FR2489044B3 - - Google Patents

Info

Publication number
FR2489044B3
FR2489044B3 FR8115884A FR8115884A FR2489044B3 FR 2489044 B3 FR2489044 B3 FR 2489044B3 FR 8115884 A FR8115884 A FR 8115884A FR 8115884 A FR8115884 A FR 8115884A FR 2489044 B3 FR2489044 B3 FR 2489044B3
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8115884A
Other languages
French (fr)
Other versions
FR2489044A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allen Bradley Co LLC
Original Assignee
Allen Bradley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allen Bradley Co LLC filed Critical Allen Bradley Co LLC
Publication of FR2489044A1 publication Critical patent/FR2489044A1/en
Application granted granted Critical
Publication of FR2489044B3 publication Critical patent/FR2489044B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
FR8115884A 1980-08-25 1981-08-18 ELECTRIC CIRCUIT COMPONENT AND MANUFACTURING METHOD THEREOF Granted FR2489044A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18132980A 1980-08-25 1980-08-25

Publications (2)

Publication Number Publication Date
FR2489044A1 FR2489044A1 (en) 1982-02-26
FR2489044B3 true FR2489044B3 (en) 1983-06-17

Family

ID=22663824

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8115884A Granted FR2489044A1 (en) 1980-08-25 1981-08-18 ELECTRIC CIRCUIT COMPONENT AND MANUFACTURING METHOD THEREOF

Country Status (5)

Country Link
JP (1) JPS5745962A (en)
CA (1) CA1151257A (en)
DE (1) DE3133584A1 (en)
FR (1) FR2489044A1 (en)
GB (1) GB2082843B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406537A1 (en) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim ARRANGEMENT OF A PERFORMANCE SEMICONDUCTOR COMPONENT ON AN INSULATING AND PROVIDED SUBSTRATE
GB2248345B (en) * 1990-09-27 1994-06-22 Stc Plc Edge soldering of electronic components
CN112074095B (en) * 2020-10-10 2021-08-31 黄石星河电路有限公司 Thin plate processing method with 0.4MM metal half-holes designed around

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873890A (en) * 1973-08-20 1975-03-25 Allen Bradley Co Terminal construction for electrical circuit device
JPS5089874A (en) * 1973-12-12 1975-07-18
CA1055134A (en) * 1975-09-02 1979-05-22 Lawrence D. Radosevich Terminal lead construction for electrical circuit substrate

Also Published As

Publication number Publication date
FR2489044A1 (en) 1982-02-26
GB2082843A (en) 1982-03-10
GB2082843B (en) 1984-09-19
DE3133584A1 (en) 1982-07-01
CA1151257A (en) 1983-08-02
JPS5745962A (en) 1982-03-16

Similar Documents

Publication Publication Date Title
FR2476425B1 (en)
FR2474291B1 (en)
FR2474044B1 (en)
FR2474465B1 (en)
FR2474436B1 (en)
FR2476216B1 (en)
FR2479066B1 (en)
FR2476537B1 (en)
FR2473029B3 (en)
FR2477888B1 (en)
FR2474835B1 (en)
FR2474153B3 (en)
FR2475148B1 (en)
FR2474589B1 (en)
FR2475928B1 (en)
FR2476604B3 (en)
DE3132226C2 (en)
FR2476621B3 (en)
FR2478241B3 (en)
DE3107338C2 (en)
FR2474906B1 (en)
FR2476920B1 (en)
FR2478393B3 (en)
CH655579B (en)
FR2475644B1 (en)