JPS57128997A - Method of producing printed circuit board - Google Patents

Method of producing printed circuit board

Info

Publication number
JPS57128997A
JPS57128997A JP1394281A JP1394281A JPS57128997A JP S57128997 A JPS57128997 A JP S57128997A JP 1394281 A JP1394281 A JP 1394281A JP 1394281 A JP1394281 A JP 1394281A JP S57128997 A JPS57128997 A JP S57128997A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing printed
producing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1394281A
Other languages
Japanese (ja)
Other versions
JPS5922395B2 (en
Inventor
Seizou Murayama
Kazuo Ishimata
Seijiyu Maejima
Kouichi Saruwatari
Riyuukichi Usuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP1394281A priority Critical patent/JPS5922395B2/en
Priority to CA000395127A priority patent/CA1212073A/en
Priority to DE8282300465T priority patent/DE3270926D1/en
Priority to EP82300465A priority patent/EP0058023B1/en
Priority to US06/344,711 priority patent/US4483751A/en
Publication of JPS57128997A publication Critical patent/JPS57128997A/en
Publication of JPS5922395B2 publication Critical patent/JPS5922395B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP1394281A 1981-02-02 1981-02-02 Printed wiring board manufacturing method Expired JPS5922395B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1394281A JPS5922395B2 (en) 1981-02-02 1981-02-02 Printed wiring board manufacturing method
CA000395127A CA1212073A (en) 1981-02-02 1982-01-28 Impregnating anodic oxide film with polymerizable compound and polymerizing and resulting wiring board
DE8282300465T DE3270926D1 (en) 1981-02-02 1982-01-29 Process of treating anodic oxide film, printed wiring board and process of making the same
EP82300465A EP0058023B1 (en) 1981-02-02 1982-01-29 Process of treating anodic oxide film, printed wiring board and process of making the same
US06/344,711 US4483751A (en) 1981-02-02 1982-02-01 Process of treating a nodic oxide film, printed wiring board and process of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1394281A JPS5922395B2 (en) 1981-02-02 1981-02-02 Printed wiring board manufacturing method

Publications (2)

Publication Number Publication Date
JPS57128997A true JPS57128997A (en) 1982-08-10
JPS5922395B2 JPS5922395B2 (en) 1984-05-26

Family

ID=11847255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1394281A Expired JPS5922395B2 (en) 1981-02-02 1981-02-02 Printed wiring board manufacturing method

Country Status (1)

Country Link
JP (1) JPS5922395B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014503036A (en) * 2011-02-14 2014-02-06 アノマックス エスディーエヌ. ビーエイチディー. Integrated substrate circuit heat sink and manufacturing method
JPWO2016047702A1 (en) * 2014-09-24 2017-04-27 京セラ株式会社 Electronic component mounting substrate and light emitting device using the same
KR20180039618A (en) * 2015-08-13 2018-04-18 가부시키가이샤 유에이씨제이 A surface-treated aluminum material excellent in resin adhesion, a method for producing the same, and a bonded body of a surface-

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014503036A (en) * 2011-02-14 2014-02-06 アノマックス エスディーエヌ. ビーエイチディー. Integrated substrate circuit heat sink and manufacturing method
JPWO2016047702A1 (en) * 2014-09-24 2017-04-27 京セラ株式会社 Electronic component mounting substrate and light emitting device using the same
KR20180039618A (en) * 2015-08-13 2018-04-18 가부시키가이샤 유에이씨제이 A surface-treated aluminum material excellent in resin adhesion, a method for producing the same, and a bonded body of a surface-

Also Published As

Publication number Publication date
JPS5922395B2 (en) 1984-05-26

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