JPS5376692A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
JPS5376692A
JPS5376692A JP15246376A JP15246376A JPS5376692A JP S5376692 A JPS5376692 A JP S5376692A JP 15246376 A JP15246376 A JP 15246376A JP 15246376 A JP15246376 A JP 15246376A JP S5376692 A JPS5376692 A JP S5376692A
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
semiconductor light
semiconductor
occurrence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15246376A
Other languages
Japanese (ja)
Inventor
Shoichi Kakimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15246376A priority Critical patent/JPS5376692A/en
Publication of JPS5376692A publication Critical patent/JPS5376692A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE: To obtain a semiconductor light emitting device of high efficiency radiating light to the outside by increasing the reflection effect of the surface on the side being mounted to the top face of a semiconductor crystal substrate and preventing the occurrence of current concentration.
COPYRIGHT: (C)1978,JPO&Japio
JP15246376A 1976-12-18 1976-12-18 Semiconductor light emitting device Pending JPS5376692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15246376A JPS5376692A (en) 1976-12-18 1976-12-18 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15246376A JPS5376692A (en) 1976-12-18 1976-12-18 Semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS5376692A true JPS5376692A (en) 1978-07-07

Family

ID=15541054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15246376A Pending JPS5376692A (en) 1976-12-18 1976-12-18 Semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS5376692A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005115240A1 (en) * 2004-05-31 2005-12-08 Fukuda Sangyo Co., Ltd. Aspiration function examining instrument
JP2012231000A (en) * 2011-04-26 2012-11-22 Toshiba Corp Semiconductor light-emitting device
WO2014022950A1 (en) * 2012-08-10 2014-02-13 海立尔股份有限公司 Led package structure having multilayer transparent electrode

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5152290A (en) * 1974-09-05 1976-05-08 Centre Erekutoroniku Oruroje E

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5152290A (en) * 1974-09-05 1976-05-08 Centre Erekutoroniku Oruroje E

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005115240A1 (en) * 2004-05-31 2005-12-08 Fukuda Sangyo Co., Ltd. Aspiration function examining instrument
JP2012231000A (en) * 2011-04-26 2012-11-22 Toshiba Corp Semiconductor light-emitting device
WO2014022950A1 (en) * 2012-08-10 2014-02-13 海立尔股份有限公司 Led package structure having multilayer transparent electrode

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