JPS57118690A - Method of producing electronic circuit - Google Patents

Method of producing electronic circuit

Info

Publication number
JPS57118690A
JPS57118690A JP56004381A JP438181A JPS57118690A JP S57118690 A JPS57118690 A JP S57118690A JP 56004381 A JP56004381 A JP 56004381A JP 438181 A JP438181 A JP 438181A JP S57118690 A JPS57118690 A JP S57118690A
Authority
JP
Japan
Prior art keywords
electronic circuit
producing electronic
producing
circuit
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56004381A
Other languages
Japanese (ja)
Inventor
Masataka Koyama
Riyouichi Ozaki
Kenji Shinosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56004381A priority Critical patent/JPS57118690A/en
Publication of JPS57118690A publication Critical patent/JPS57118690A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/24195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP56004381A 1981-01-14 1981-01-14 Method of producing electronic circuit Pending JPS57118690A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56004381A JPS57118690A (en) 1981-01-14 1981-01-14 Method of producing electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56004381A JPS57118690A (en) 1981-01-14 1981-01-14 Method of producing electronic circuit

Publications (1)

Publication Number Publication Date
JPS57118690A true JPS57118690A (en) 1982-07-23

Family

ID=11582773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56004381A Pending JPS57118690A (en) 1981-01-14 1981-01-14 Method of producing electronic circuit

Country Status (1)

Country Link
JP (1) JPS57118690A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171740A (en) * 1984-02-17 1985-09-05 Toshiba Corp Wiring of integrated circuit element
JPH04158596A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Electronic parts mounting method and electronic parts mounting board
US7176055B2 (en) 2001-11-02 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171740A (en) * 1984-02-17 1985-09-05 Toshiba Corp Wiring of integrated circuit element
JPH04158596A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Electronic parts mounting method and electronic parts mounting board
US7176055B2 (en) 2001-11-02 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Similar Documents

Publication Publication Date Title
JPS5745952A (en) Method of producing integrated circuit
JPS57160194A (en) Method of producing microminature circuit
JPS5779650A (en) Method of producing integrated circuit
GB2113477B (en) Method of producing printed circuits
DE3278837D1 (en) A method of forming an electronic circuit structure
JPS5727053A (en) Method of producing integrated circuit
JPS57132393A (en) Method of producing electric circuit board
JPS57128097A (en) Method of producing printed circuit board
JPS57118690A (en) Method of producing electronic circuit
JPS57166095A (en) Circuit board and method of producing same
JPS57128096A (en) Method of producing printed circuit board
JPS5749129A (en) Method of producing electronic part
JPS57121298A (en) Method of producing circuit board
JPS57120391A (en) Method of producing circuit board
JPS57180195A (en) Method of producing circuit board
JPS5790995A (en) Method of producing printed circuit
JPS57186393A (en) Method of producing flash circuit
JPS57173926A (en) Method of producing ceramic electronic part
JPS57115898A (en) Method of producing printed circuit board
JPS57132390A (en) Method of producing printed circuit board
JPS57128997A (en) Method of producing printed circuit board
JPS5768012A (en) Method of producing electronic part
JPS5783088A (en) Method of producing circuit board
JPS57128998A (en) Method of producing printed circuit board
JPS5718384A (en) Method of producing electronic circuit block