GB1443028A - Microminiaturized electrical compoennts - Google Patents

Microminiaturized electrical compoennts

Info

Publication number
GB1443028A
GB1443028A GB5031973A GB5031973A GB1443028A GB 1443028 A GB1443028 A GB 1443028A GB 5031973 A GB5031973 A GB 5031973A GB 5031973 A GB5031973 A GB 5031973A GB 1443028 A GB1443028 A GB 1443028A
Authority
GB
United Kingdom
Prior art keywords
recesses
projections
component
housing
housing part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5031973A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1443028A publication Critical patent/GB1443028A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1443028 Semi-conductor devices PHILIPS ELECTRONIC and ASSOCIATED INDUSTRIES Ltd 30 Oct 1973 [2 Nov 1972] 50319/73 Heading H1K An electrical component, e.g. as shown a semiconductor device, comprises a component body 1 to which electrical connection is made by an array of conductors 2 on flexible insulating film 3, or by a lead frame (Fig. 4a, not shown) the foil 3 or frame being located on a first housing part 4 and held by interengagement of housing part 4 and second housing part 7 which completes the enclosure of component body 1 the first and second parts having interlocking projections 5 and recesses 8. The housing parts may comprise synthetic resin material, and part 4 may include a heat sink member, e.g. a copper or aluminium block, on which component 1 sits or is secured by heat conductive adhesive (Fig. 2a, not shown). Component body 1 may be electrically connected to conductor tracks 2 or the lead frame by adhesive or solder. Projections 5 may have thickened portions which snap into conical or part-spherical widenings at the ends of the recesses, and the ends of the projections may be split (Figs. 3a to 3c, not shown). Alternatively (Fig. 3d, not shown) the recesses extend through the thickness of the housing part, the projections extend at least to the ends of the recesses and have heads engaging widenings at the ends of the recesses. As shown the projections 5 pass through holes 6 in foil 3 thus fixing it in position. The assembly may be sealed by synthetic resin around the component and where leads leave the housing, or the housing parts may be fused together.
GB5031973A 1972-11-02 1973-10-30 Microminiaturized electrical compoennts Expired GB1443028A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722253627 DE2253627A1 (en) 1972-11-02 1972-11-02 ELECTRICAL COMPONENT IN MICRO-TECHNOLOGY, PREFERABLY SEMICONDUCTOR COMPONENT

Publications (1)

Publication Number Publication Date
GB1443028A true GB1443028A (en) 1976-07-21

Family

ID=5860646

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5031973A Expired GB1443028A (en) 1972-11-02 1973-10-30 Microminiaturized electrical compoennts

Country Status (6)

Country Link
JP (1) JPS5638060B2 (en)
DE (1) DE2253627A1 (en)
FR (1) FR2205745B1 (en)
GB (1) GB1443028A (en)
IT (1) IT996899B (en)
NL (1) NL7314802A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036371A1 (en) * 1979-09-27 1981-04-16 Hybrid Systems Corp., Bedford, Mass. HYBRID GEAR PACK
DE3212903A1 (en) * 1981-04-13 1982-11-11 SGS-ATES Componenti Elettronici S.p.A., 20041 Agrate Brianza, Milano METHOD FOR PRODUCING PLASTIC HOUSINGS WITH BUILT-IN HEAT ARRESTER FOR INTEGRATED CIRCUITS AND COMBINATION OF MOLDING TOOL AND HEAT ARRESTER SUITABLE FOR IMPLEMENTING THE METHOD
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
EP3300104A4 (en) * 2015-05-20 2019-01-09 Kyocera Corporation Semiconductor element package, semiconductor device, and mounting structure

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272466U (en) * 1975-11-26 1977-05-30
NL7713758A (en) * 1977-12-13 1979-06-15 Philips Nv SEMI-GUIDE DEVICE.
DE2942261A1 (en) * 1979-10-19 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Encapsulated semiconductor device on support plate - has semiconductor element soldered between perforated plate and supply electrode and is encapsulated
DE3138743A1 (en) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Surface acoustic wave filter and the like, mounted in a tight casing
US5072283A (en) * 1988-04-12 1991-12-10 Bolger Justin C Pre-formed chip carrier cavity package
GB2236213A (en) * 1989-09-09 1991-03-27 Ibm Integral protective enclosure for an assembly mounted on a flexible printed circuit board
DE4224103A1 (en) * 1992-07-22 1994-01-27 Manfred Dr Ing Michalk Miniature housing with electronic components
US8058719B2 (en) 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads
US8018042B2 (en) 2007-03-23 2011-09-13 Microsemi Corporation Integrated circuit with flexible planar leads

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816345B1 (en) * 1967-06-09 1973-05-21
JPS476963U (en) * 1971-02-13 1972-09-25
JPS4816345U (en) * 1971-07-02 1973-02-23

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036371A1 (en) * 1979-09-27 1981-04-16 Hybrid Systems Corp., Bedford, Mass. HYBRID GEAR PACK
DE3212903A1 (en) * 1981-04-13 1982-11-11 SGS-ATES Componenti Elettronici S.p.A., 20041 Agrate Brianza, Milano METHOD FOR PRODUCING PLASTIC HOUSINGS WITH BUILT-IN HEAT ARRESTER FOR INTEGRATED CIRCUITS AND COMBINATION OF MOLDING TOOL AND HEAT ARRESTER SUITABLE FOR IMPLEMENTING THE METHOD
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
WO2002060810A3 (en) * 2001-01-30 2003-09-04 Univ Sheffield Micro-element substrate interconnection
EP3300104A4 (en) * 2015-05-20 2019-01-09 Kyocera Corporation Semiconductor element package, semiconductor device, and mounting structure

Also Published As

Publication number Publication date
FR2205745A1 (en) 1974-05-31
JPS5638060B2 (en) 1981-09-03
DE2253627A1 (en) 1974-05-16
FR2205745B1 (en) 1978-08-11
IT996899B (en) 1975-12-10
NL7314802A (en) 1974-05-06
JPS4977172A (en) 1974-07-25

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee