JPS6484740A - Electronic circuit package - Google Patents

Electronic circuit package

Info

Publication number
JPS6484740A
JPS6484740A JP24325287A JP24325287A JPS6484740A JP S6484740 A JPS6484740 A JP S6484740A JP 24325287 A JP24325287 A JP 24325287A JP 24325287 A JP24325287 A JP 24325287A JP S6484740 A JPS6484740 A JP S6484740A
Authority
JP
Japan
Prior art keywords
socket
pin
circuit package
electron circuit
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24325287A
Other languages
Japanese (ja)
Other versions
JP2517315B2 (en
Inventor
Koji Kawashima
Shinji Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62243252A priority Critical patent/JP2517315B2/en
Publication of JPS6484740A publication Critical patent/JPS6484740A/en
Application granted granted Critical
Publication of JP2517315B2 publication Critical patent/JP2517315B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To obtain a compact electron circuit package having an exceedingly large mounting area as well as a high mounting density of components where the property of processing is excellent and its maintenance is easy, by extending the conductor pin of an IC socket which is connected to the electron circuit package and combining the above pin with the IC socket which is connected to the other package. CONSTITUTION:A conductor pin 15 of an IC socket 16 which is connected to an electron circuit package 10 is extended and is combined to the IC socket 16 which is connected to the other electron circuit package. For example, a through hole 20 which is passed by the IC socket 16 (pin extension IC socket) extending the conductor pin 15 is provided and the pin extension IC socket 16 is connected electrically to a substrate 11 with a solder land 19 and simultaneously it is fixed. The pin extension socket 16 is composed of a contact part 14 and a connecting pin part 15 and similarly, a plurality of electron circuit packages 10 are formed and after equipping each substrate 11 with electronic component 21, one electron circuit package is formed by connecting the electronic component with the contact part 14 of the pin extension socket 16.
JP62243252A 1987-09-28 1987-09-28 Electronic circuit package Expired - Lifetime JP2517315B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62243252A JP2517315B2 (en) 1987-09-28 1987-09-28 Electronic circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62243252A JP2517315B2 (en) 1987-09-28 1987-09-28 Electronic circuit package

Publications (2)

Publication Number Publication Date
JPS6484740A true JPS6484740A (en) 1989-03-30
JP2517315B2 JP2517315B2 (en) 1996-07-24

Family

ID=17101104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62243252A Expired - Lifetime JP2517315B2 (en) 1987-09-28 1987-09-28 Electronic circuit package

Country Status (1)

Country Link
JP (1) JP2517315B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09270575A (en) * 1996-03-29 1997-10-14 Nec Corp Connection structure and connection for printed board
US5677569A (en) * 1994-10-27 1997-10-14 Samsung Electronics Co., Ltd. Semiconductor multi-package stack

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131087U (en) * 1985-02-05 1986-08-16
JPS61183589U (en) * 1985-05-08 1986-11-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131087U (en) * 1985-02-05 1986-08-16
JPS61183589U (en) * 1985-05-08 1986-11-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5677569A (en) * 1994-10-27 1997-10-14 Samsung Electronics Co., Ltd. Semiconductor multi-package stack
JPH09270575A (en) * 1996-03-29 1997-10-14 Nec Corp Connection structure and connection for printed board

Also Published As

Publication number Publication date
JP2517315B2 (en) 1996-07-24

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