JPS5774166A - Array head of light emitting diode - Google Patents
Array head of light emitting diodeInfo
- Publication number
- JPS5774166A JPS5774166A JP55150796A JP15079680A JPS5774166A JP S5774166 A JPS5774166 A JP S5774166A JP 55150796 A JP55150796 A JP 55150796A JP 15079680 A JP15079680 A JP 15079680A JP S5774166 A JPS5774166 A JP S5774166A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- array
- light emitting
- wires
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Led Device Packages (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
Abstract
PURPOSE: To provide an LED array head which can eliminate the reverse operation of an input signal with simple assembling by providing a wire on the back surface of an insulator placing the array.
CONSTITUTION: The first wires 36, 27, 38 are formed directly on an insulating substrate 31. An insulator 39 is formed on the wire 36 except both ends, and the second wires 40W43 are formed thereon. An LED array 32 is placed on the wire 40, and drive ICs 32, 34 are place on the wires 42, 37. The wire 36 extends to the opposite side of the array 32 from one side placed with drive ICs 33, 34. This wire 36 connects a light emitting unit of, for example, odd number of the array 32 mounted with a terminal at the opposite side to the terminal of the IC 34, and the wires 44, 45 connect both terminals to the wire 36. The wire 41 connects the light emitting unit of, for example, even number of the array 32 to the wire 46, which is connected via the wire 47 to the IC 33.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55150796A JPS5774166A (en) | 1980-10-29 | 1980-10-29 | Array head of light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55150796A JPS5774166A (en) | 1980-10-29 | 1980-10-29 | Array head of light emitting diode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5774166A true JPS5774166A (en) | 1982-05-10 |
JPS612509B2 JPS612509B2 (en) | 1986-01-25 |
Family
ID=15504614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55150796A Granted JPS5774166A (en) | 1980-10-29 | 1980-10-29 | Array head of light emitting diode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5774166A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58110268A (en) * | 1981-12-25 | 1983-06-30 | Minolta Camera Co Ltd | Controller for electrostatic recorder |
JPS58111981A (en) * | 1981-12-25 | 1983-07-04 | ミノルタ株式会社 | Luminous segment driving circuit |
JPS5990975A (en) * | 1982-11-17 | 1984-05-25 | Sanyo Electric Co Ltd | Assembly of light-emitting diode |
JPS6019565A (en) * | 1983-07-13 | 1985-01-31 | Sanyo Electric Co Ltd | Luminous head for printing |
JPS6083463A (en) * | 1983-10-13 | 1985-05-11 | Nec Corp | Light source for original reading |
JPS60263483A (en) * | 1984-06-12 | 1985-12-26 | Sanyo Electric Co Ltd | Light-emitting diode aligned material |
WO1986002045A1 (en) * | 1984-09-27 | 1986-04-10 | Sanyo Electric Co., Ltd. | Optical printing head for optical printing apparatus |
JPS61145877A (en) * | 1984-12-19 | 1986-07-03 | Mitsubishi Electric Corp | Led array head |
JPS61147584A (en) * | 1984-12-20 | 1986-07-05 | Mitsubishi Electric Corp | Light-emitting diode array head |
JPS61211063A (en) * | 1985-03-15 | 1986-09-19 | Kyocera Corp | Optical printing head |
JPS62219583A (en) * | 1986-03-20 | 1987-09-26 | Kyocera Corp | Photo printer head |
JPS62261465A (en) * | 1986-05-08 | 1987-11-13 | Mitsubishi Electric Corp | Optical printer head |
-
1980
- 1980-10-29 JP JP55150796A patent/JPS5774166A/en active Granted
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58111981A (en) * | 1981-12-25 | 1983-07-04 | ミノルタ株式会社 | Luminous segment driving circuit |
JPS58110268A (en) * | 1981-12-25 | 1983-06-30 | Minolta Camera Co Ltd | Controller for electrostatic recorder |
JPH0444435B2 (en) * | 1982-11-17 | 1992-07-21 | Sanyo Denki Kk | |
JPS5990975A (en) * | 1982-11-17 | 1984-05-25 | Sanyo Electric Co Ltd | Assembly of light-emitting diode |
JPS6019565A (en) * | 1983-07-13 | 1985-01-31 | Sanyo Electric Co Ltd | Luminous head for printing |
JPH0526663B2 (en) * | 1983-07-13 | 1993-04-16 | Sanyo Denki Kk | |
JPS6083463A (en) * | 1983-10-13 | 1985-05-11 | Nec Corp | Light source for original reading |
JPS60263483A (en) * | 1984-06-12 | 1985-12-26 | Sanyo Electric Co Ltd | Light-emitting diode aligned material |
WO1986002045A1 (en) * | 1984-09-27 | 1986-04-10 | Sanyo Electric Co., Ltd. | Optical printing head for optical printing apparatus |
JPH0825302B1 (en) * | 1984-09-27 | 1996-03-13 | Sanyo Denki Kk | |
JPS61145877A (en) * | 1984-12-19 | 1986-07-03 | Mitsubishi Electric Corp | Led array head |
JPS61147584A (en) * | 1984-12-20 | 1986-07-05 | Mitsubishi Electric Corp | Light-emitting diode array head |
JPS61211063A (en) * | 1985-03-15 | 1986-09-19 | Kyocera Corp | Optical printing head |
JPS62219583A (en) * | 1986-03-20 | 1987-09-26 | Kyocera Corp | Photo printer head |
JPS62261465A (en) * | 1986-05-08 | 1987-11-13 | Mitsubishi Electric Corp | Optical printer head |
Also Published As
Publication number | Publication date |
---|---|
JPS612509B2 (en) | 1986-01-25 |
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