GB1457805A - Electric circuit modules - Google Patents

Electric circuit modules

Info

Publication number
GB1457805A
GB1457805A GB932574A GB932574A GB1457805A GB 1457805 A GB1457805 A GB 1457805A GB 932574 A GB932574 A GB 932574A GB 932574 A GB932574 A GB 932574A GB 1457805 A GB1457805 A GB 1457805A
Authority
GB
United Kingdom
Prior art keywords
substrate
recesses
component
substrates
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB932574A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Components Ltd
Original Assignee
Mullard Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mullard Ltd filed Critical Mullard Ltd
Priority to GB932574A priority Critical patent/GB1457805A/en
Publication of GB1457805A publication Critical patent/GB1457805A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

1457805 Component assemblies MULLARD Ltd 1 March 1974 9325/74 Heading H1R An electric circuit module (Figs. 1, 2) comprises epoxy resin substrates 1, 2 sealed at their peripheries by epoxy resin adhesive 3 With a third epoxy resin substrate 4 sealed peripherally to substrate 2 with similar adhesive. A surface of substrate 2 is formed with conductor channels 6, component lead channels 7, and component recesses 8 ; the other surface having recesses 11 for component bodies projecting from substrate 1 which is similarly formed butwithouttheexternal or inter-layer contact pins 12, 13 or underlying recesses 11 of substrate 2. Substrate 4 has on its lower surface recesses for projecting component bodies of substrate 2. Conductors 15 are formed in the channels by printing with a silver containing epoxy resin conductive thermosetting adhesive, after which component bodies 10 are placed in recesses 8 with leads 9 located in channels 7 in contact with the conductive adhesive also contacting pins 12, 13. Components and conductors are similarly positioned in substrate 1, to which substrate 2 is sealed with the inter-layer pins extending into conducting adhesive 6, after which the substrates assembly is heat cured. Substrate 4 is sealed on simultaneously or subsequently. In a modification (not shown) conductor arrays are located on substrate 4 and on the opposed surface of substrate 2 with the components located in recesses therein; after which substrates 1, 2, 4 are adhered peripherally together so that the conductors contact the component leads, and the assembly is heat cured. The substrates may be thermoplastic resin adhered mechanically or by ultrasonic welding, the components may be capacitors integrated circuits, transistors or diodes, and heat sinks may be incorporated. The conducting adhesive may be a silver containing acrylic resin, and the conductors may be printed on the substrates, which may be of alloyed, ABS, or polyester resin.
GB932574A 1974-03-01 1974-03-01 Electric circuit modules Expired GB1457805A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB932574A GB1457805A (en) 1974-03-01 1974-03-01 Electric circuit modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB932574A GB1457805A (en) 1974-03-01 1974-03-01 Electric circuit modules

Publications (1)

Publication Number Publication Date
GB1457805A true GB1457805A (en) 1976-12-08

Family

ID=9869787

Family Applications (1)

Application Number Title Priority Date Filing Date
GB932574A Expired GB1457805A (en) 1974-03-01 1974-03-01 Electric circuit modules

Country Status (1)

Country Link
GB (1) GB1457805A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2189350A (en) * 1986-04-16 1987-10-21 Marconi Electronic Devices Printed circuits
US4889962A (en) * 1988-08-19 1989-12-26 Northern Telecom Limited Circuit board with coaxial circuit and method therefor
EP0641153A1 (en) * 1993-08-27 1995-03-01 Poly-Flex Circuits, Inc. Method of making subsurface electronic circuits
WO1999061282A1 (en) * 1998-05-27 1999-12-02 Lear Corporation Trim panel having grooves with integrally formed electrical circuits
EP1303171A2 (en) * 2001-10-11 2003-04-16 Alps Electric Co., Ltd. Electronic circuit unit suitable for miniaturization
WO2004070768A3 (en) * 2003-02-07 2005-04-14 Decoma Int Inc Direct mount led lamp
EP2157369A1 (en) * 2008-08-20 2010-02-24 Noegh Support plate for LED electrical circuit

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2189350A (en) * 1986-04-16 1987-10-21 Marconi Electronic Devices Printed circuits
EP0242020A2 (en) * 1986-04-16 1987-10-21 Marconi Electronic Devices Limited Electrical circuits
EP0242020A3 (en) * 1986-04-16 1989-01-11 Marconi Electronic Devices Limited Electrical circuits
GB2189350B (en) * 1986-04-16 1989-11-29 Marconi Electronic Devices Electrical circuits
US4889962A (en) * 1988-08-19 1989-12-26 Northern Telecom Limited Circuit board with coaxial circuit and method therefor
US5531020A (en) * 1989-11-14 1996-07-02 Poly Flex Circuits, Inc. Method of making subsurface electronic circuits
EP0641153A1 (en) * 1993-08-27 1995-03-01 Poly-Flex Circuits, Inc. Method of making subsurface electronic circuits
WO1999061282A1 (en) * 1998-05-27 1999-12-02 Lear Corporation Trim panel having grooves with integrally formed electrical circuits
US6106303A (en) * 1998-05-27 2000-08-22 Lear Automotive Dearborn, Inc. Trim panel having grooves with integrally formed electrical circuits
EP1303171A2 (en) * 2001-10-11 2003-04-16 Alps Electric Co., Ltd. Electronic circuit unit suitable for miniaturization
EP1303171A3 (en) * 2001-10-11 2005-11-16 Alps Electric Co., Ltd. Electronic circuit unit suitable for miniaturization
WO2004070768A3 (en) * 2003-02-07 2005-04-14 Decoma Int Inc Direct mount led lamp
US7425081B2 (en) 2003-02-07 2008-09-16 Magna International Inc. LED lamp assembly with conductive epoxy LED interconnections
EP2157369A1 (en) * 2008-08-20 2010-02-24 Noegh Support plate for LED electrical circuit
FR2935217A1 (en) * 2008-08-20 2010-02-26 Noech SUPPORT PLATE FOR ELECTRICAL LED CIRCUIT

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee