GB1285735A - Integrated semiconductor unit - Google Patents

Integrated semiconductor unit

Info

Publication number
GB1285735A
GB1285735A GB48317/69A GB4831769A GB1285735A GB 1285735 A GB1285735 A GB 1285735A GB 48317/69 A GB48317/69 A GB 48317/69A GB 4831769 A GB4831769 A GB 4831769A GB 1285735 A GB1285735 A GB 1285735A
Authority
GB
United Kingdom
Prior art keywords
leads
housing
oct
integrated semiconductor
semiconductor unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB48317/69A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of GB1285735A publication Critical patent/GB1285735A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

1285735 Integrated circuits TELEFUNKEN PATENTVERWERTUNGS GmbH 1 Oct 1969 [1 Oct 1968] 48317/69 Heading H1K Certain terminal leads 5a, 5b extending from an integrated circuit housing 14 are of larger cross-section than the remaining leads 4 to facilitate heat conduction from devices such as power transistors mounted on the leads 5a, 5b within the housing 14. The leads 5a, 5b may be bent upwards, rather than downwards as shown, to permit connection to a further heat sink. All the leads may be stamped or etched from a common Au-plated Ni sheet, and the housing 14 may contain a plurality of semi-conductor bodies.
GB48317/69A 1968-10-01 1969-10-01 Integrated semiconductor unit Expired GB1285735A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681800213 DE1800213A1 (en) 1968-10-01 1968-10-01 Housing for integrated semiconductor circuits

Publications (1)

Publication Number Publication Date
GB1285735A true GB1285735A (en) 1972-08-16

Family

ID=5709158

Family Applications (1)

Application Number Title Priority Date Filing Date
GB48317/69A Expired GB1285735A (en) 1968-10-01 1969-10-01 Integrated semiconductor unit

Country Status (2)

Country Link
DE (1) DE1800213A1 (en)
GB (1) GB1285735A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2736467A1 (en) * 1995-07-07 1997-01-10 Samsung Aerospace Ind SEMICONDUCTOR DEVICE DISSIPATING HEAT
WO2006024626A2 (en) * 2004-08-31 2006-03-09 Siemens Aktiengesellschaft Electric sub-assembly
WO2008069755A1 (en) * 2006-12-05 2008-06-12 Infineon Technologies Ag Integrated semiconductor outline package

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
DE4031051C2 (en) * 1989-11-14 1997-05-07 Siemens Ag Module with at least one semiconductor switching element and a control circuit
DE4410212A1 (en) * 1994-03-24 1995-09-28 Telefunken Microelectron Electronic module with semiconductor integrated circuit
DE19604614A1 (en) * 1996-02-08 1997-08-14 Bayerische Motoren Werke Ag Encapsulated electronic control device e.g. for motor vehicles
US7169245B2 (en) * 2004-12-13 2007-01-30 3M Innovative Properties Company Methods of using sonication to couple a heat sink to a heat-generating component

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2736467A1 (en) * 1995-07-07 1997-01-10 Samsung Aerospace Ind SEMICONDUCTOR DEVICE DISSIPATING HEAT
GB2303248A (en) * 1995-07-07 1997-02-12 Samsung Aerospace Ind Semiconductor device which dissipates heat
WO2006024626A2 (en) * 2004-08-31 2006-03-09 Siemens Aktiengesellschaft Electric sub-assembly
WO2006024626A3 (en) * 2004-08-31 2007-02-01 Siemens Ag Electric sub-assembly
US8174097B2 (en) 2004-08-31 2012-05-08 Continental Automotive Gmbh Electric sub-assembly
WO2008069755A1 (en) * 2006-12-05 2008-06-12 Infineon Technologies Ag Integrated semiconductor outline package
US8169069B2 (en) 2006-12-05 2012-05-01 Infineon Technologies Ag Integrated semiconductor outline package

Also Published As

Publication number Publication date
DE1800213A1 (en) 1970-05-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees