GB1240789A - Improvements in or relating to electrical equipment - Google Patents

Improvements in or relating to electrical equipment

Info

Publication number
GB1240789A
GB1240789A GB6170769A GB6170769A GB1240789A GB 1240789 A GB1240789 A GB 1240789A GB 6170769 A GB6170769 A GB 6170769A GB 6170769 A GB6170769 A GB 6170769A GB 1240789 A GB1240789 A GB 1240789A
Authority
GB
Grant status
Application
Patent type
Prior art keywords
holes
circuit
circuit units
contacts
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6170769A
Inventor
Geoffrey Roland Pearce
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
STC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • H05K1/184Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09981Metallised walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Abstract

1,240,789. Circuit assemblies. STANDARD TELEPHONES & CABLES Ltd. 18 Dec., 1969, No. 61707/69. Heading H1R. [Also in Division H2] An electrical circuit assembly consists of a printed circuit board 3 with at least one hole in it, and integrated circuit units 2, which are located in the holes. Electrical contacts 4, 5 are located on the edge of the holes, positioned to be aligned with the terminal leads 1, of the circuit units when they are in the holes. The terminal leads of the circuit units are bent so as to form springy contacts, which are mechanically secured to the respective contacts on the edge of the holes, either by soldering or in a plug-socket manner. The printed circuit board may have printed wiring on one or both of its faces. The circuit units may also carry printed wiring on one or more of their outer faces.
GB6170769A 1969-12-18 1969-12-18 Improvements in or relating to electrical equipment Expired GB1240789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB6170769A GB1240789A (en) 1969-12-18 1969-12-18 Improvements in or relating to electrical equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB6170769A GB1240789A (en) 1969-12-18 1969-12-18 Improvements in or relating to electrical equipment

Publications (1)

Publication Number Publication Date
GB1240789A true true GB1240789A (en) 1971-07-28

Family

ID=10487352

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6170769A Expired GB1240789A (en) 1969-12-18 1969-12-18 Improvements in or relating to electrical equipment

Country Status (1)

Country Link
GB (1) GB1240789A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054938A (en) * 1974-05-13 1977-10-18 American Microsystems, Inc. Combined semiconductor device and printed circuit board assembly
US4403818A (en) * 1980-06-26 1983-09-13 General Motors Corporation Instrument panel for vehicles
EP0210560A2 (en) * 1985-07-27 1987-02-04 GRUNDIG E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig holländ. Stiftung & Co. KG. Process of soldering an integrated circuit in a circuit board
GB2204184A (en) * 1987-04-29 1988-11-02 Stanley Bracey Mounting electronic components on substrates
EP0297236A2 (en) * 1987-06-25 1989-01-04 WABCO Vermögensverwaltungs-GmbH Printed circuit board
GB2208333A (en) * 1987-07-24 1989-03-22 Plessey Co Plc Interconnecting printed circuit boards
DE3914055A1 (en) * 1989-04-28 1990-10-31 Thomson Brandt Gmbh Semiconductor component with silicon disc - has circuit on either side of disc i.e. EPROM RAM etc.
US4994938A (en) * 1988-12-28 1991-02-19 Texas Instruments Incorporated Mounting of high density components on substrate
GB2240431A (en) * 1989-12-22 1991-07-31 Motorola Inc Surface-mount dielectric filter.
US5200884A (en) * 1989-02-15 1993-04-06 Nihon Kaiheiki Kogyo Kabushiki Kaisha Electrical control device
EP0481177B1 (en) * 1990-10-15 1996-01-10 GRUNDIG E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig GmbH & Co. KG Printed circuit board with soldered integrated circuit
US5712764A (en) * 1996-05-03 1998-01-27 Ford Motor Company Apparatus and method of assembling vehicle instrument panel structural and electronic components
US5994648A (en) * 1997-03-27 1999-11-30 Ford Motor Company Three-dimensional molded sockets for mechanical and electrical component attachment

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054938A (en) * 1974-05-13 1977-10-18 American Microsystems, Inc. Combined semiconductor device and printed circuit board assembly
US4403818A (en) * 1980-06-26 1983-09-13 General Motors Corporation Instrument panel for vehicles
EP0210560A2 (en) * 1985-07-27 1987-02-04 GRUNDIG E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig holländ. Stiftung & Co. KG. Process of soldering an integrated circuit in a circuit board
EP0210560A3 (en) * 1985-07-27 1987-05-27 GRUNDIG E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig holländ. Stiftung & Co. KG. Process of soldering an integrated circuit in a circuit board
GB2204184A (en) * 1987-04-29 1988-11-02 Stanley Bracey Mounting electronic components on substrates
DE3720925A1 (en) * 1987-06-25 1989-01-05 Wabco Westinghouse Fahrzeug circuit board
EP0297236A2 (en) * 1987-06-25 1989-01-04 WABCO Vermögensverwaltungs-GmbH Printed circuit board
EP0297236A3 (en) * 1987-06-25 1990-08-22 WABCO Vermögensverwaltungs-GmbH Printed circuit board
GB2208333A (en) * 1987-07-24 1989-03-22 Plessey Co Plc Interconnecting printed circuit boards
GB2208333B (en) * 1987-07-24 1991-03-13 Plessey Co Plc A method of connection and a module for use therein
US4994938A (en) * 1988-12-28 1991-02-19 Texas Instruments Incorporated Mounting of high density components on substrate
US5200884A (en) * 1989-02-15 1993-04-06 Nihon Kaiheiki Kogyo Kabushiki Kaisha Electrical control device
DE3914055A1 (en) * 1989-04-28 1990-10-31 Thomson Brandt Gmbh Semiconductor component with silicon disc - has circuit on either side of disc i.e. EPROM RAM etc.
GB2240431A (en) * 1989-12-22 1991-07-31 Motorola Inc Surface-mount dielectric filter.
GB2240431B (en) * 1989-12-22 1994-06-15 Motorola Inc Surface-mount filter
EP0481177B1 (en) * 1990-10-15 1996-01-10 GRUNDIG E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig GmbH & Co. KG Printed circuit board with soldered integrated circuit
US5712764A (en) * 1996-05-03 1998-01-27 Ford Motor Company Apparatus and method of assembling vehicle instrument panel structural and electronic components
US5994648A (en) * 1997-03-27 1999-11-30 Ford Motor Company Three-dimensional molded sockets for mechanical and electrical component attachment

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