JPS6435905A - Method of mounting capacitor to circuit board - Google Patents

Method of mounting capacitor to circuit board

Info

Publication number
JPS6435905A
JPS6435905A JP62191200A JP19120087A JPS6435905A JP S6435905 A JPS6435905 A JP S6435905A JP 62191200 A JP62191200 A JP 62191200A JP 19120087 A JP19120087 A JP 19120087A JP S6435905 A JPS6435905 A JP S6435905A
Authority
JP
Japan
Prior art keywords
external electrode
wire
solder
land
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62191200A
Other languages
Japanese (ja)
Other versions
JP2528326B2 (en
Inventor
Hideo Kurihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP62191200A priority Critical patent/JP2528326B2/en
Publication of JPS6435905A publication Critical patent/JPS6435905A/en
Application granted granted Critical
Publication of JP2528326B2 publication Critical patent/JP2528326B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Ceramic Capacitors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To make it possible to prevent a short-circuit by solder on a pair of capacitors even when the position of the capacitors against a substrate is deviated. CONSTITUTION:Only a land 8, with which the first external electrode 5 is soldered, is provided on an insulating circuit substrate 7. At the same time, a wire-bonding part 10, to be used to connect the second external electrode 6 with a wire 9, is provided. solder mixed with paste on the land 8 of the substrate 7 and other necessary parts. Subsequently, a laminated porcelain capacitor is arranged longitudinally in such a manner that the straight line linking the first and the second external electrodes 5 and 6 is right-angled to the main surface of the circuit substrate 7, the first external electrode 5 is fixed to the land 8 with solder 11, and the second external electrode 6 and the wire-bonding part 10 are connected with a wire 9. Through the above-mentioned procedures, the electric connection of a laminated porcelain capacitor 1 is conducted, and a hybrid integrated circuit is completed. In this case, the first external electrode 5 and the second external electrode 6 are not short-circuited by the solder.
JP62191200A 1987-07-30 1987-07-30 How to attach a capacitor to a circuit board Expired - Lifetime JP2528326B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62191200A JP2528326B2 (en) 1987-07-30 1987-07-30 How to attach a capacitor to a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62191200A JP2528326B2 (en) 1987-07-30 1987-07-30 How to attach a capacitor to a circuit board

Publications (2)

Publication Number Publication Date
JPS6435905A true JPS6435905A (en) 1989-02-07
JP2528326B2 JP2528326B2 (en) 1996-08-28

Family

ID=16270573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62191200A Expired - Lifetime JP2528326B2 (en) 1987-07-30 1987-07-30 How to attach a capacitor to a circuit board

Country Status (1)

Country Link
JP (1) JP2528326B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100865636B1 (en) * 2006-02-14 2008-10-29 티디케이가부시기가이샤 Ceramic Capacitor Mounting Structure and Ceramic Capacitor
JP2014027255A (en) * 2012-06-22 2014-02-06 Murata Mfg Co Ltd Ceramic electronic component and ceramic electronic device
JP2017063125A (en) * 2015-09-25 2017-03-30 Tdk株式会社 Electronic component
JP2017126715A (en) * 2016-01-15 2017-07-20 株式会社村田製作所 Electronic component, mounted electronic component, and electronic component mounting method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131946U (en) * 1978-03-06 1979-09-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131946U (en) * 1978-03-06 1979-09-12

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100865636B1 (en) * 2006-02-14 2008-10-29 티디케이가부시기가이샤 Ceramic Capacitor Mounting Structure and Ceramic Capacitor
JP2014027255A (en) * 2012-06-22 2014-02-06 Murata Mfg Co Ltd Ceramic electronic component and ceramic electronic device
JP2017063125A (en) * 2015-09-25 2017-03-30 Tdk株式会社 Electronic component
JP2017126715A (en) * 2016-01-15 2017-07-20 株式会社村田製作所 Electronic component, mounted electronic component, and electronic component mounting method

Also Published As

Publication number Publication date
JP2528326B2 (en) 1996-08-28

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