JPS57180155A - Vessel for electronic circuit - Google Patents

Vessel for electronic circuit

Info

Publication number
JPS57180155A
JPS57180155A JP6545781A JP6545781A JPS57180155A JP S57180155 A JPS57180155 A JP S57180155A JP 6545781 A JP6545781 A JP 6545781A JP 6545781 A JP6545781 A JP 6545781A JP S57180155 A JPS57180155 A JP S57180155A
Authority
JP
Japan
Prior art keywords
terminals
electronic circuit
vessel
sides
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6545781A
Other languages
Japanese (ja)
Inventor
Hitoshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6545781A priority Critical patent/JPS57180155A/en
Publication of JPS57180155A publication Critical patent/JPS57180155A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To facilitate mounting of a wiring plate in a vessel for dual lines type electronic circuit by a method wherein out of many lead terminals to lead out downward from both sides of the vessel main body to seal a semiconductor IC chip inside, only the necessary terminals at the minimum for mounting and positioning on the printed wiring plate are made long, and the others are made short. CONSTITUTION:Out of the many lead terminals to lead out downward from both sides of the vessel main body 1 for dual lines type electronic circuit to seal the semiconductor IC chip inside, the four lead terminals 2a at both ends out of the terminals on both sides are made broad upto about the half of total length, and breadth of the points thereafter are narrowed by about the half for insertion in penetrating holes in the printed wiring plate. Moreover the broad parts of the terminals 2b positioned between them only survive, the points thereafter are cut, and the terminals 2a only are inserted in the penetrating holes 4 in the substrate 3 to be soldered to conductors 5 provided in the holes 4.
JP6545781A 1981-04-30 1981-04-30 Vessel for electronic circuit Pending JPS57180155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6545781A JPS57180155A (en) 1981-04-30 1981-04-30 Vessel for electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6545781A JPS57180155A (en) 1981-04-30 1981-04-30 Vessel for electronic circuit

Publications (1)

Publication Number Publication Date
JPS57180155A true JPS57180155A (en) 1982-11-06

Family

ID=13287679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6545781A Pending JPS57180155A (en) 1981-04-30 1981-04-30 Vessel for electronic circuit

Country Status (1)

Country Link
JP (1) JPS57180155A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59103449U (en) * 1982-12-28 1984-07-12 富士通株式会社 Mounting structure of semiconductor package
JPS6052659U (en) * 1983-09-16 1985-04-13 富士通テン株式会社 Mounting structure of flat package integrated circuit
JPS6215846A (en) * 1985-07-12 1987-01-24 Matsushita Electric Works Ltd Pin grid array

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156344A (en) * 1979-05-24 1980-12-05 Toshiba Corp Connection of semiconductor device
JPS5649153B2 (en) * 1974-05-31 1981-11-19

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649153B2 (en) * 1974-05-31 1981-11-19
JPS55156344A (en) * 1979-05-24 1980-12-05 Toshiba Corp Connection of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59103449U (en) * 1982-12-28 1984-07-12 富士通株式会社 Mounting structure of semiconductor package
JPS6052659U (en) * 1983-09-16 1985-04-13 富士通テン株式会社 Mounting structure of flat package integrated circuit
JPH0217501Y2 (en) * 1983-09-16 1990-05-16
JPS6215846A (en) * 1985-07-12 1987-01-24 Matsushita Electric Works Ltd Pin grid array

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