JPS5645039A - Optical head - Google Patents

Optical head

Info

Publication number
JPS5645039A
JPS5645039A JP10548179A JP10548179A JPS5645039A JP S5645039 A JPS5645039 A JP S5645039A JP 10548179 A JP10548179 A JP 10548179A JP 10548179 A JP10548179 A JP 10548179A JP S5645039 A JPS5645039 A JP S5645039A
Authority
JP
Japan
Prior art keywords
tin
driving circuit
optical head
led array
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10548179A
Other languages
Japanese (ja)
Inventor
Toshiyuki Iwabuchi
Keiji Murasugi
Kazuyoshi Tateishi
Yukio Tokunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Original Assignee
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp, Oki Electric Industry Co Ltd filed Critical Nippon Telegraph and Telephone Corp
Priority to JP10548179A priority Critical patent/JPS5645039A/en
Publication of JPS5645039A publication Critical patent/JPS5645039A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To permit an optical head to be more compact and its assembly to be simplified by unitizing an LED array and a scan driving circuit for it on the same substrate, and using a film provided with lead wirings. CONSTITUTION:A copper foil plated with tin is bonded to an insulating film 11, and given patterns of lead wirings 14a and 14b are formed by selective etching, which are plated with tin. Bumps of gold or tin are provided on the connecting portions of the terminals of an LED array 12 and a scan driving circuit 13, and aligned with the lead wirings before being connected on pressing and heating. Then the film 11 is punched to complete a block 21, and terminals 22 (the lead wiring 14b) of the block 21 is aligned with a lead wiring 32 on a substrate 31, and connected together. At this time, the LED array 12 and the scan driving circuit 13 are connected to lead wirings 33 and 34 on the substrate 31 respectively for purposes of grounding and heat radiation. The constitution permits the terminal processing to be simplified and the optical head to be more compact, so that a higher packaging density is obtained.
JP10548179A 1979-08-21 1979-08-21 Optical head Pending JPS5645039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10548179A JPS5645039A (en) 1979-08-21 1979-08-21 Optical head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10548179A JPS5645039A (en) 1979-08-21 1979-08-21 Optical head

Publications (1)

Publication Number Publication Date
JPS5645039A true JPS5645039A (en) 1981-04-24

Family

ID=14408771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10548179A Pending JPS5645039A (en) 1979-08-21 1979-08-21 Optical head

Country Status (1)

Country Link
JP (1) JPS5645039A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849452U (en) * 1981-09-28 1983-04-04 沖電気工業株式会社 Optical semiconductor array cartridge
JPS6031828A (en) * 1983-08-03 1985-02-18 Toyota Motor Corp Catalyst for purifying exhaust gas and its preparation
JPS6051049U (en) * 1983-09-14 1985-04-10 株式会社リコー optical writing head
JPS618145U (en) * 1984-06-20 1986-01-18 三洋電機株式会社 optical printer head
JPS6125150U (en) * 1984-07-20 1986-02-14 三洋電機株式会社 optical printer head
JPS6240853U (en) * 1985-08-28 1987-03-11
JPS63132432U (en) * 1987-02-20 1988-08-30

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849452U (en) * 1981-09-28 1983-04-04 沖電気工業株式会社 Optical semiconductor array cartridge
JPS6031828A (en) * 1983-08-03 1985-02-18 Toyota Motor Corp Catalyst for purifying exhaust gas and its preparation
JPS6051049U (en) * 1983-09-14 1985-04-10 株式会社リコー optical writing head
JPS618145U (en) * 1984-06-20 1986-01-18 三洋電機株式会社 optical printer head
JPH0436932Y2 (en) * 1984-06-20 1992-08-31
JPS6125150U (en) * 1984-07-20 1986-02-14 三洋電機株式会社 optical printer head
JPH03372Y2 (en) * 1984-07-20 1991-01-09
JPS6240853U (en) * 1985-08-28 1987-03-11
JPS63132432U (en) * 1987-02-20 1988-08-30

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