JPS57128997A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS57128997A JPS57128997A JP1394281A JP1394281A JPS57128997A JP S57128997 A JPS57128997 A JP S57128997A JP 1394281 A JP1394281 A JP 1394281A JP 1394281 A JP1394281 A JP 1394281A JP S57128997 A JPS57128997 A JP S57128997A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- producing printed
- producing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1394281A JPS5922395B2 (en) | 1981-02-02 | 1981-02-02 | Printed wiring board manufacturing method |
CA000395127A CA1212073A (en) | 1981-02-02 | 1982-01-28 | Impregnating anodic oxide film with polymerizable compound and polymerizing and resulting wiring board |
DE8282300465T DE3270926D1 (en) | 1981-02-02 | 1982-01-29 | Process of treating anodic oxide film, printed wiring board and process of making the same |
EP82300465A EP0058023B1 (en) | 1981-02-02 | 1982-01-29 | Process of treating anodic oxide film, printed wiring board and process of making the same |
US06/344,711 US4483751A (en) | 1981-02-02 | 1982-02-01 | Process of treating a nodic oxide film, printed wiring board and process of making the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1394281A JPS5922395B2 (en) | 1981-02-02 | 1981-02-02 | Printed wiring board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57128997A true JPS57128997A (en) | 1982-08-10 |
JPS5922395B2 JPS5922395B2 (en) | 1984-05-26 |
Family
ID=11847255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1394281A Expired JPS5922395B2 (en) | 1981-02-02 | 1981-02-02 | Printed wiring board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5922395B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014503036A (en) * | 2011-02-14 | 2014-02-06 | アノマックス エスディーエヌ. ビーエイチディー. | Integrated substrate circuit heat sink and manufacturing method |
JPWO2016047702A1 (en) * | 2014-09-24 | 2017-04-27 | 京セラ株式会社 | Electronic component mounting substrate and light emitting device using the same |
KR20180039618A (en) * | 2015-08-13 | 2018-04-18 | 가부시키가이샤 유에이씨제이 | A surface-treated aluminum material excellent in resin adhesion, a method for producing the same, and a bonded body of a surface- |
-
1981
- 1981-02-02 JP JP1394281A patent/JPS5922395B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014503036A (en) * | 2011-02-14 | 2014-02-06 | アノマックス エスディーエヌ. ビーエイチディー. | Integrated substrate circuit heat sink and manufacturing method |
JPWO2016047702A1 (en) * | 2014-09-24 | 2017-04-27 | 京セラ株式会社 | Electronic component mounting substrate and light emitting device using the same |
KR20180039618A (en) * | 2015-08-13 | 2018-04-18 | 가부시키가이샤 유에이씨제이 | A surface-treated aluminum material excellent in resin adhesion, a method for producing the same, and a bonded body of a surface- |
Also Published As
Publication number | Publication date |
---|---|
JPS5922395B2 (en) | 1984-05-26 |
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