JPS6450539A - Connection of electronic component and transfer type microlead faceplate used therefor - Google Patents
Connection of electronic component and transfer type microlead faceplate used thereforInfo
- Publication number
- JPS6450539A JPS6450539A JP20649187A JP20649187A JPS6450539A JP S6450539 A JPS6450539 A JP S6450539A JP 20649187 A JP20649187 A JP 20649187A JP 20649187 A JP20649187 A JP 20649187A JP S6450539 A JPS6450539 A JP S6450539A
- Authority
- JP
- Japan
- Prior art keywords
- lead pieces
- electronic component
- wiring board
- faceplate
- microlead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
PURPOSE:To enable independent small-sized lead pieces to be connected to terminals of electronic component arranged in lattices for solving a problem of thermal stress, by connecting an end of each of the lead pieces reversibly bonded to a faceplate with a bonding pad of the electronic component, separating the lead pieces from the face plate and fixing the other ends of the lead pieces to connecting parts of a wiring board. CONSTITUTION:When bonding pads of an electronic component 13 are electrically connected and fixed to connecting parts of a wiring board 15, a faceplate 8 is first prepared such that flat and curved lead pieces 1 are reversibly bonded thereon corresponding to bonding patterns on the electronic component 13 and to connecting patterns on the wiring board 15. Subsequently, an end of each of said lead pieces 1 is connected to a bonding pad of the electronic component 13. The lead pieces 1 are then separated from the faceplate 8. Then, the other ends of the lead pieces 1 are fixed to the connecting parts of the wiring board 15. In this manner, the bonding pads of the circuit board 13 are connected and fixed to the wiring board 15 through lead pieces 1. For example, each of said lead pieces 1 may be provided with solder dams 2 and 3 at the opposite connecting ends adjacent to the connection terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20649187A JPS6450539A (en) | 1987-08-21 | 1987-08-21 | Connection of electronic component and transfer type microlead faceplate used therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20649187A JPS6450539A (en) | 1987-08-21 | 1987-08-21 | Connection of electronic component and transfer type microlead faceplate used therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6450539A true JPS6450539A (en) | 1989-02-27 |
Family
ID=16524251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20649187A Pending JPS6450539A (en) | 1987-08-21 | 1987-08-21 | Connection of electronic component and transfer type microlead faceplate used therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6450539A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03248786A (en) * | 1990-02-26 | 1991-11-06 | Matsushita Electric Ind Co Ltd | Optical beam heating machine |
US6221749B1 (en) | 1998-09-02 | 2001-04-24 | Shinko Electric Industries Co., Ltd. | Semiconductor device and production thereof |
US6429517B1 (en) | 1998-10-16 | 2002-08-06 | Shinko Electric Industries Co., Ltd | Semiconductor device and fabrication method thereof |
US6836011B2 (en) | 2001-09-07 | 2004-12-28 | Nec Electronics Corporation | Semiconductor chip mounting structure with movable connection electrodes |
JP2006147890A (en) * | 2004-11-22 | 2006-06-08 | Advanced Systems Japan Inc | Spiral contact, and intermetallic joining method using the same |
JP2006216729A (en) * | 2005-02-03 | 2006-08-17 | Fuji Electric Device Technology Co Ltd | Semiconductor device and manufacturing method thereof |
-
1987
- 1987-08-21 JP JP20649187A patent/JPS6450539A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03248786A (en) * | 1990-02-26 | 1991-11-06 | Matsushita Electric Ind Co Ltd | Optical beam heating machine |
US6221749B1 (en) | 1998-09-02 | 2001-04-24 | Shinko Electric Industries Co., Ltd. | Semiconductor device and production thereof |
US6429517B1 (en) | 1998-10-16 | 2002-08-06 | Shinko Electric Industries Co., Ltd | Semiconductor device and fabrication method thereof |
US6836011B2 (en) | 2001-09-07 | 2004-12-28 | Nec Electronics Corporation | Semiconductor chip mounting structure with movable connection electrodes |
US7064015B2 (en) | 2001-09-07 | 2006-06-20 | Nec Electronics Corporation | Semiconductor device and manufacturing method of the same |
JP2006147890A (en) * | 2004-11-22 | 2006-06-08 | Advanced Systems Japan Inc | Spiral contact, and intermetallic joining method using the same |
JP2006216729A (en) * | 2005-02-03 | 2006-08-17 | Fuji Electric Device Technology Co Ltd | Semiconductor device and manufacturing method thereof |
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