GB1514401A - Panel board for electronic circuitry - Google Patents
Panel board for electronic circuitryInfo
- Publication number
- GB1514401A GB1514401A GB577176A GB577176A GB1514401A GB 1514401 A GB1514401 A GB 1514401A GB 577176 A GB577176 A GB 577176A GB 577176 A GB577176 A GB 577176A GB 1514401 A GB1514401 A GB 1514401A
- Authority
- GB
- United Kingdom
- Prior art keywords
- voltage
- board
- plane
- socket contacts
- planes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10333—Individual female type metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Abstract
1514401 Electronic component assemblies AUGAT INC 13 Feb 1976 [24 April 1975] 05771/76 Heading H1R A multilayer panelboard for high speed logic 11 comprises (Figs. 1, 2) plural dual in line arrays 12 of socket contacts 13 each having underlying wire wrap extensions 14 projecting from the opposite side of the board, which may carry any number of such arrays. One or more of the latter may contain dual in line packages 15 of integrated circuit switching logic. The board 11 comprises dielectric laminates 16, 17 represented by a conductive intermediate voltage plane 21 and carrying externally conductive ground planes 22, 23. Multiple socket contacts 13 are inserted through the board with protruding wire wrap extensions 14 interconnectible as required by wrapped wires. A dual in line integrated circuit package 15 had leads 31 inserted into the socket contacts, and end contact 26 is solder connected to voltage planes 32, 33 isolated from internal plane 21 by an etched out gap, while end contact 27 is solder connected at 35 to plane 21 also isolated by an etched out gap. Distributed capacitance between the voltage and ground planes is increased to reduce interference noise. Holes 36, 37 of the end of each array 12 enable decoupling capacitors to be interconnected between the voltage and ground planes; a lead through hole 36 being isolated from planes 22, 23 by etched out clearances and solder connected to voltage plane 29. A lead through hole 37 is connectible by solder to ground planes 22, 23. The board may be of glass epoxy with tin plated copper layers, and the socket contacts may be of brass with beryllium copper contacts all gold over nickel plated.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57142875A | 1975-04-24 | 1975-04-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1514401A true GB1514401A (en) | 1978-06-14 |
Family
ID=24283668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB577176A Expired GB1514401A (en) | 1975-04-24 | 1976-02-13 | Panel board for electronic circuitry |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS51130868A (en) |
CA (1) | CA1045240A (en) |
DE (1) | DE2608522A1 (en) |
GB (1) | GB1514401A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4494172A (en) * | 1982-01-28 | 1985-01-15 | Mupac Corporation | High-speed wire wrap board |
DE3937183A1 (en) * | 1989-07-22 | 1991-01-24 | Bosch Gmbh Robert | METHOD FOR EMISSION RADIATION DAMPING ON CIRCUIT BOARDS |
EP2416385A1 (en) * | 2010-08-02 | 2012-02-08 | Scheuten S.à.r.l. | Multi-layer back contact film |
-
1976
- 1976-02-10 CA CA245,401A patent/CA1045240A/en not_active Expired
- 1976-02-13 GB GB577176A patent/GB1514401A/en not_active Expired
- 1976-03-02 DE DE19762608522 patent/DE2608522A1/en not_active Withdrawn
- 1976-04-23 JP JP51046422A patent/JPS51130868A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CA1045240A (en) | 1978-12-26 |
DE2608522A1 (en) | 1976-11-04 |
JPS51130868A (en) | 1976-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |