GB1257418A - - Google Patents

Info

Publication number
GB1257418A
GB1257418A GB1257418DA GB1257418A GB 1257418 A GB1257418 A GB 1257418A GB 1257418D A GB1257418D A GB 1257418DA GB 1257418 A GB1257418 A GB 1257418A
Authority
GB
United Kingdom
Prior art keywords
contact elements
carrier
contact
tongues
network
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19691916160 priority Critical patent/DE1916160B2/en
Application filed filed Critical
Publication of GB1257418A publication Critical patent/GB1257418A/en
Application status is Expired legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7082Coupling device supported only by cooperation with PCB
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1,257,418. Capacitors. SIEMENS A.G. 26 March, 1970 [28 March, 1969], No. 14706/70. Heading H2E. For making multiple electrical connection between, e.g. contact areas 5 on module 1 and contact areas 6 on wiring board 3, a disconnectible connection device comprises contact elements 7 supported by and extending through insulating carrier 8 flexible perpendicular to its plane, the current path length provided by contact elements 7 being 1 mm. or less. The assembly may be held together by screws (Fig. 1, not shown). The contact elements may comprise metal balls supported in holes in carrier 8. Alternatively, carrier 8 may comprise a network of strands of elastomeric material, the network being thickened, e.g. at intersections, and the thickened portions metallized to form the contact elements (Fig. 4, not shown). Certain bridging portions of the network may also be metallized. The contact elements may alternatively consist of spring plates of, e.g. beryllium bronze with tongues bent to either side of the carrier and the tongues may be coated with gold. Instead of being bent the tongues may carry contact pips. In a method of making a connection device, an array of slotted spring plates11 is punched from a thin sheet 14 with bridging portions 17 between each plate, insulating foil 15 is laminated to each side of the sheet openings 16 in the foils registering with the parts 12 of the spring plates produced by the slotting. Bridging portions' 17 may be removed. For use as a coaxial connector, a central contact element is surrounded by a ring of electrically interconnected contact elements.
GB1257418D 1969-03-28 1970-03-26 Expired GB1257418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19691916160 DE1916160B2 (en) 1969-03-28 1969-03-28 Releasable electrical contacts between micro-assemblies and / or wiring boards

Publications (1)

Publication Number Publication Date
GB1257418A true GB1257418A (en) 1971-12-15

Family

ID=5729704

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1257418D Expired GB1257418A (en) 1969-03-28 1970-03-26

Country Status (7)

Country Link
US (1) US3634807A (en)
BE (1) BE748115A (en)
DE (1) DE1916160B2 (en)
FR (1) FR2035959A1 (en)
GB (1) GB1257418A (en)
LU (1) LU60609A1 (en)
NL (1) NL7003475A (en)

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GB2225904A (en) * 1988-11-23 1990-06-13 Amphenol Corp Filtered electrical contact

