JPS6450539A - Connection of electronic component and transfer type microlead faceplate used therefor - Google Patents

Connection of electronic component and transfer type microlead faceplate used therefor

Info

Publication number
JPS6450539A
JPS6450539A JP20649187A JP20649187A JPS6450539A JP S6450539 A JPS6450539 A JP S6450539A JP 20649187 A JP20649187 A JP 20649187A JP 20649187 A JP20649187 A JP 20649187A JP S6450539 A JPS6450539 A JP S6450539A
Authority
JP
Japan
Prior art keywords
lead pieces
electronic component
wiring board
faceplate
microlead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20649187A
Other languages
Japanese (ja)
Inventor
Takanobu Noro
Kunio Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP20649187A priority Critical patent/JPS6450539A/en
Publication of JPS6450539A publication Critical patent/JPS6450539A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Abstract

PURPOSE:To enable independent small-sized lead pieces to be connected to terminals of electronic component arranged in lattices for solving a problem of thermal stress, by connecting an end of each of the lead pieces reversibly bonded to a faceplate with a bonding pad of the electronic component, separating the lead pieces from the face plate and fixing the other ends of the lead pieces to connecting parts of a wiring board. CONSTITUTION:When bonding pads of an electronic component 13 are electrically connected and fixed to connecting parts of a wiring board 15, a faceplate 8 is first prepared such that flat and curved lead pieces 1 are reversibly bonded thereon corresponding to bonding patterns on the electronic component 13 and to connecting patterns on the wiring board 15. Subsequently, an end of each of said lead pieces 1 is connected to a bonding pad of the electronic component 13. The lead pieces 1 are then separated from the faceplate 8. Then, the other ends of the lead pieces 1 are fixed to the connecting parts of the wiring board 15. In this manner, the bonding pads of the circuit board 13 are connected and fixed to the wiring board 15 through lead pieces 1. For example, each of said lead pieces 1 may be provided with solder dams 2 and 3 at the opposite connecting ends adjacent to the connection terminals.
JP20649187A 1987-08-21 1987-08-21 Connection of electronic component and transfer type microlead faceplate used therefor Pending JPS6450539A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20649187A JPS6450539A (en) 1987-08-21 1987-08-21 Connection of electronic component and transfer type microlead faceplate used therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20649187A JPS6450539A (en) 1987-08-21 1987-08-21 Connection of electronic component and transfer type microlead faceplate used therefor

Publications (1)

Publication Number Publication Date
JPS6450539A true JPS6450539A (en) 1989-02-27

Family

ID=16524251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20649187A Pending JPS6450539A (en) 1987-08-21 1987-08-21 Connection of electronic component and transfer type microlead faceplate used therefor

Country Status (1)

Country Link
JP (1) JPS6450539A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03248786A (en) * 1990-02-26 1991-11-06 Matsushita Electric Ind Co Ltd Optical beam heating machine
US6221749B1 (en) 1998-09-02 2001-04-24 Shinko Electric Industries Co., Ltd. Semiconductor device and production thereof
US6429517B1 (en) 1998-10-16 2002-08-06 Shinko Electric Industries Co., Ltd Semiconductor device and fabrication method thereof
US6836011B2 (en) 2001-09-07 2004-12-28 Nec Electronics Corporation Semiconductor chip mounting structure with movable connection electrodes
JP2006147890A (en) * 2004-11-22 2006-06-08 Advanced Systems Japan Inc Spiral contact, and intermetallic joining method using the same
JP2006216729A (en) * 2005-02-03 2006-08-17 Fuji Electric Device Technology Co Ltd Semiconductor device and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03248786A (en) * 1990-02-26 1991-11-06 Matsushita Electric Ind Co Ltd Optical beam heating machine
US6221749B1 (en) 1998-09-02 2001-04-24 Shinko Electric Industries Co., Ltd. Semiconductor device and production thereof
US6429517B1 (en) 1998-10-16 2002-08-06 Shinko Electric Industries Co., Ltd Semiconductor device and fabrication method thereof
US6836011B2 (en) 2001-09-07 2004-12-28 Nec Electronics Corporation Semiconductor chip mounting structure with movable connection electrodes
US7064015B2 (en) 2001-09-07 2006-06-20 Nec Electronics Corporation Semiconductor device and manufacturing method of the same
JP2006147890A (en) * 2004-11-22 2006-06-08 Advanced Systems Japan Inc Spiral contact, and intermetallic joining method using the same
JP2006216729A (en) * 2005-02-03 2006-08-17 Fuji Electric Device Technology Co Ltd Semiconductor device and manufacturing method thereof

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