JPH03254082A - Adapter for chip carrier - Google Patents

Abstract

PURPOSE: To reduce the cost of an adapter for chip carrier by furnishing a plate form supporting member with a plurality of conductive pads and also a plurality of through holes, and establishing a structure which requires only pressure-fitting of a connecting member. CONSTITUTION: On one surface of a plate form insulated supporting member 11, conductive pads in rows 12a, 12b, 12c are formed corresponding to the leads 2 of a chip carrier. The leads 2 are connected to the mating pads belonging to the rows 12a, 12b, 12c on the surface of an adapter 10. Through holes in rows 13a, 13b, 13c are furnished in the positions where connections are to be generated with the pads. A connecting pin 18 is fitted by pressure to connect with the pads 12a, 12b, 12c. A base board 20 has a conductive pad 23 on the surface of an insulated plate 21, being extended to a through hole 22 in such a way as enclosing the internal wall surface. When the pin 18 is fitted by pressure in the hole 22, the connection of the adapter 10 with the board 20 is established.

Description

DETAILED DESCRIPTION OF THE INVENTION OBJECTS OF THE INVENTION (INDUSTRIAL APPLICATION FIELD) The present invention relates to an adapter used for attaching a chip carrier containing a built-in device such as an IC onto a substrate.

(Conventional technology) When mounting a chip carrier on a board, conventionally,
The leads (legs) of the chip carrier were soldered directly to the conductive pads on the board. In this case, since it is directly attached by soldering, there is an advantage that the contact reliability is high. However, the lead pitch of recent chip carriers has become smaller, so before soldering, a test socket is used to test the quality of the built-in IC.
There is a problem that it is difficult to connect the chip carrier to the soto.

For this reason, for example,
As disclosed in Japanese Patent No. 8, No. 61=5468E3, etc., it is common practice to use a socket for receiving and holding a chip carrier. If such a socket is used, even if the pitch of the leads of the chip carrier is small, the pitch of the pins of the socket can be increased to perform so-called pitch conversion. Therefore, by connecting the pins of the socket to the test socket, the chip carrier received in the socket can be connected to the test socket via the socket, and the device can be easily tested.

(Problem to be Solved by the Invention) However, since the connection between the leads of the chip carrier and the terminals of the socket when they are received and held in the socket is only made by contact between the two,
There is a problem of poor contact reliability. In addition, such sockets require a recess for receiving the chip carrier, multiple grooves for guiding each lead of the chip carrier, and a lid for holding the received chip carrier. Therefore, there is a problem that it is expensive.

The present invention has been made in view of such problems, and an object of the present invention is to provide a chip carrier adapter that can perform pitch conversion, has high electrical connection reliability, and is inexpensive.

1. Structure of the Invention (Means for Solving the Problems) In order to achieve the above object, in the chip carrier adapter of the present invention, on one surface of the plate-shaped insulating support member, there is provided a structure corresponding to the lead position of the chip carrier. to form a plurality of conductive pads, a plurality of through holes penetrating from one surface of the support member to the other surface are formed at a predetermined pitch, and one end of the plurality of connection members is connected to the other surface. The connection is press-fitted into each through-hole from one side and the other end is made to protrude to the other side, and a plurality of conductive pads are formed extending into the corresponding through-hole, and the connection is press-fitted into the through-hole. It is electrically connected to the component.

(Function) When using the adapter configured as described above, each lead of the chip carrier is directly soldered to a corresponding conductive pad formed on one surface of the adapter. Therefore, the connection reliability between the leads and the conductive pads, that is, the connection reliability between the chip carrier and the adapter is high. Furthermore, the position of the through hole into which the connection member is press-fitted and connected to the conductive pad can be arbitrarily set on the support member. Therefore, even if the pitch of the leads is small, the pitch can be easily changed by increasing the positional pitch of the through holes.

(Embodiments) Hereinafter, preferred embodiments of the present invention will be described based on the drawings.

An adapter 10 according to the invention is shown in FIG. 1 with a chip carrier 1 attached. The chip carrier 1 has a plurality of boards 2 extending from each side to the bottom.

