GB1142627A - Improvements relating to printed circuit boards - Google Patents

Improvements relating to printed circuit boards

Info

Publication number
GB1142627A
GB1142627A GB2394766A GB2394766A GB1142627A GB 1142627 A GB1142627 A GB 1142627A GB 2394766 A GB2394766 A GB 2394766A GB 2394766 A GB2394766 A GB 2394766A GB 1142627 A GB1142627 A GB 1142627A
Authority
GB
United Kingdom
Prior art keywords
board
rupture
lines
printed
perforations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2394766A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1142627A publication Critical patent/GB1142627A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0293Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/0909Preformed cutting or breaking line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827Tapered, e.g. tapered hole, via or groove
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/162Testing a finished product, e.g. heat cycle testing of solder joints
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections

Abstract

1,142,627. Printed circuits. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 27 May, 1966 [1 June, 1965], No. 23947/66. Heading H1R. In a printed circuit board 1 provided with lines of local weakness, such as perforations 7, to facilitate the division of the board into separate parts 3 ... 6, the printed circuitry on the separate parts is connected together by thin printed wires 8 which cross the rupture lines to form a functionally unitary arrangement, and enlarged, preferably circular, contact areas 9 are provided at each end of each wire 8 on either side of a rupture line. Associated components (not shown) are mounted on the board 1 and the entire circuit is tested before the board is divided. After division, and before or after the mounting of the parts 3 ... 6 in an assembly, connections broken by the severing of wires 8 are restored by bonding conductors between the relevant contact areas 9, which may be apertured. The board 1 is formed by conventional techniques from a metal-clad paper-based insulating laminate and may be double-sided. Instead of lines of perforations, the rupture lines may be delineated by grooves in the boards; and the wires 8 may be weakened at the line or rupture, by scratching or nicking. Figs. 3, 4 (not shown) depict a printed circuit board in which a portion (16) to be removed is defined by a slot (13) and a single line of perforations (7); after division, the two parts (16, 17) of the board are mounted perpendicular to one another on a radio chassis, and are mutually connected by fly leads (12).
GB2394766A 1965-06-01 1966-05-27 Improvements relating to printed circuit boards Expired GB1142627A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT497065A AT256275B (en) 1965-06-01 1965-06-01 Circuit board which can be divided into at least two circuit board parts along a break line or break lines defined by a perforation, notches or the like

Publications (1)

Publication Number Publication Date
GB1142627A true GB1142627A (en) 1969-02-12

Family

ID=3570469

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2394766A Expired GB1142627A (en) 1965-06-01 1966-05-27 Improvements relating to printed circuit boards

Country Status (3)

Country Link
AT (1) AT256275B (en)
DE (1) DE1665214A1 (en)
GB (1) GB1142627A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2468278A1 (en) * 1979-10-23 1981-04-30 Tektronix Inc METHOD AND APPARATUS FOR CONNECTING CONDUCTIVE ELEMENTS BETWEEN A MAIN CIRCUIT PANEL AND ADJACENT CIRCUIT PANELS
CN102680882A (en) * 2011-03-18 2012-09-19 株式会社理光 Circuit board, image forming apparatus, and method of managing reuse information of circuit board

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2657212C3 (en) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Process for the production of rigid and flexible areas having printed circuit boards
DE3631963A1 (en) * 1986-09-19 1988-03-31 Siemens Ag Method for producing a printed circuit board assembly
FR2626999B1 (en) * 1988-02-05 1993-08-27 Jaeger DEVICE INCLUDING A TRANSMISSION PASSIVE DISPLAY ELEMENT IN PARTICULAR FOR AN ELECTRONIC WATCH OF A MOTOR VEHICLE
DE19834641C2 (en) * 1998-07-31 2001-12-20 Cherry Gmbh Circuit carrier with control parts communicating via bus lines and method for assembling such a circuit carrier
DE19936013B4 (en) * 1999-08-04 2007-06-06 Sew-Eurodrive Gmbh & Co. Kg Method for the simultaneous production of printed circuit boards and parts from a common carrier substrate, printed circuit board with fasteners and their use
DE102006003348A1 (en) * 2006-01-23 2007-07-26 Robert Bosch Gmbh Method for representing separation forces
DE102010052127A1 (en) * 2010-11-22 2012-05-24 Giesecke & Devrient Gmbh Card-shaped data carrier e.g. digital memory card used in telecommunication terminal of telecommunication system, has auxiliary antenna that is connected to main portion and integrated switching circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2468278A1 (en) * 1979-10-23 1981-04-30 Tektronix Inc METHOD AND APPARATUS FOR CONNECTING CONDUCTIVE ELEMENTS BETWEEN A MAIN CIRCUIT PANEL AND ADJACENT CIRCUIT PANELS
CN102680882A (en) * 2011-03-18 2012-09-19 株式会社理光 Circuit board, image forming apparatus, and method of managing reuse information of circuit board

Also Published As

Publication number Publication date
DE1665214A1 (en) 1971-01-07
AT256275B (en) 1967-08-10

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