JPS5637656A - Airtight container with light transmission opening - Google Patents

Airtight container with light transmission opening

Info

Publication number
JPS5637656A
JPS5637656A JP11332779A JP11332779A JPS5637656A JP S5637656 A JPS5637656 A JP S5637656A JP 11332779 A JP11332779 A JP 11332779A JP 11332779 A JP11332779 A JP 11332779A JP S5637656 A JPS5637656 A JP S5637656A
Authority
JP
Japan
Prior art keywords
opening
light transmission
melting point
wire
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11332779A
Other languages
Japanese (ja)
Inventor
Masato Nakajima
Akira Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11332779A priority Critical patent/JPS5637656A/en
Publication of JPS5637656A publication Critical patent/JPS5637656A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To avoid the decrease is light transmission performance of an airtight container with a light transmission opening without coating a low melting point glass directly on when opening by interposing a ring-like spacer coated with a low melting point glass therebetween the securing a semiconductor element for emitting a light and for receiving a light on a substrate and forming the opening at an interval thereon. CONSTITUTION:A photosemiconductor 8 is secured to the central portion on a planar ceramic substrate 4 formed with a metallized wire 6 on the periphery thereof while exposing the central portion thereof with an low melting point solder such as an AuSi or the like or Ag paste. Then, electrodes fromed thereon are connected through fine wires made of Au, Al or the like to the wire 6, and external lead wires 7 are led from the wires 6. When a planar light transmission opening 5 made of glass, saphhire, quarts or the like is confronted thereafter with the photosemiconductor 8, a ring-shaped ceramic support 8 having low metling point glass-coated layers 2, 3 on each of both the front surface and the back surface of a circular or rectangular shape is fixedly disposed between the wire 6 and the opening 5.
JP11332779A 1979-09-04 1979-09-04 Airtight container with light transmission opening Pending JPS5637656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11332779A JPS5637656A (en) 1979-09-04 1979-09-04 Airtight container with light transmission opening

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11332779A JPS5637656A (en) 1979-09-04 1979-09-04 Airtight container with light transmission opening

Publications (1)

Publication Number Publication Date
JPS5637656A true JPS5637656A (en) 1981-04-11

Family

ID=14609421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11332779A Pending JPS5637656A (en) 1979-09-04 1979-09-04 Airtight container with light transmission opening

Country Status (1)

Country Link
JP (1) JPS5637656A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199542A (en) * 1982-05-14 1983-11-19 Shinko Electric Ind Co Ltd Sealing member
EP0275122A2 (en) * 1987-01-16 1988-07-20 Sumitomo Electric Industries Limited Chip package transmissive to ultraviolet light
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199542A (en) * 1982-05-14 1983-11-19 Shinko Electric Ind Co Ltd Sealing member
EP0275122A2 (en) * 1987-01-16 1988-07-20 Sumitomo Electric Industries Limited Chip package transmissive to ultraviolet light
US5063435A (en) * 1987-01-16 1991-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width
US5399805A (en) * 1992-10-13 1995-03-21 Olin Corporation Metal electronic package with reduced seal width

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