The interval between each lead 2, that is, the pitch is p as shown in the figure, and this pitch p is an extremely small value (for example, 0.64
-m). This chip carrier 1 has an adapter 10
It is attached to one side (top side) of the

Therefore, as shown in FIG.
A plurality of conductive pads 1 arranged in a square shape corresponding to the pads 2
2 all 2 b, 12 c are provided.

The spacing between these conductive pads 12a, 12b, 12c is the same as the pitch p of the leads 2 of the chip carrier I, and when the chip carrier 1 is placed on the adapter 10 as shown in FIG. Putt 12 a, 12
Corresponding guides 2 are brought into contact with the tops b and 12c.

This support member 11 has a plurality of through holes 13a, 13b, 13C arranged in three rows for each row of conductive pads.
is formed. These through holes 13a, 13b, 13c
The same number of conductive pads 12a, 12b, and 12c are provided, and the conductive pads 12a, 12b, and 12c are formed to extend to the corresponding through holes 13a, 13b, and 13c. Conductive pad 12 al l 2 b,
12c are arranged repeatedly in this order as shown in the figure, the conductive pads 12a extend to and are connected to the through holes 13a forming the outer row, and the conductive pads 12b
The conductive pads 12c extend to and connect to the through holes 13b forming the inner row, and the conductive pads 12c extend to and connect to the through holes 13c forming the center row.

Therefore, as shown in FIG. 4, the pitch in each row of these through holes is P□, and this pitch P1 is three times as large as the pitch p of the leads 2 of the chip carrier 1.

Also, the pitch between each row is P2. P3, and this pitch P2+P3 is the pitch of each conductive pad 13 at
It can be arbitrarily set by adjusting the inward or outward extension length of 13 b + 13 c.

Note that FIG. 5 shows the connection structure between each conductive pad 12a, 12b, 12c and each through hole 13aj13b+13c. As can be seen from this figure, the conductive pads 12a (12b, 12c) are connected to the through holes 13a (
13b, 13c) and is formed to cover the inner wall of the tesono.

The plurality of through holes 13 at 13 b, 13
A connecting pin 18 is press-fitted into the support member 11 from the lower surface side thereof. As shown in FIG. 5, this connecting pin 18 has a base end 18c that is press-fitted into the through-holes 13a, 13b, and 1.3c, and a base end 18c that is located at the center and serves as a stopper during press-fitting. flange portion 18b
and the support member 11 in the state attached to the support member 11.
A thin rod-shaped tip 18a protrudes downward from the top.

As shown in the figure, the inner wall surfaces of the through holes 13a, 13b, 13c are covered with conductive pads 12a, 12b, 12C, and the base end portions 18c are connected to the through holes 13a, 13.
b, 13c, this proximal end 18c becomes the corresponding conductive pad 12a, 12b.

12c.

The pitch of each connection pin 18 press-fitted in this way is the same as that of the through-hole 13a as described above.

The pitch is the same as that of the leads 13b and 13c, and is expanded (converted) from the pitch p of the leads 2 of the chip carrier 1.

That is, pitch conversion is performed by the adapter 10.

A conductive pad 1 is provided on the top surface of the adapter 10 having such a configuration.
2a, 12b+12c and the corresponding boards 2 are placed in contact with each other, and
The contacting conductive pads 12a, 12b, 12C and each lead 2 are soldered to attach the chip carrier 1 to the adapter 10, as shown in FIG.

If the adapter 10 with the chip carrier 1 attached in this way is attached to the test socket via its connection pin 8, the device of the chip carrier 1 (
IC, etc.) can be tested. In this case, as described above, the pitch of the connection pins 18 press-fitted into the adapter 10 is changed and made larger, so that the connection pins 18 can be easily attached to the test socket. .

