GB1257418A - - Google Patents
Info
- Publication number
- GB1257418A GB1257418A GB1257418DA GB1257418A GB 1257418 A GB1257418 A GB 1257418A GB 1257418D A GB1257418D A GB 1257418DA GB 1257418 A GB1257418 A GB 1257418A
- Authority
- GB
- United Kingdom
- Prior art keywords
- contact elements
- contact
- carrier
- tongues
- network
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
1,257,418. Capacitors. SIEMENS A.G. 26 March, 1970 [28 March, 1969], No. 14706/70. Heading H2E. For making multiple electrical connection between, e.g. contact areas 5 on module 1 and contact areas 6 on wiring board 3, a disconnectible connection device comprises contact elements 7 supported by and extending through insulating carrier 8 flexible perpendicular to its plane, the current path length provided by contact elements 7 being 1 mm. or less. The assembly may be held together by screws (Fig. 1, not shown). The contact elements may comprise metal balls supported in holes in carrier 8. Alternatively, carrier 8 may comprise a network of strands of elastomeric material, the network being thickened, e.g. at intersections, and the thickened portions metallized to form the contact elements (Fig. 4, not shown). Certain bridging portions of the network may also be metallized. The contact elements may alternatively consist of spring plates of, e.g. beryllium bronze with tongues bent to either side of the carrier and the tongues may be coated with gold. Instead of being bent the tongues may carry contact pips. In a method of making a connection device, an array of slotted spring plates11 is punched from a thin sheet 14 with bridging portions 17 between each plate, insulating foil 15 is laminated to each side of the sheet openings 16 in the foils registering with the parts 12 of the spring plates produced by the slotting. Bridging portions' 17 may be removed. For use as a coaxial connector, a central contact element is surrounded by a ring of electrically interconnected contact elements.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691916160 DE1916160C (en) | 1969-03-28 | Detachable electrical contacts between micro-assemblies and / or wiring boards |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1257418A true GB1257418A (en) | 1971-12-15 |
Family
ID=5729704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1257418D Expired GB1257418A (en) | 1969-03-28 | 1970-03-26 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3634807A (en) |
BE (1) | BE748115A (en) |
FR (1) | FR2035959A1 (en) |
GB (1) | GB1257418A (en) |
LU (1) | LU60609A1 (en) |
NL (1) | NL7003475A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2225904A (en) * | 1988-11-23 | 1990-06-13 | Amphenol Corp | Filtered electrical contact |
Families Citing this family (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1387587A (en) * | 1971-07-22 | 1975-03-19 | Plessey Co Ltd | Electrical interconnectors and connector assemblies |
US3868676A (en) * | 1971-11-24 | 1975-02-25 | Burroughs Corp | Display panel electrode termination |
US3881799A (en) * | 1972-09-11 | 1975-05-06 | George H Elliott | Resilient multi-micro point metallic junction |
US4774760A (en) * | 1986-05-05 | 1988-10-04 | International Business Machines Corporation | Method of making a multipad solder preform |
US5185073A (en) * | 1988-06-21 | 1993-02-09 | International Business Machines Corporation | Method of fabricating nendritic materials |
US5137461A (en) * | 1988-06-21 | 1992-08-11 | International Business Machines Corporation | Separable electrical connection technology |
FR2643753A1 (en) * | 1989-02-28 | 1990-08-31 | Commissariat Energie Atomique | Method of interconnecting electrical components by means of deformable and substantially spherical conducting elements |
US4954878A (en) * | 1989-06-29 | 1990-09-04 | Digital Equipment Corp. | Method of packaging and powering integrated circuit chips and the chip assembly formed thereby |
US5015191A (en) * | 1990-03-05 | 1991-05-14 | Amp Incorporated | Flat IC chip connector |
US5118299A (en) * | 1990-05-07 | 1992-06-02 | International Business Machines Corporation | Cone electrical contact |
JP2673993B2 (en) * | 1990-07-02 | 1997-11-05 | 日本無線株式会社 | Surface acoustic wave device |
US5105537A (en) * | 1990-10-12 | 1992-04-21 | International Business Machines Corporation | Method for making a detachable electrical contact |
