JPS5313373A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5313373A
JPS5313373A JP8657576A JP8657576A JPS5313373A JP S5313373 A JPS5313373 A JP S5313373A JP 8657576 A JP8657576 A JP 8657576A JP 8657576 A JP8657576 A JP 8657576A JP S5313373 A JPS5313373 A JP S5313373A
Authority
JP
Japan
Prior art keywords
semiconductor device
procided
transfere
constitution
reduce
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8657576A
Other languages
Japanese (ja)
Inventor
Akihiro Hachiman
Tetsuo Sekiwa
Makoto Naito
Akinobu Kasami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8657576A priority Critical patent/JPS5313373A/en
Publication of JPS5313373A publication Critical patent/JPS5313373A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]

Abstract

PURPOSE: A the constitution in which semiconductor mixed crystal containing P and Ga is procided on the GaP substrate, the grid mismatching at every surface is made below 0.14% to reduce transfere density around each surface, thereby improving luminous efficiency when a luminous element is formed.
COPYRIGHT: (C)1978,JPO&Japio
JP8657576A 1976-07-22 1976-07-22 Semiconductor device Pending JPS5313373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8657576A JPS5313373A (en) 1976-07-22 1976-07-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8657576A JPS5313373A (en) 1976-07-22 1976-07-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5313373A true JPS5313373A (en) 1978-02-06

Family

ID=13890797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8657576A Pending JPS5313373A (en) 1976-07-22 1976-07-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5313373A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294317A (en) * 1976-02-04 1977-08-08 Ito Yasuro Method of pouring cement mixture in prepacked concrete

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294317A (en) * 1976-02-04 1977-08-08 Ito Yasuro Method of pouring cement mixture in prepacked concrete
JPS5516042B2 (en) * 1976-02-04 1980-04-28

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