GB1374666A - Assembly comprising a micro electronic package a bus strip and a printed circuit base - Google Patents

Assembly comprising a micro electronic package a bus strip and a printed circuit base

Info

Publication number
GB1374666A
GB1374666A GB2580272A GB2580272A GB1374666A GB 1374666 A GB1374666 A GB 1374666A GB 2580272 A GB2580272 A GB 2580272A GB 2580272 A GB2580272 A GB 2580272A GB 1374666 A GB1374666 A GB 1374666A
Authority
GB
United Kingdom
Prior art keywords
printed circuit
assembly
board
packages
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2580272A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Logic Dynamics Inc
Original Assignee
Logic Dynamics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Logic Dynamics Inc filed Critical Logic Dynamics Inc
Priority to GB2580272A priority Critical patent/GB1374666A/en
Publication of GB1374666A publication Critical patent/GB1374666A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7076Coupling devices for connection between PCB and component, e.g. display
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10272Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Abstract

1374666 Component assemblies LOGIC DYNAMICS Inc 2 June 1972 25802/72 Heading H1R A printed circuit board 31 carries DIL packages 23. Power is supplied by bus strips 40 which are positioned underneath the packages 23 to save board area. Leads from the packages 23 and from the bus strips 40 are connected to the same terminals. Each bus strip 40 may comprise an earth conductor and one or two power conductors, or, as shown, a power conductor 52 screened by a pair of earth conductors 49. The terminals may be holes 35 or pads (36, Fig. 8, not shown) on the surface of the board 31. The conductors may be of phosphor-bronze. The board 31 carries printed wiring 33 and edge contacts 32 on both sides.
GB2580272A 1972-06-02 1972-06-02 Assembly comprising a micro electronic package a bus strip and a printed circuit base Expired GB1374666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2580272A GB1374666A (en) 1972-06-02 1972-06-02 Assembly comprising a micro electronic package a bus strip and a printed circuit base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2580272A GB1374666A (en) 1972-06-02 1972-06-02 Assembly comprising a micro electronic package a bus strip and a printed circuit base

Publications (1)

Publication Number Publication Date
GB1374666A true GB1374666A (en) 1974-11-20

Family

ID=10233553

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2580272A Expired GB1374666A (en) 1972-06-02 1972-06-02 Assembly comprising a micro electronic package a bus strip and a printed circuit base

Country Status (1)

Country Link
GB (1) GB1374666A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603927A (en) * 1984-07-12 1986-08-05 Rogers Corporation Surface mounted bussing device
EP0239494A1 (en) * 1986-03-28 1987-09-30 Bull S.A. Integrated circuit housing
US5053920A (en) * 1989-06-09 1991-10-01 Digital Equipment Corporation Integrated power conversion
US5276587A (en) * 1991-04-30 1994-01-04 Sundstrand Corporation Pivotable electrical connection apparatus
EP0583407A1 (en) * 1991-05-08 1994-02-23 General DataComm, Inc. Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603927A (en) * 1984-07-12 1986-08-05 Rogers Corporation Surface mounted bussing device
EP0239494A1 (en) * 1986-03-28 1987-09-30 Bull S.A. Integrated circuit housing
FR2596607A1 (en) * 1986-03-28 1987-10-02 Bull Sa METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A CIRCUIT BOARD, INTEGRATED CIRCUIT BOX AND INTEGRATED CIRCUIT BOARD FOR IMPLEMENTING THE METHOD
US4812949A (en) * 1986-03-28 1989-03-14 Bull, S.A. Method of and apparatus for mounting an IC chip
US5053920A (en) * 1989-06-09 1991-10-01 Digital Equipment Corporation Integrated power conversion
US5276587A (en) * 1991-04-30 1994-01-04 Sundstrand Corporation Pivotable electrical connection apparatus
EP0583407A1 (en) * 1991-05-08 1994-02-23 General DataComm, Inc. Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
EP0583407A4 (en) * 1991-05-08 1995-10-25 Gen Datacomm Ind Inc Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees