JP2625180B2 - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JP2625180B2 JP2625180B2 JP63308275A JP30827588A JP2625180B2 JP 2625180 B2 JP2625180 B2 JP 2625180B2 JP 63308275 A JP63308275 A JP 63308275A JP 30827588 A JP30827588 A JP 30827588A JP 2625180 B2 JP2625180 B2 JP 2625180B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- insulating plate
- lead
- substrate
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子回路、特に電子回路を実現するために用
いる回路基板に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit, and more particularly, to a circuit board used to realize an electronic circuit.
従来、この種の回転基板は部品を基板上の配線端子に
接続させようとした場合に２通りの構造のものが用いら
れている。その一つは第３図に示すように、基板15に導
電性スルーホール16,16…を設け、電子部品12のリード1
3を基板15のスルーホール16に挿通してハンダ付け14を
行って接続する構造のものである。2. Description of the Related Art Conventionally, two types of rotating boards of this type are used when components are to be connected to wiring terminals on the board. One of them is to provide conductive through holes 16, 16,... In a substrate 15 as shown in FIG.
3 has a structure in which it is inserted into a through hole 16 of a board 15 and soldered 14 to perform connection.
もう一つは第４図に示すように、基板23の導電性スル
ーホール21内にICソケット（又はピンソケット）20の外
部リード24を挿通してハンダ付け22を行い、ICソケット
20のソケット部19に電子部品17のリード18を圧入して接
続する構造のものである。The other, as shown in FIG. 4, is to insert the external lead 24 of the IC socket (or pin socket) 20 into the conductive through-hole 21 of the substrate 23 and to perform soldering 22 to the IC socket.
This has a structure in which the leads 18 of the electronic component 17 are press-fitted into the socket portions 19 of 20 and connected.
しかし、第３図に示すように直接電子部品12を接続し
た場合、部品12内部の回路に対してハンダの熱が加えら
れてしまい、部品内部の回路に悪影響を及ぼすこと、直
接接続してしまった場合、取り付け部品が正常動作を行
なわなくなったときの変換が大変であるという欠点があ
る。又、第４図に示すようにICソケット又はピンソケッ
トを用いて接続した場合、取り付け部品数が多くなって
しまい、完成した回路基板の価格が高価になるばかりで
なく、部品取り付け作業に多くの時間を費してしまうと
いう欠点がある。However, when the electronic components 12 are directly connected as shown in FIG. 3, the heat of the solder is applied to the circuit inside the components 12, which adversely affects the circuits inside the components 12 and causes the direct connection. In such a case, there is a disadvantage that the conversion when the attached component does not perform a normal operation is difficult. In addition, when connection is made using an IC socket or a pin socket as shown in FIG. 4, the number of parts to be mounted increases, so that not only does the price of the completed circuit board become expensive, but also many parts mounting work is required. It has the disadvantage of spending time.
本発明の目的は前記課題を解決した回路基板を提供す
ることにある。An object of the present invention is to provide a circuit board that solves the above-mentioned problem.
前記目的を達成するため、本発明に係る回路基板に絶
縁板においては、導電性スルーホールを備えた基板を相
対変位可能に内蔵し、該絶縁板に、前記基板のスルーホ
ール内に差込まれた電子部品のリードを受け入れるリー
ド孔を前記スルーホールに対応させて設け、さらに前記
絶縁板を付勢して絶縁板のリード孔に受け入れられた電
子部品のリードを基板のスルーホール内壁に圧着挾持さ
せるバネ手段を有するものである。In order to achieve the above object, in a circuit board according to the present invention, in an insulating plate, a substrate having a conductive through hole is incorporated so as to be relatively displaceable, and the insulating plate is inserted into the through hole of the substrate. A lead hole for receiving the lead of the electronic component is provided corresponding to the through-hole, and the insulating plate is urged to crimp the lead of the electronic component received in the lead hole of the insulating plate to the inner wall of the through-hole of the substrate. It has a spring means to make it.
以下、本発明の一実施例を図により説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す断面図、第２図は同
平面図である。FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a plan view of the same.
図において、基板８上に電子部品１のリード２を挿通
させる導電性スルーホール3,3…を各リード２に対応さ
せて設け、該基板８に絶縁板７をスルーホール３を横切
って相対変位可能に内蔵し、該絶縁板７に、スルーホー
ル３に差込まれた電子部品１のリード２を受け入れるリ
ード孔7aを各スルーホール３に対応して設ける。また、
基板８に、絶縁板７の端縁に臨ませて透孔10を設け、該
透孔10に位置する絶縁板７の端縁にバネ受け６を設け、
透孔10に内蔵したバネ５の端部をバネ受け６に弾接さ
せ、該バネ５により絶縁板７を、電子部品１のリード２
が基板スルーホール３の内壁に圧着挾持する方向に付勢
する。また、基板８の一部に絶縁板７の操作用スリット
９を設けるとともに、絶縁板７に操作孔11を設け、レバ
ー４をスリット９を介して絶縁板７の操作孔11に差込ん
で絶縁板７をレバー４をもって相対変位させる。In the figure, conductive through holes 3, 3... For inserting the leads 2 of the electronic component 1 are provided on the substrate 8 in correspondence with the respective leads 2, and an insulating plate 7 is formed on the substrate 8 by traversing the through holes 3. A lead hole 7a is provided in the insulating plate 7 for receiving the lead 2 of the electronic component 1 inserted into the through hole 3 so as to correspond to each through hole 3. Also,
A through hole 10 is provided in the substrate 8 so as to face an edge of the insulating plate 7, and a spring receiver 6 is provided at an edge of the insulating plate 7 located in the through hole 10.
The end of a spring 5 built into the through hole 10 is elastically contacted with a spring receiver 6, and the insulating plate 7 is moved by the spring 5 into the lead 2 of the electronic component 1.
Urges against the inner wall of the through hole 3. In addition, a slit 9 for operating the insulating plate 7 is provided in a part of the substrate 8, an operating hole 11 is provided in the insulating plate 7, and the lever 4 is inserted into the operating hole 11 of the insulating plate 7 through the slit 9 for insulation. The plate 7 is relatively displaced by the lever 4.
実施例において、レバー４を絶縁板７の操作孔11に差
込み、該絶縁板７をバネ５のバネ力に抗して相対変位さ
せ絶縁板リード孔7aと基板スルーホール３とを同芯上に
配列し、この状態で電子部品１のリード２を絶縁板リー
ド孔7aと基板スルーホール３とに渡って差込み、レバー
４への外力を解除する。すると、バネ５のバネ力が絶縁
板７に作用して絶縁板７が相対変位し、基板スルーホー
ル３に対して絶縁板リード孔7aの位置が偏寄するため、
バネ５のバネ力を受けて絶縁板リード孔7aの内壁で電子
部品１のリード２が基板スルーホール３の内壁に圧着さ
れ、電子部品１のリード２はリード孔7aとスルーホール
３との内壁間に挾持されて基板のスルーホール３に電気
的に接続される。この状態において、電子部品１はスル
ーホール３を介して基板８の図示しない配線パターンに
電気的に接続されることとなる。In the embodiment, the lever 4 is inserted into the operation hole 11 of the insulating plate 7, and the insulating plate 7 is relatively displaced against the spring force of the spring 5, so that the insulating plate lead hole 7a and the substrate through hole 3 are concentric. In this state, the lead 2 of the electronic component 1 is inserted across the lead hole 7a of the insulating plate and the through hole 3 of the board, and the external force to the lever 4 is released. Then, the spring force of the spring 5 acts on the insulating plate 7 to relatively displace the insulating plate 7, and the position of the insulating plate lead hole 7 a is deviated from the substrate through hole 3.
Under the spring force of the spring 5, the lead 2 of the electronic component 1 is pressed against the inner wall of the substrate through hole 3 at the inner wall of the insulating plate lead hole 7a, and the lead 2 of the electronic component 1 is connected to the inner wall of the lead hole 7a and the through hole 3. It is sandwiched between and electrically connected to the through hole 3 of the substrate. In this state, the electronic component 1 is electrically connected to a wiring pattern (not shown) of the substrate 8 via the through hole 3.
又、電子部品１を抜き取る場合には、絶縁板７の操作
孔11にレバー４を差込み、該レバー４により絶縁板７を
バネ５に抗して相対変位させて基板スルーホール３に対
し絶縁板リード孔7aを同芯上に配列させ、電子部品１の
リード２の固定をフリーにした状態にしてリード２をス
ルーホール３及びリード孔7aから抜き取る。When the electronic component 1 is to be removed, the lever 4 is inserted into the operation hole 11 of the insulating plate 7, and the insulating plate 7 is relatively displaced by the lever 4 against the spring 5 so that the insulating plate 7 The lead holes 7a are arranged concentrically, and the lead 2 of the electronic component 1 is fixed free, and the lead 2 is pulled out from the through hole 3 and the lead hole 7a.
以上説明したように、本発明は回路基板自体に部品を
配線端子部に接続及び固定する機能を有することによ
り、接続専用外部部品を用いる必要がなく、又基板に設
けられた部品を簡単に交換することができ、かつ、基板
への部品の接続を金属接続することがないため、金属接
続時に発生していた高熱による部品回路への悪影響を防
止することができる効果を有する。As described above, the present invention has the function of connecting and fixing components to the wiring terminal portion on the circuit board itself, so that there is no need to use external components dedicated to connection, and the components provided on the board can be easily replaced. Since the connection of the component to the substrate is not performed by metal connection, there is an effect that it is possible to prevent a bad influence on the component circuit due to high heat generated at the time of metal connection.
第１図は本発明の一実施例を示す断面図、第２図は同平
面図、第３図，第４図は従来例を示す断面図である。 １……電子部品、２……リード ３……スルーホール、５……バネ ７……絶縁板、7a……リード孔 ８……基板1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view of the same, and FIGS. 3 and 4 are sectional views showing a conventional example. DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Lead 3 ... Through hole, 5 ... Spring 7 ... Insulating plate, 7a ... Lead hole 8 ... Board
Claims (1)
を相対変位可能に内蔵し、該絶縁板に、前記基板のスル
ーホール内に差込まれた電子部品のリードを受け入れる
リード孔を前記スルーホールに対応させて設け、さらに
前記絶縁板を付勢して絶縁板のリード孔に受け入れられ
た電子部品のリードを基板のスルーホール内壁に圧着挾
持させるバネ手段を有することを特徴とする回路基板。An insulating plate is provided in a substrate having a conductive through hole so as to be relatively displaceable, and a lead hole for receiving a lead of an electronic component inserted in the through hole of the substrate is provided in the insulating plate. A circuit provided in correspondence with the through hole, and further comprising a spring means for urging the insulating plate to press and clamp the lead of the electronic component received in the lead hole of the insulating plate to the inner wall of the through hole of the substrate. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63308275A JP2625180B2 (en) | 1988-12-06 | 1988-12-06 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63308275A JP2625180B2 (en) | 1988-12-06 | 1988-12-06 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02154495A JPH02154495A (en) | 1990-06-13 |
| JP2625180B2 true JP2625180B2 (en) | 1997-07-02 |
Family
ID=17979065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63308275A Expired - Lifetime JP2625180B2 (en) | 1988-12-06 | 1988-12-06 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2625180B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5967837A (en) * | 1996-10-01 | 1999-10-19 | Alps Automotive, Inc. | Assembly for connecting an electric/electronic device to a printed circuit board |
| KR101502237B1 (en) * | 2013-11-12 | 2015-03-12 | 주식회사 현대케피코 | A device for supporting a part of PCB |
-
1988
- 1988-12-06 JP JP63308275A patent/JP2625180B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02154495A (en) | 1990-06-13 |
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