GB2289170B - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- GB2289170B GB2289170B GB9508857A GB9508857A GB2289170B GB 2289170 B GB2289170 B GB 2289170B GB 9508857 A GB9508857 A GB 9508857A GB 9508857 A GB9508857 A GB 9508857A GB 2289170 B GB2289170 B GB 2289170B
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit board
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11761294A JP3365048B2 (en) | 1994-05-06 | 1994-05-06 | Chip component mounting board and chip component mounting method |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9508857D0 GB9508857D0 (en) | 1995-06-21 |
GB2289170A GB2289170A (en) | 1995-11-08 |
GB2289170B true GB2289170B (en) | 1998-06-24 |
Family
ID=14716075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9508857A Expired - Fee Related GB2289170B (en) | 1994-05-06 | 1995-05-01 | Circuit board |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3365048B2 (en) |
KR (1) | KR950035538A (en) |
CN (1) | CN1080082C (en) |
GB (1) | GB2289170B (en) |
TW (1) | TW423265B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3400634B2 (en) | 1996-02-28 | 2003-04-28 | 富士通株式会社 | Method of modifying wiring pattern of printed circuit board and method of cutting wiring pattern of printed circuit board |
CN100531514C (en) * | 2004-07-12 | 2009-08-19 | 鸿富锦精密工业(深圳)有限公司 | Short-proof printed circuit board structure |
JP2006041409A (en) * | 2004-07-30 | 2006-02-09 | Toshiba Corp | Wiring board and magnetic disc device |
US7312403B2 (en) * | 2004-09-24 | 2007-12-25 | Matsushita Electric Industrial Co., Ltd. | Circuit component mounting device |
WO2015114070A1 (en) * | 2014-01-31 | 2015-08-06 | Trüb Emulsions Chemie Ag | Aqueous primer coating for use in a digital printing process |
JP2016207952A (en) | 2015-04-28 | 2016-12-08 | 富士通株式会社 | Component built-in substrate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1062928A (en) * | 1964-09-15 | 1967-03-22 | Standard Telephones Cables Ltd | Multi-wafer integrated circuits |
US4777564A (en) * | 1986-10-16 | 1988-10-11 | Motorola, Inc. | Leadform for use with surface mounted components |
US5227589A (en) * | 1991-12-23 | 1993-07-13 | Motorola, Inc. | Plated-through interconnect solder thief |
EP0578880A1 (en) * | 1992-07-14 | 1994-01-19 | General Electric Company | Plated D-shell connector |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01251788A (en) * | 1988-03-31 | 1989-10-06 | Canon Inc | Printed board |
-
1994
- 1994-05-06 JP JP11761294A patent/JP3365048B2/en not_active Expired - Fee Related
-
1995
- 1995-04-18 TW TW084103790A patent/TW423265B/en not_active IP Right Cessation
- 1995-05-01 GB GB9508857A patent/GB2289170B/en not_active Expired - Fee Related
- 1995-05-04 KR KR1019950010944A patent/KR950035538A/en not_active Application Discontinuation
- 1995-05-05 CN CN95104667A patent/CN1080082C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1062928A (en) * | 1964-09-15 | 1967-03-22 | Standard Telephones Cables Ltd | Multi-wafer integrated circuits |
US4777564A (en) * | 1986-10-16 | 1988-10-11 | Motorola, Inc. | Leadform for use with surface mounted components |
US5227589A (en) * | 1991-12-23 | 1993-07-13 | Motorola, Inc. | Plated-through interconnect solder thief |
EP0578880A1 (en) * | 1992-07-14 | 1994-01-19 | General Electric Company | Plated D-shell connector |
Also Published As
Publication number | Publication date |
---|---|
JP3365048B2 (en) | 2003-01-08 |
TW423265B (en) | 2001-02-21 |
KR950035538A (en) | 1995-12-30 |
CN1113069A (en) | 1995-12-06 |
JPH07302970A (en) | 1995-11-14 |
CN1080082C (en) | 2002-02-27 |
GB9508857D0 (en) | 1995-06-21 |
GB2289170A (en) | 1995-11-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20020501 |