JPS5745962A - Substrate, electronic circuit device and method of producing same - Google Patents
Substrate, electronic circuit device and method of producing sameInfo
- Publication number
- JPS5745962A JPS5745962A JP9166881A JP9166881A JPS5745962A JP S5745962 A JPS5745962 A JP S5745962A JP 9166881 A JP9166881 A JP 9166881A JP 9166881 A JP9166881 A JP 9166881A JP S5745962 A JPS5745962 A JP S5745962A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic circuit
- circuit device
- producing same
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18132980A | 1980-08-25 | 1980-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5745962A true JPS5745962A (en) | 1982-03-16 |
Family
ID=22663824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9166881A Pending JPS5745962A (en) | 1980-08-25 | 1981-06-16 | Substrate, electronic circuit device and method of producing same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5745962A (en) |
CA (1) | CA1151257A (en) |
DE (1) | DE3133584A1 (en) |
FR (1) | FR2489044A1 (en) |
GB (1) | GB2082843B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3406537A1 (en) * | 1984-02-23 | 1985-08-29 | Brown, Boveri & Cie Ag, 6800 Mannheim | ARRANGEMENT OF A PERFORMANCE SEMICONDUCTOR COMPONENT ON AN INSULATING AND PROVIDED SUBSTRATE |
GB2248345B (en) * | 1990-09-27 | 1994-06-22 | Stc Plc | Edge soldering of electronic components |
CN112074095B (en) * | 2020-10-10 | 2021-08-31 | 黄石星河电路有限公司 | Thin plate processing method with 0.4MM metal half-holes designed around |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5045963A (en) * | 1973-08-20 | 1975-04-24 | ||
JPS5089874A (en) * | 1973-12-12 | 1975-07-18 | ||
JPS5229966A (en) * | 1975-09-02 | 1977-03-07 | Allen Bradley Co | Method of connecting electric circuit device and terminal leads firmly |
-
1981
- 1981-05-26 CA CA000378327A patent/CA1151257A/en not_active Expired
- 1981-06-16 JP JP9166881A patent/JPS5745962A/en active Pending
- 1981-08-18 FR FR8115884A patent/FR2489044A1/en active Granted
- 1981-08-18 GB GB8125160A patent/GB2082843B/en not_active Expired
- 1981-08-25 DE DE19813133584 patent/DE3133584A1/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5045963A (en) * | 1973-08-20 | 1975-04-24 | ||
JPS5089874A (en) * | 1973-12-12 | 1975-07-18 | ||
JPS5229966A (en) * | 1975-09-02 | 1977-03-07 | Allen Bradley Co | Method of connecting electric circuit device and terminal leads firmly |
Also Published As
Publication number | Publication date |
---|---|
GB2082843B (en) | 1984-09-19 |
DE3133584A1 (en) | 1982-07-01 |
FR2489044B3 (en) | 1983-06-17 |
GB2082843A (en) | 1982-03-10 |
FR2489044A1 (en) | 1982-02-26 |
CA1151257A (en) | 1983-08-02 |
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