JPS5587462A - Integrated circuit package - Google Patents

Integrated circuit package

Info

Publication number
JPS5587462A
JPS5587462A JP16401878A JP16401878A JPS5587462A JP S5587462 A JPS5587462 A JP S5587462A JP 16401878 A JP16401878 A JP 16401878A JP 16401878 A JP16401878 A JP 16401878A JP S5587462 A JPS5587462 A JP S5587462A
Authority
JP
Japan
Prior art keywords
terminal
earth
ceramic
terminals
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16401878A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16401878A priority Critical patent/JPS5587462A/en
Publication of JPS5587462A publication Critical patent/JPS5587462A/en
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To reduce cross-talk caused by interference between conductive pattern and lead terminal by forming earth lead terminal connected to back earth conductive plate and allowing the said terminal to exist between lead terminals connected to signal line.
CONSTITUTION: Earth conductive plate 11 and ceramic substrate with square hole 12 are adhered on the rear side of integrated circuit package 10. Conductive patterns 13aW13d are established on substrate 12 and lead terminals 14aW14d are brazed to each of them. All parts other than the ceramic are plated with Au. Conductive pattern 13a is also formed on the external surface of the ceramic and the internal surface of square hole, and connected to earth conductive plate 11. Other conductive patterns are formed only on ceramic substrate, connecting terminals 14b, 14c to signal lines. Terminal 14a diminishes mutual interference between terminals 14b and 14c. In addition, if the terminal 14a is connected to earthing line 15, it will exist between microstrip lines 16, 17 of the signal line, so that it will contribute to cross- talk reduction.
COPYRIGHT: (C)1980,JPO&Japio
JP16401878A 1978-12-25 1978-12-25 Integrated circuit package Pending JPS5587462A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16401878A JPS5587462A (en) 1978-12-25 1978-12-25 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16401878A JPS5587462A (en) 1978-12-25 1978-12-25 Integrated circuit package

Publications (1)

Publication Number Publication Date
JPS5587462A true JPS5587462A (en) 1980-07-02

Family

ID=15785213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16401878A Pending JPS5587462A (en) 1978-12-25 1978-12-25 Integrated circuit package

Country Status (1)

Country Link
JP (1) JPS5587462A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154861A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Package
JPS58170843U (en) * 1982-05-10 1983-11-15 株式会社日立製作所 Packages for integrated circuits
US4514749A (en) * 1983-01-18 1985-04-30 At&T Bell Laboratories VLSI Chip with ground shielding
JPS6063947U (en) * 1983-10-08 1985-05-07 沖電気工業株式会社 Semiconductor integrated circuit container
JPS61182247A (en) * 1985-02-08 1986-08-14 Nippon Telegr & Teleph Corp <Ntt> Ic package
JPS61234055A (en) * 1985-04-10 1986-10-18 Fujitsu Ltd Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025176A (en) * 1973-05-19 1975-03-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025176A (en) * 1973-05-19 1975-03-17

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154861A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Package
JPS58170843U (en) * 1982-05-10 1983-11-15 株式会社日立製作所 Packages for integrated circuits
US4514749A (en) * 1983-01-18 1985-04-30 At&T Bell Laboratories VLSI Chip with ground shielding
JPS6063947U (en) * 1983-10-08 1985-05-07 沖電気工業株式会社 Semiconductor integrated circuit container
JPS61182247A (en) * 1985-02-08 1986-08-14 Nippon Telegr & Teleph Corp <Ntt> Ic package
JPS61234055A (en) * 1985-04-10 1986-10-18 Fujitsu Ltd Semiconductor device

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