GB1209901A - Improvements relating to the mounting of integrated circuit assemblies - Google Patents
Improvements relating to the mounting of integrated circuit assembliesInfo
- Publication number
- GB1209901A GB1209901A GB0639/67A GB163967A GB1209901A GB 1209901 A GB1209901 A GB 1209901A GB 0639/67 A GB0639/67 A GB 0639/67A GB 163967 A GB163967 A GB 163967A GB 1209901 A GB1209901 A GB 1209901A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductors
- integrated circuit
- mounting
- improvements relating
- circuit assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
1,209,901. Mounting semiconductor devices. PLESSEY TELECOMMUNICATION RESEARCH Ltd. 8 Jan., 1968 [11 Jan., 1967], No. 1639/67. Headings H1K and H1R. An integrated circuit chip 1 is mounted on an insulating support 2 carrying a plurality of conductors 3 which extend over an aperture 6 in the support 2 to leave terminal ends 7 free for direct connection to the circuit chip 1. The conductors 3 are formed by etching metal foil on the insulating support. Apertures 8, 9 allow the conductors 3 to be bonded to printed wires of a printed circuit board (not shown). The chip 1, terminal ends 7 and conductors 3 may be encapsulated as shown by the chain outline.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0639/67A GB1209901A (en) | 1967-01-11 | 1967-01-11 | Improvements relating to the mounting of integrated circuit assemblies |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0639/67A GB1209901A (en) | 1967-01-11 | 1967-01-11 | Improvements relating to the mounting of integrated circuit assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1209901A true GB1209901A (en) | 1970-10-21 |
Family
ID=9725432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0639/67A Expired GB1209901A (en) | 1967-01-11 | 1967-01-11 | Improvements relating to the mounting of integrated circuit assemblies |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1209901A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2080918A1 (en) * | 1970-01-21 | 1971-11-26 | Siemens Ag | |
US3942245A (en) * | 1971-11-20 | 1976-03-09 | Ferranti Limited | Related to the manufacture of lead frames and the mounting of semiconductor devices thereon |
FR2317852A1 (en) * | 1975-07-07 | 1977-02-04 | Nat Semiconductor Corp | INTERCONNECTION TAPE FOR CONNECTING AN ASSEMBLY OF SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SUCH TAPE |
FR2438339A1 (en) * | 1978-10-05 | 1980-04-30 | Suisse Horlogerie | Electrical connection to integrated circuit - by placing integrated circuit in housing punched in thickness of substrate supporting printed conductors |
GB2124433A (en) * | 1982-07-07 | 1984-02-15 | Int Standard Electric Corp | Electronic component assembly |
US4472876A (en) * | 1981-08-13 | 1984-09-25 | Minnesota Mining And Manufacturing Company | Area-bonding tape |
US4550248A (en) * | 1981-03-24 | 1985-10-29 | Gao Gesellschaft Fur Automation Und Organisation Gmbh | Identification card having an IC module |
WO1986003591A1 (en) * | 1984-12-10 | 1986-06-19 | Aseco Corporation | Contact set for test apparatus for testing integrated circuit package |
US4867715A (en) * | 1988-05-02 | 1989-09-19 | Delco Electronics Corporation | Interconnection lead with redundant bonding regions |
EP0406373A1 (en) * | 1988-12-07 | 1991-01-09 | Tribotech | Tape automated bonded lead package and reusable transport tape for use therewith |
US5390079A (en) * | 1991-09-10 | 1995-02-14 | Hitachi, Ltd. | Tape carrier package |
-
1967
- 1967-01-11 GB GB0639/67A patent/GB1209901A/en not_active Expired
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2080918A1 (en) * | 1970-01-21 | 1971-11-26 | Siemens Ag | |
US3942245A (en) * | 1971-11-20 | 1976-03-09 | Ferranti Limited | Related to the manufacture of lead frames and the mounting of semiconductor devices thereon |
FR2317852A1 (en) * | 1975-07-07 | 1977-02-04 | Nat Semiconductor Corp | INTERCONNECTION TAPE FOR CONNECTING AN ASSEMBLY OF SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SUCH TAPE |
FR2438339A1 (en) * | 1978-10-05 | 1980-04-30 | Suisse Horlogerie | Electrical connection to integrated circuit - by placing integrated circuit in housing punched in thickness of substrate supporting printed conductors |
US4550248A (en) * | 1981-03-24 | 1985-10-29 | Gao Gesellschaft Fur Automation Und Organisation Gmbh | Identification card having an IC module |
US4472876A (en) * | 1981-08-13 | 1984-09-25 | Minnesota Mining And Manufacturing Company | Area-bonding tape |
GB2124433A (en) * | 1982-07-07 | 1984-02-15 | Int Standard Electric Corp | Electronic component assembly |
WO1986003591A1 (en) * | 1984-12-10 | 1986-06-19 | Aseco Corporation | Contact set for test apparatus for testing integrated circuit package |
US4686468A (en) * | 1984-12-10 | 1987-08-11 | Aseco Corporation | Contact set for test apparatus for testing integrated circuit package |
US4867715A (en) * | 1988-05-02 | 1989-09-19 | Delco Electronics Corporation | Interconnection lead with redundant bonding regions |
EP0406373A1 (en) * | 1988-12-07 | 1991-01-09 | Tribotech | Tape automated bonded lead package and reusable transport tape for use therewith |
EP0406373A4 (en) * | 1988-12-07 | 1992-04-29 | Tribotech | Tape automated bonded lead package and reusable transport tape for use therewith |
US5390079A (en) * | 1991-09-10 | 1995-02-14 | Hitachi, Ltd. | Tape carrier package |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |