JPS6435941A - Semiconductor device with window for light transmission - Google Patents
Semiconductor device with window for light transmissionInfo
- Publication number
- JPS6435941A JPS6435941A JP19169387A JP19169387A JPS6435941A JP S6435941 A JPS6435941 A JP S6435941A JP 19169387 A JP19169387 A JP 19169387A JP 19169387 A JP19169387 A JP 19169387A JP S6435941 A JPS6435941 A JP S6435941A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- fluctuation
- located under
- wall
- generate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To suppress the fluctuation of electrical characteristics essential as a device and to contrive the improvement of the reliability of the device by a method wherein a function element easy to generate the fluctuation of its characteristics is arranged on the surface region other than a part, which is located under a circumferential wall, of the surface of a chip. CONSTITUTION:A circumferential wall 3 is formed on the surface of a chip 2 containing a photodetector in such a way as to encircle the element, and is covered with a light-transmitting window material 4. The chip 2 is die-bonded on a lead frame, bonding pads, the lead frame are electrically connected to each other, and the whole is resin-sealed. In this case, a functional element easy to generate the fluctuation of its characteristics is arranged on the part other than a part, which is located under the wall, of the surface of the chip. That is, by arranging the functional element, which is easy to generate the fluctuation of its characteristics, on the part other than a part, which is located under the wall, of the chip surface, a stress to concentrate on the part, which is located under the wall, of the chip surface can be prevented from extending to the functional element. Thereby, an electrical stability essential as a device can be reliably held.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19169387A JPS6435941A (en) | 1987-07-30 | 1987-07-30 | Semiconductor device with window for light transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19169387A JPS6435941A (en) | 1987-07-30 | 1987-07-30 | Semiconductor device with window for light transmission |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6435941A true JPS6435941A (en) | 1989-02-07 |
Family
ID=16278893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19169387A Pending JPS6435941A (en) | 1987-07-30 | 1987-07-30 | Semiconductor device with window for light transmission |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6435941A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH073618A (en) * | 1993-06-18 | 1995-01-06 | Nikkiso Co Ltd | Finishing template of stocking |
| US6906405B2 (en) * | 2001-01-10 | 2005-06-14 | Canon Kabushiki Kaisha | Electronic part and its manufacturing method |
-
1987
- 1987-07-30 JP JP19169387A patent/JPS6435941A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH073618A (en) * | 1993-06-18 | 1995-01-06 | Nikkiso Co Ltd | Finishing template of stocking |
| US6906405B2 (en) * | 2001-01-10 | 2005-06-14 | Canon Kabushiki Kaisha | Electronic part and its manufacturing method |
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