Next, when attaching the chip carrier 1 to a printed circuit board or the like, as shown in FIG. Let it be inserted. Board 2
0 consists of a plate-like member 21 made of an insulating material and conductive pads 23 formed on the surface of this plate-like member 21, and a plurality of through holes 22 are formed in the plate-like member 21. A corresponding conductive pad 23 is formed extending to the through hole 22 and covering the inner wall thereof. For this reason, through hole 2
When the tip end 18a of the connecting pin 18 is inserted into the connecting pin 2, the connecting pin 18 and a predetermined conductive pad 23 are electrically connected. In order to ensure electrical connection here, normally the tip 18a of the connecting pin 18 inserted in this way is
and a conductive pad 23 are soldered in the through hole 22.

As described above, the adapter 10 with the chip carrier 1 attached is attached to the board 20, and the chip carrier 1
The leads 2 and the conductive pads 23 of the substrate 20 are reliably electrically connected.

In the above example, the connection between the adapter 10 and the board 20 was shown as a through-hole type in which the connection pin 18 was inserted into a through hole. As shown, a surface mount type may be used.

In this case, the adapter 10' is constructed using the connecting pin 19 instead of the connecting pin 18. This connecting pin 19 has a base end 19c that is press-fitted into the through hole 13a (13b, 13C) and a flange portion 19b that serves as a stopper, which have the same shape as the connecting pin 18, but the shape of the tip end 19a is different from that shown in the figure. The lower end surface of the tip portion 19a is flat as shown in FIG. Correspondingly, a conductive pad 26 is formed on the substrate 20, and the adapter 10 is placed on the substrate 20 so that the lower flat surface of the tip 19a of the connection pin 19 comes into contact with the conductive pad 26. In this state, the tip portion 19a and the conductive bat 26 are joined by reflow soldering or the like.

In addition, in this example, the base end 1 of the connecting pin 18.19
8c+19c through the through hole 13a (1
3b, 13c), but it is also possible to solder them.

However, high-temperature solder (approximately 23060) is used to join the leads 2 of the chip carrier 1 and the conductive pads 12a (12b, 12C) of the adapter 10, but the attachment of the connecting pins 18 and 19 is costly. Since low-temperature solder is normally used for these reasons, a problem arises in that the solder on the connecting pins 18 and 19 melts when soldering the chip carrier 12a to the adapter 10. For this reason, it is desirable to use a press-fit type as in this example.

As described above, according to the present invention, a plurality of conductive pads are formed on one surface of a plate-shaped insulating support member in correspondence with the reed positions of the chip carrier. Since each lead of the carrier is directly soldered and connected to the corresponding conductive pad, the reliability of the electrical connection between the lead and the conductive pad, that is, the reliability of the connection between the chip carrier and the adapter is high. In addition, the position of the through hole into which the connecting member is press-fitted and connected to the conductive pad can be arbitrarily set on the support member, so even if the pitch of the leads is small,
The pitch can be easily changed by increasing the pitch of the through holes, and connection to a test socket is facilitated. Furthermore, the present adapter has a simple structure in which a plurality of conductive butts are formed on a plate-shaped support member, a plurality of through holes are formed, and a connecting member is press-fitted into the through holes. Product costs can be reduced.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a chip carrier adapter according to the present invention with a chip carrier attached; FIGS. 2, 3, and 4 are plan, side, and bottom views of the adapter; 5 is a sectional view taken along the arrow v-■ in FIG. 3, FIG. 6 is a sectional view showing the adapter and the board to which it is connected, and FIG. 7 is a sectional view showing the adapter according to a different example of the present invention and the board to which it is connected. FIG. 2 is a sectional view showing a substrate.

Claims (1)

[Claims] 1) A chip carrier adapter that is connected to a board with a chip carrier mounted on one surface, the adapter being formed on the one surface corresponding to the lead position of the chip carrier. a plate-shaped insulating support member having a plurality of conductive pads and a plurality of through holes formed at a predetermined pitch from one surface to the other; a plurality of connection members that are press-fitted into the through-hole from the surface side and whose other ends protrude toward the other surface side, and each of the plurality of conductive pads is formed to extend into the corresponding through-hole. A chip carrier adapter, wherein the chip carrier adapter is electrically connected to the connecting member press-fitted into the through hole.