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US3868676A (en) * 1971-11-24 1975-02-25 Burroughs Corp Display panel electrode termination
US3881799A (en) * 1972-09-11 1975-05-06 George H Elliott Resilient multi-micro point metallic junction
US4774760A (en) * 1986-05-05 1988-10-04 International Business Machines Corporation Method of making a multipad solder preform
US5185073A (en) * 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
FR2643753A1 (en) * 1989-02-28 1990-08-31 Commissariat Energie Atomique Method of interconnecting electrical components by means of deformable and substantially spherical conducting elements
US4954878A (en) * 1989-06-29 1990-09-04 Digital Equipment Corp. Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
US5015191A (en) * 1990-03-05 1991-05-14 Amp Incorporated Flat IC chip connector
US5118299A (en) * 1990-05-07 1992-06-02 International Business Machines Corporation Cone electrical contact
JP2673993B2 (en) * 1990-07-02 1997-11-05 日本無線株式会社 Surface acoustic wave device
US5105537A (en) * 1990-10-12 1992-04-21 International Business Machines Corporation Method for making a detachable electrical contact
US5207585A (en) * 1990-10-31 1993-05-04 International Business Machines Corporation Thin interface pellicle for dense arrays of electrical interconnects
JPH04170811K1 (en) * 1990-11-05 1992-06-18
US5163834A (en) * 1990-12-17 1992-11-17 International Business Machines Corporation High density connector
US5477160A (en) * 1992-08-12 1995-12-19 Fujitsu Limited Module test card
US5363038A (en) * 1992-08-12 1994-11-08 Fujitsu Limited Method and apparatus for testing an unpopulated chip carrier using a module test card
US5297967A (en) * 1992-10-13 1994-03-29 International Business Machines Corporation Electrical interconnector with helical contacting portion and assembly using same
US5321583A (en) * 1992-12-02 1994-06-14 Intel Corporation Electrically conductive interposer and array package concept for interconnecting to a circuit board
US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
DE19647229C1 (en) * 1996-11-15 1998-02-12 Telefunken Microelectron Plate type component carrier to component carrier connector device for e.g. circuit board
US5949246A (en) * 1997-01-28 1999-09-07 International Business Machines Test head for applying signals in a burn-in test of an integrated circuit
US6232789B1 (en) * 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US6036502A (en) * 1997-11-03 2000-03-14 Intercon Systems, Inc. Flexible circuit compression connector system and method of manufacture
US6027346A (en) * 1998-06-29 2000-02-22 Xandex, Inc. Membrane-supported contactor for semiconductor test
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6345989B1 (en) * 1999-01-06 2002-02-12 Thomas & Betts International, Inc. Circuit board side interconnect
US6194669B1 (en) * 1999-02-05 2001-02-27 Trw Inc. Solder ball grid array for connecting multiple millimeter wave assemblies
US6578264B1 (en) * 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
JP2001319718A (en) 2000-05-02 2001-11-16 Fci Japan Kk Connector
DE10143173A1 (en) * 2000-12-04 2002-06-06 Cascade Microtech Inc Wafer probe has contact finger array with impedance matching network suitable for wide band
GB2370428B (en) * 2000-12-21 2004-11-10 Nokia Mobile Phones Ltd A connector
WO2003052435A1 (en) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Membrane probing system
US6815963B2 (en) 2002-05-23 2004-11-09 Cascade Microtech, Inc. Probe for testing a device under test
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7014479B2 (en) * 2003-03-24 2006-03-21 Che-Yu Li Electrical contact and connector and method of manufacture
US20050227510A1 (en) * 2004-04-09 2005-10-13 Brown Dirk D Small array contact with precision working range
US20100167561A1 (en) * 2003-04-11 2010-07-01 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7056131B1 (en) 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US7628617B2 (en) * 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7758351B2 (en) * 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US7597561B2 (en) * 2003-04-11 2009-10-06 Neoconix, Inc. Method and system for batch forming spring elements in three dimensions
US20070020960A1 (en) * 2003-04-11 2007-01-25 Williams John D Contact grid array system
US8584353B2 (en) * 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7070419B2 (en) * 2003-06-11 2006-07-04 Neoconix Inc. Land grid array connector including heterogeneous contact elements
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US6916181B2 (en) * 2003-06-11 2005-07-12 Neoconix, Inc. Remountable connector for land grid array packages
US6869290B2 (en) * 2003-06-11 2005-03-22 Neoconix, Inc. Circuitized connector for land grid array
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US20050120553A1 (en) * 2003-12-08 2005-06-09 Brown Dirk D. Method for forming MEMS grid array connector
GB2425844B (en) * 2003-12-24 2007-07-11 Cascade Microtech Inc Active wafer probe
US7354276B2 (en) * 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
TWI309094B (en) * 2004-03-19 2009-04-21 Neoconix Inc Electrical connector in a flexible host and method for fabricating the same
US7090503B2 (en) * 2004-03-19 2006-08-15 Neoconix, Inc. Interposer with compliant pins
US7025601B2 (en) * 2004-03-19 2006-04-11 Neoconix, Inc. Interposer and method for making same
US7347698B2 (en) * 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
US20050205988A1 (en) * 2004-03-19 2005-09-22 Epic Technology Inc. Die package with higher useable die contact pad area
US20060000642A1 (en) * 2004-07-01 2006-01-05 Epic Technology Inc. Interposer with compliant pins
CA2570886A1 (en) * 2004-07-07 2006-02-16 Cascade Microtech, Inc. Probe head having a membrane suspended probe
JP2008512680A (en) * 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッドCascade Microtech,Incorporated Double-sided probing structure
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US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
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US20070050738A1 (en) * 2005-08-31 2007-03-01 Dittmann Larry E Customer designed interposer
US7357644B2 (en) * 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
WO2007146285A2 (en) 2006-06-09 2007-12-21 Cascade Microtech, Inc. Differential signal probe with integral balun
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) * 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) * 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7764072B2 (en) * 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7876114B2 (en) * 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) * 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) * 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
DE102009028744A1 (en) * 2009-08-20 2011-03-31 Semikron Elektronik Gmbh & Co. Kg Method for producing an electrical connection between printed circuit boards
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
US9653194B2 (en) * 2013-08-12 2017-05-16 Te Connectivity Corporation Low resistance insert

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US2854552A (en) * 1955-12-27 1958-09-30 Illinois Tool Works Switch means for printed circuits
GB924358A (en) * 1959-10-02 1963-04-24 Siemens Ag Plug-in contact device for a plate carrying circuit components
US3105729A (en) * 1960-04-01 1963-10-01 Rosenthal Herbert Electrical connecting apparatus
US3197766A (en) * 1962-03-08 1965-07-27 Control Data Corp Stacked circuit boards
US3235829A (en) * 1963-05-29 1966-02-15 Crown Design & Mfg Corp Encapsulated terminal board connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2225904A (en) * 1988-11-23 1990-06-13 Amphenol Corp Filtered electrical contact
US5011434A (en) * 1988-11-23 1991-04-30 Amphenol Corporation Filtered electrical connector
GB2225904B (en) * 1988-11-23 1992-12-23 Amphenol Corp Filter contact for an electrical connector

Also Published As

Publication number Publication date
US3634807A (en) 1972-01-11
BE748115A1 (en)
FR2035959A1 (en) 1970-12-24
DE1916160B2 (en) 1972-11-02
LU60609A1 (en) 1970-05-26
DE1916160A1 (en) 1970-10-08
NL7003475A (en) 1970-09-30
BE748115A (en) 1970-09-28

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees