WO2014022950A1

WO2014022950A1 - Led package structure having multilayer transparent electrode

Info

Publication number: WO2014022950A1
Application number: PCT/CN2012/001069
Authority: WO
Inventors: 陈明鸿; 潘敬仁; 许世昌
Original assignee: 海立尔股份有限公司
Priority date: 2012-08-10
Filing date: 2012-08-10
Publication date: 2014-02-13

Abstract

An LED package structure having multilayer transparent electrodes, comprising a substrate (10), a first light-transmitting electrode layer (20), a second light-transmitting electrode layer (30), a light-transmitting protective layer (50), a light-emitting chip (40), and a light-transmitting connection electrode layer (60). The electrode layers (20, 30) and the protective layer (50) are all made of transparent materials, thus the light emitted by the LED will not be blocked.

Description

LED package structure with multilayer transparent electrodes

The present invention relates to an LED package structure having a plurality of transparent electrodes, and more particularly to an LED package structure having a plurality of transparent electrodes in which the electrode layer and the protective layer are both transparent materials. Background technique

In the conventional LED package structure, the electrode layer and the electrical connection layer are mostly formed of a non-transparent metal or semiconductor material, which often has a great influence on the light-emitting direction and the amount of light emitted by the LED, especially in the case of high demand. In the state where the ratio is light, the light extraction efficiency is often greatly reduced.

Nowadays, research on the improvement of the amount of light is often carried out on the circuit structure and the formation of LED semiconductors. Although it can also increase the amount of light emitted, the shielding of the light from the electrode layer and the electrical connection layer still exists.

Therefore, considering the comprehensive consideration of the semiconductor material, the improvement of the circuit structure, the LED packaging method, and the elimination of the shielding of the electrode layer and the connection layer, the light-emitting effect is increased, and the development of the LED package at this stage will be formed. Summary of the invention

The invention relates to an LED package structure with a plurality of transparent electrodes, which is an LED package structure with a plurality of transparent electrodes in which the electrode layer and the protective layer are both transparent materials. The LED package structure with a plurality of transparent electrodes of the present invention has a substrate, a light transmissive first electrode layer, a light transmissive second electrode layer, a light transmissive protective layer, and is electrically connected A connecting electrode layer of light. With the implementation of the present invention, the light output of the LED can be prevented from being blocked by the necessary electrode and the electrical connection layer, thereby achieving a more perfect light-emitting effect.

In order to achieve the above effects, the present invention provides an LED package structure having a plurality of transparent electrodes, comprising: a substrate on an outer surface and formed with a first accommodating area and a second accommodating space; a first electrode layer formed on the first accommodating region; a second electrode layer formed on the second accommodating region and not connected to the first electrode layer; a light emitting chip formed on the first a protective layer formed on the periphery of the light emitting chip and extending to the top surface of the light emitting chip; and a connecting electrode layer formed on one side of the protective layer and electrically connected to the light emitting chip from the top surface of the light emitting chip And a second electrode layer.

By the implementation of the present invention, at least the following advancements can be achieved:

1. The light output of the LED can be blocked by the electrode and the electrical connection layer to achieve a more perfect light output.

2. Further integration of nanostructures can increase the light extraction efficiency of LEDs. The above description is only an overview of the technical solutions of the present invention, and the technical means of the present invention can be more clearly understood, and can be implemented in accordance with the contents of the specification, and the above and other objects, features and advantages of the present invention can be more clearly understood. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

1 is a view showing an embodiment of an LED package structure having a plurality of transparent electrodes according to an embodiment of the present invention.

2 is a diagram showing an embodiment of a light emitting chip of the embodiment of FIG. 1A.

Fig. 3 is a view showing another embodiment of an LED package structure having a plurality of transparent electrodes according to an embodiment of the present invention.

4 is a diagram showing an embodiment of a light emitting chip of the embodiment of FIG. 3.

FIG. 5 is a view showing another embodiment of an LED package structure having a plurality of nano structures combined with a plurality of transparent electrodes according to an embodiment of the present invention.

[Main component symbol description]

100, 100, 100, , LED package structure with multilayer transparent electrodes

10 substrate 11 first accommodating area

12 second accommodating area 20 first electrode layer

30 second electrode layer 40, 40, light emitting chip

41 conductive reflective layer 42 P-type semiconductor layer

43 light-emitting layer 44 N-type semiconductor layer

45 conductive anti-reflective layer 50 protective layer

60 connecting electrode layer 70 nanostructures the best way to achieve the invention

1 is a view showing an embodiment of an LED package structure having a plurality of transparent electrodes according to an embodiment of the present invention. 2 is a diagram showing an embodiment of a light emitting chip of the embodiment of FIG. 1A. 3 is a view showing another embodiment of an LED package structure having a plurality of transparent electrodes according to an embodiment of the present invention. 4 is a diagram showing an embodiment of a light emitting chip of the embodiment of FIG. 3. FIG. 5 is a view showing another embodiment of an LED package structure having a plurality of nano-structures combined with a plurality of transparent electrodes according to an embodiment of the present invention.

As shown in FIG. 1 , an LED package structure 100 having a plurality of transparent electrodes according to the present invention includes: a substrate 10 , a first electrode layer 20 , a second electrode layer 30 , and a light emitting chip 40 . A protective layer 50 and a connection electrode layer 60.

The substrate 10 is formed of an insulating heat dissipating material, and is a base plate body of the LED package structure 100 with a plurality of transparent electrodes, which is formed with a first accommodating area separated on an outer surface. 11 and a second accommodating area 12. The first electrode layer 20 is made of a metal conductive material and is formed on the first accommodating area 11. The second electrode layer 30, which is also a metal conductive layer, is formed on the second accommodating area 12, the second electrode layer 30 is not connected to the first electrode layer 20, and the first electrode layer 20 and the second electrode The layer 30 is a connecting portion of the LED package structure 100 with a plurality of transparent electrodes of the present invention and electrically connected to the outside.

As shown in FIG. 2, a light-emitting chip 40 is formed on the first electrode layer 20, and the light-emitting chip 40 includes: a conductive reflective layer 41 combined with the first electrode layer 20; The semiconductor layer 42 is grown on the conductive reflective layer 41; a light-emitting layer 43 is grown on the P-type semiconductor layer 42; an N-type semiconductor layer 44 is grown on the light-emitting layer 43; and a conductive anti-reflective layer 45 is provided. It grows on the N-type semiconductor layer 44.

The conductive reflective layer 41 in the light-emitting chip 40 is composed of a plurality of light-transmissive conductive layers having different refractive indices and conductive metals, wherein the conductive metal mainly provides light reflection and does not affect electrical conduction. The conductive anti-reflective layer 45 is composed of a plurality of light-transmissive conductive layers having different refractive indices, and the light can be completely penetrated, and the transmitted light contains visible light and invisible light.

The protective layer 50 is formed of a light-transmissive insulating material, which may be silicon dioxide or aluminum oxide or titanium dioxide or zinc oxide or other light-transmissive insulating material. The protective layer 50 is formed on the periphery of the light-emitting chip 40 and The edge extends to the top surface of the light-emitting chip 40, fixes and protects the light-emitting chip 40 and allows light to pass through, and the transmitted light contains visible light and invisible light.

The connecting electrode layer 60 is a light-transmitting conductive material shield formed on one side of the protective layer 50, and electrically connected to the conductive anti-reflective layer 45 and the second electrode layer 30 of the light-emitting chip 40, and can penetrate the connecting electrode layer 60. Light also contains visible light and invisible light.

In the LED package structure 100 of the present invention, the P-type semiconductor layer 42 of the light-emitting chip 40 is electrically connected to the external electrode via the connection conductive reflective layer 41, and the N-type semiconductor layer 44 is electrically connected. The second electrode layer 30 is connected to the external electrically connected via the conductive anti-reflective layer 45.

When the plurality of first electrode layers 20 of the LED package structure 100 having the plurality of transparent electrodes are connected to each other, and the second electrode layers 30 of the LED package structure 100 having the plurality of transparent electrodes are connected to each other, a plurality of layers are formed. A parallel structure of LED package structures 100 with multiple layers of transparent electrodes.

The first electrode layer 20 of the LED package structure 100 with a plurality of transparent electrodes is connected to the second electrode layer 30 of the LED package structure 100 with another multilayer transparent electrode, so that multiple sets of series are connected to form A series structure of a plurality of LED package structures 100 having a plurality of transparent electrodes.

As shown in FIG. 3, another LED package structure 100 having a plurality of transparent electrodes according to the present invention further includes: a substrate 10, a first electrode layer 20, a second electrode layer 30, and a The light emitting chip 40', a protective layer 50, and a connecting electrode layer 60. The difference from the LED package structure 100 with a multilayer transparent electrode of the present invention shown in FIG. 1 is only that the position of the P-type semiconductor layer 42 and the N-type semiconductor layer 44 are replaced in the semiconductor process. The invention shown in 4 Another kind of light-emitting chip 40, . The embodiment shown in Figure 3 has the same efficacy as the embodiment shown in Figure 1.

As shown in FIG. 5, another LED package structure 100 with multiple transparent electrodes of the present invention can further combine a plurality of nanostructures 70, and a combination of the nanostructures 70 can add a device of the present invention. The light-emitting efficiency of the LED package structure 100' of the multilayer transparent electrode can be a plurality of micro-lens.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the preferred embodiments, it is not intended to limit the present invention. The skilled person can make some modifications or modifications to the equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention, but without departing from the technical solution of the present invention, according to the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

Claims

Rights request

1. An LED package structure with multi-layer transparent electrodes, characterized by including: a substrate, which is made of insulating heat dissipation material, and has a first accommodation area and a first accommodation area separated on an outer surface. Second containment area;

A first electrode layer is formed on the first accommodation area;

A second electrode layer is formed on the second accommodation area and is not connected to the first electrode layer; a light-emitting chip is formed on the first electrode layer, the light-emitting chip includes: a conductive reflective layer, Combined with the first electrode layer; a P-type semiconductor layer, grown on the conductive reflective layer; a light-emitting layer, grown on the P-type semiconductor layer J; an N-type semiconductor layer, grown on the light-emitting layer; and A conductive anti-reflection layer grown on the N-type semiconductor layer;

A protective layer is formed around the periphery of the light-emitting chip and extends to the top edge of the light-emitting chip; and

A connecting electrode layer is formed on one side of the protective layer and electrically connects the conductive anti-reflection layer and the second electrode layer.

2. The LED package structure of claim 1, wherein the first electrode layer and the second electrode layer are both formed of metal conductive material shields.

3. The LED package structure of claim 1, wherein the conductive reflective layer is composed of multiple layers of light-transmitting conductive layers with different refractive indexes and conductive metal.

4. The LED package structure of claim 1, wherein the conductive anti-reflection layer is composed of multiple light-transmitting conductive layers with different refractive indexes.

5. The LED package structure of claim 1, wherein the protective layer is made of a light-transmitting insulating material.

6. The LED package structure of claim 1, wherein the protective layer is formed of silicon dioxide, aluminum oxide, titanium dioxide, or zinc oxide.

7. The LED package structure of claim 1, wherein the connection electrode layer is made of a light-transmitting conductive material.

8. The LED package structure of claim 1, wherein an outer surface of the LED package structure is further combined with a plurality of nanostructures.