US5207585A (en) * | 1990-10-31 | 1993-05-04 | International Business Machines Corporation | Thin interface pellicle for dense arrays of electrical interconnects |
JPH04170811A (en) * | 1990-11-05 | 1992-06-18 | Fujitsu Ltd | Surface acoustic wave device |
US5163834A (en) * | 1990-12-17 | 1992-11-17 | International Business Machines Corporation | High density connector |
US5363038A (en) * | 1992-08-12 | 1994-11-08 | Fujitsu Limited | Method and apparatus for testing an unpopulated chip carrier using a module test card |
US5477160A (en) * | 1992-08-12 | 1995-12-19 | Fujitsu Limited | Module test card |
US5297967A (en) * | 1992-10-13 | 1994-03-29 | International Business Machines Corporation | Electrical interconnector with helical contacting portion and assembly using same |
US5321583A (en) * | 1992-12-02 | 1994-06-14 | Intel Corporation | Electrically conductive interposer and array package concept for interconnecting to a circuit board |
US6232789B1 (en) * | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
US5914613A (en) * | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US5949246A (en) * | 1997-01-28 | 1999-09-07 | International Business Machines | Test head for applying signals in a burn-in test of an integrated circuit |
US6036502A (en) * | 1997-11-03 | 2000-03-14 | Intercon Systems, Inc. | Flexible circuit compression connector system and method of manufacture |
US6027346A (en) * | 1998-06-29 | 2000-02-22 | Xandex, Inc. | Membrane-supported contactor for semiconductor test |
US6256882B1 (en) * | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6345989B1 (en) * | 1999-01-06 | 2002-02-12 | Thomas & Betts International, Inc. | Circuit board side interconnect |
US6194669B1 (en) * | 1999-02-05 | 2001-02-27 | Trw Inc. | Solder ball grid array for connecting multiple millimeter wave assemblies |
US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
US7262611B2 (en) * | 2000-03-17 | 2007-08-28 | Formfactor, Inc. | Apparatuses and methods for planarizing a semiconductor contactor |
JP2001319718A (en) | 2000-05-02 | 2001-11-16 | Fci Japan Kk | Connector |
DE20114544U1 (en) | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | wafer probe |
GB2370428B (en) * | 2000-12-21 | 2004-11-10 | Nokia Mobile Phones Ltd | A connector |
AU2002327490A1 (en) * | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
KR100864916B1 (en) * | 2002-05-23 | 2008-10-22 | 캐스케이드 마이크로테크 인코포레이티드 | Probe for testing a device under test |
US6724205B1 (en) * | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
US7014479B2 (en) * | 2003-03-24 | 2006-03-21 | Che-Yu Li | Electrical contact and connector and method of manufacture |
US7244125B2 (en) * | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
US7056131B1 (en) * | 2003-04-11 | 2006-06-06 | Neoconix, Inc. | Contact grid array system |
US7628617B2 (en) * | 2003-06-11 | 2009-12-08 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US20100167561A1 (en) * | 2003-04-11 | 2010-07-01 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US6916181B2 (en) * | 2003-06-11 | 2005-07-12 | Neoconix, Inc. | Remountable connector for land grid array packages |
US20050120553A1 (en) * | 2003-12-08 | 2005-06-09 | Brown Dirk D. | Method for forming MEMS grid array connector |
US7113408B2 (en) * | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
US8584353B2 (en) * | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
US7758351B2 (en) * | 2003-04-11 | 2010-07-20 | Neoconix, Inc. | Method and system for batch manufacturing of spring elements |
US7114961B2 (en) * | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
US20070020960A1 (en) * | 2003-04-11 | 2007-01-25 | Williams John D | Contact grid array system |
US7597561B2 (en) * | 2003-04-11 | 2009-10-06 | Neoconix, Inc. | Method and system for batch forming spring elements in three dimensions |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US7070419B2 (en) * | 2003-06-11 | 2006-07-04 | Neoconix Inc. | Land grid array connector including heterogeneous contact elements |
US6869290B2 (en) * | 2003-06-11 | 2005-03-22 | Neoconix, Inc. | Circuitized connector for land grid array |
WO2006017078A2 (en) * | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
