungsraaterial an alo conveyor belt during individual work processes suitable carrier body is used, which nit with a router closely matched to the component to be distributed Incisions is provided so that the number of outer electrodes of the component to be manufactured in particular geometric arrangement results, so that by deforming at least one of the first in a plane lying electrodes between the or those in the starting position located electrodes and the or the preformed electrode a mechanical bias is created that then between the pre-tensioned electrodes for the contacting intended Bauclencntccnordnung inserted in an oriented manner and then made of contacting material existing electrodes are connected to the component to be contacted. 2 »Propagation according to claim 1, characterized in that at the same time more aXs two electrodes with the component 909887/0810 PA 9/493/016 - 8 - 3. The method according to claim 1 and 2, characterized in that that the component assemblies by conduction with the electrodes, especially in a protective gas atmosphere. 4. The method according to claim 1-3, characterized in that the connection by a Theraokorapressionsverfahren he follows. 5. The method according to claim 1-4, characterized in that a contacting material with a silver-tin alloy provided copper tape is locked / ended. 6. The method according to claim 5, characterized in that on First of all, apply a 10 / un thick layer of silver to the copper band and then a layer of tin about 5 μm thick is electrolytically applied. 7. The method according to claim 5 and 6, characterized in that the silver-tin layer is vapor-deposited or rolled on will. 0 »using the method according to claims 1-7 EUR listening '* ■ position of Halbleiterbauelenentcn that glerunge- after the LE and / or diffusion technic eind manufactured, as well as for the production of planar transistors and" diodes and integrated circuits. 909887/0810 - " PA 9/493/016 - 9 - ■ 9. Multipole electrical components such as Capacitors and resistors produced by a method according to claims 1-7. _-:: BAD Ö09887 / 081Q ι ^ ⁰ ·. Empty page