JPS5768088A - Photosemiconductor device - Google Patents

Photosemiconductor device

Info

Publication number
JPS5768088A
JPS5768088A JP55143924A JP14392480A JPS5768088A JP S5768088 A JPS5768088 A JP S5768088A JP 55143924 A JP55143924 A JP 55143924A JP 14392480 A JP14392480 A JP 14392480A JP S5768088 A JPS5768088 A JP S5768088A
Authority
JP
Japan
Prior art keywords
enclosure
substrate
adherence
lead
outer periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55143924A
Other languages
Japanese (ja)
Inventor
Yoshio Arima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55143924A priority Critical patent/JPS5768088A/en
Publication of JPS5768088A publication Critical patent/JPS5768088A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To improve the adherence between a supporting substrate and an enclosure by forming the bonding surface of both the substrate and the enclosure in recessed or projected structure. CONSTITUTION:Leads 12, 13 are secured to a ceramic supporting substrate 15, light emitting element or photodetector 11 are mounted at the end of a lead 12, and the end of the lead 13 is connected via a wire 14. A recess 17a is formed on the upper outer periphery of a substrate 15, and a projected part 17b is formed on the lower outer periphery of the enclosure 6 to engaged. Accordingly, the adherence can be extremely preferably improved.
JP55143924A 1980-10-15 1980-10-15 Photosemiconductor device Pending JPS5768088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55143924A JPS5768088A (en) 1980-10-15 1980-10-15 Photosemiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55143924A JPS5768088A (en) 1980-10-15 1980-10-15 Photosemiconductor device

Publications (1)

Publication Number Publication Date
JPS5768088A true JPS5768088A (en) 1982-04-26

Family

ID=15350257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55143924A Pending JPS5768088A (en) 1980-10-15 1980-10-15 Photosemiconductor device

Country Status (1)

Country Link
JP (1) JPS5768088A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236061U (en) * 1988-09-02 1990-03-08
US5567972A (en) * 1993-11-05 1996-10-22 Oki Electric Industry Co., Ltd. Optical element mounted on a base having a capacitor imbedded therein
US6677614B1 (en) * 1992-12-17 2004-01-13 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device
US6808950B2 (en) * 1992-12-17 2004-10-26 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124199U (en) * 1975-04-25 1976-02-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124199U (en) * 1975-04-25 1976-02-21

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236061U (en) * 1988-09-02 1990-03-08
US6677614B1 (en) * 1992-12-17 2004-01-13 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device
US6808950B2 (en) * 1992-12-17 2004-10-26 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device
US7094619B2 (en) 1992-12-17 2006-08-22 Kabushiki Kaisha Toshiba Method of fabricating a light emitting device
US7288795B2 (en) 1992-12-17 2007-10-30 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device
US7297984B2 (en) 1992-12-17 2007-11-20 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device
US7315046B2 (en) 1992-12-17 2008-01-01 Kabushiki Kaisha Toshiba Semiconductor light-emitting device and method for manufacturing the device
US5567972A (en) * 1993-11-05 1996-10-22 Oki Electric Industry Co., Ltd. Optical element mounted on a base having a capacitor imbedded therein
US5698889A (en) * 1993-11-05 1997-12-16 Oki Electric Industry Co., Ltd. Optical element mounted on a base having a capacitor imbedded therein

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