US20050227510A1 (en) * | 2004-04-09 | 2005-10-13 | Brown Dirk D | Small array contact with precision working range |
JP2007517231A (en) * | 2003-12-24 | 2007-06-28 | カスケード マイクロテック インコーポレイテッド | Active wafer probe |
US20050205988A1 (en) * | 2004-03-19 | 2005-09-22 | Epic Technology Inc. | Die package with higher useable die contact pad area |
US7347698B2 (en) * | 2004-03-19 | 2008-03-25 | Neoconix, Inc. | Deep drawn electrical contacts and method for making |
US7025601B2 (en) * | 2004-03-19 | 2006-04-11 | Neoconix, Inc. | Interposer and method for making same |
US7090503B2 (en) * | 2004-03-19 | 2006-08-15 | Neoconix, Inc. | Interposer with compliant pins |
US7383632B2 (en) * | 2004-03-19 | 2008-06-10 | Neoconix, Inc. | Method for fabricating a connector |
US20060000642A1 (en) * | 2004-07-01 | 2006-01-05 | Epic Technology Inc. | Interposer with compliant pins |
US7354276B2 (en) * | 2004-07-20 | 2008-04-08 | Neoconix, Inc. | Interposer with compliant pins |
KR20070058522A (en) * | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | Double sided probing structures |
WO2006050395A2 (en) * | 2004-11-02 | 2006-05-11 | Umech Technologies, Co. | Optically enhanced digital imaging system |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7535247B2 (en) * | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
JP5080459B2 (en) * | 2005-06-13 | 2012-11-21 | カスケード マイクロテック インコーポレイテッド | Wideband active / passive differential signal probe |
US20070050738A1 (en) * | 2005-08-31 | 2007-03-01 | Dittmann Larry E | Customer designed interposer |
US7357644B2 (en) * | 2005-12-12 | 2008-04-15 | Neoconix, Inc. | Connector having staggered contact architecture for enhanced working range |
US7609077B2 (en) | 2006-06-09 | 2009-10-27 | Cascade Microtech, Inc. | Differential signal probe with integral balun |
US7403028B2 (en) * | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7443186B2 (en) * | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
US7764072B2 (en) * | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7723999B2 (en) * | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7876114B2 (en) * | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7888957B2 (en) * | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US8410806B2 (en) * | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
US9653194B2 (en) * | 2013-08-12 | 2017-05-16 | Te Connectivity Corporation | Low resistance insert |
US20190273351A1 (en) * | 2018-03-02 | 2019-09-05 | Mersen Usa Newburyport-Ma, Llc | Electrical connector |
US11134562B2 (en) | 2019-03-29 | 2021-09-28 | International Business Machines Corporation | Chip interconnect devices |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2854552A (en) * | 1955-12-27 | 1958-09-30 | Illinois Tool Works | Switch means for printed circuits |
GB924358A (en) * | 1959-10-02 | 1963-04-24 | Siemens Ag | Plug-in contact device for a plate carrying circuit components |
US3105729A (en) * | 1960-04-01 | 1963-10-01 | Rosenthal Herbert | Electrical connecting apparatus |
US3197766A (en) * | 1962-03-08 | 1965-07-27 | Control Data Corp | Stacked circuit boards |
US3235829A (en) * | 1963-05-29 | 1966-02-15 | Crown Design & Mfg Corp | Encapsulated terminal board connector |
-
1970
- 1970-03-11 NL NL7003475A patent/NL7003475A/xx unknown
- 1970-03-19 US US21118A patent/US3634807A/en not_active Expired - Lifetime
- 1970-03-25 FR FR7010744A patent/FR2035959A1/fr not_active Withdrawn
- 1970-03-26 GB GB1257418D patent/GB1257418A/en not_active Expired
- 1970-03-26 LU LU60609D patent/LU60609A1/xx unknown
- 1970-03-27 BE BE748115D patent/BE748115A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2225904A (en) * | 1988-11-23 | 1990-06-13 | Amphenol Corp | Filtered electrical contact |
US5011434A (en) * | 1988-11-23 | 1991-04-30 | Amphenol Corporation | Filtered electrical connector |
GB2225904B (en) * | 1988-11-23 | 1992-12-23 | Amphenol Corp | Filter contact for an electrical connector |
Also Published As
Publication number | Publication date |
---|---|
DE1916160B2 (en) | 1972-11-02 |
US3634807A (en) | 1972-01-11 |
NL7003475A (en) | 1970-09-30 |
FR2035959A1 (en) | 1970-12-24 |
DE1916160A1 (en) | 1970-10-08 |
BE748115A (en) | 1970-09-28 |
LU60609A1 (en) | 1970-05-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PLNP | Patent lapsed through nonpayment of renewal fees |