GB1062928A - Multi-wafer integrated circuits - Google Patents

Multi-wafer integrated circuits

Info

Publication number
GB1062928A
GB1062928A GB37615/64A GB3761564A GB1062928A GB 1062928 A GB1062928 A GB 1062928A GB 37615/64 A GB37615/64 A GB 37615/64A GB 3761564 A GB3761564 A GB 3761564A GB 1062928 A GB1062928 A GB 1062928A
Authority
GB
United Kingdom
Prior art keywords
conductors
wafers
areas
soldered
sept
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37615/64A
Inventor
Geoffrey Arthur Leonard King
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB37615/64A priority Critical patent/GB1062928A/en
Priority to DEJ28815A priority patent/DE1240961B/en
Priority to NL6511689A priority patent/NL6511689A/xx
Priority to CH1273265A priority patent/CH438494A/en
Priority to FR31487A priority patent/FR88644E/en
Priority to BE669627D priority patent/BE669627A/xx
Publication of GB1062928A publication Critical patent/GB1062928A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)

Abstract

1,062,928. Printed circuit assemblies; semiconductor devices. STANDARD TELEPHONES & CABLES Ltd. Sept. 10, 1965 [Sept. 15, 1964], No. 37615/64. Headings H1K and H1R. [Also in Division H2] In an integrated circuit comprising a plurality of wafers (e.g. Si circuit elements) having all their terminals co-planar and connected by soldering to printed conductors on an insulating base, those areas of the conductors which are soldered to the terminals are of greater thickness than the areas of the conductors in the vicinity of the edges of the wafers. This prevents excess solder from rising up the sides of the wafers. The conductors may be formed from a Cu-clad laminate using a " doubleetch " technique; in the first etching step, the Cu cladding is reduced to about half its original thickness except in areas to be soldered; the normal wiring pattern is formed in the second etching step.
GB37615/64A 1964-09-15 1964-09-15 Multi-wafer integrated circuits Expired GB1062928A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB37615/64A GB1062928A (en) 1964-09-15 1964-09-15 Multi-wafer integrated circuits
DEJ28815A DE1240961B (en) 1964-09-15 1965-08-19 Method for attaching semiconductor chips to an insulating substrate and for producing an insulating substrate that can be used therefor
NL6511689A NL6511689A (en) 1964-09-15 1965-09-08
CH1273265A CH438494A (en) 1964-09-15 1965-09-14 Method of assembling semiconductor wafers
FR31487A FR88644E (en) 1964-09-15 1965-09-15 Semiconductor device enhancements
BE669627D BE669627A (en) 1964-09-15 1965-09-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB37615/64A GB1062928A (en) 1964-09-15 1964-09-15 Multi-wafer integrated circuits

Publications (1)

Publication Number Publication Date
GB1062928A true GB1062928A (en) 1967-03-22

Family

ID=10397756

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37615/64A Expired GB1062928A (en) 1964-09-15 1964-09-15 Multi-wafer integrated circuits

Country Status (5)

Country Link
BE (1) BE669627A (en)
CH (1) CH438494A (en)
DE (1) DE1240961B (en)
GB (1) GB1062928A (en)
NL (1) NL6511689A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617216A (en) * 1980-08-07 1986-10-14 Gao Gesellschaft Fur Automation Und Organisation Mbh Multi-layer identification card
GB2289170A (en) * 1994-05-06 1995-11-08 Sony Corp Printed circuit board solder thief

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1591580B1 (en) * 1967-10-11 1971-02-04 Siemens Ag Method for the simultaneous attachment of several electrical connection elements to contact points of thin-film components in communications technology
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617216A (en) * 1980-08-07 1986-10-14 Gao Gesellschaft Fur Automation Und Organisation Mbh Multi-layer identification card
GB2289170A (en) * 1994-05-06 1995-11-08 Sony Corp Printed circuit board solder thief
GB2289170B (en) * 1994-05-06 1998-06-24 Sony Corp Circuit board
CN1080082C (en) * 1994-05-06 2002-02-27 索尼公司 Printed circuit board

Also Published As

Publication number Publication date
BE669627A (en) 1966-03-15
NL6511689A (en) 1966-03-16
DE1240961B (en) 1967-05-24
CH438494A (en) 1967-06-30

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