JPS5567179A - Luminous display device - Google Patents
Luminous display deviceInfo
- Publication number
- JPS5567179A JPS5567179A JP14085278A JP14085278A JPS5567179A JP S5567179 A JPS5567179 A JP S5567179A JP 14085278 A JP14085278 A JP 14085278A JP 14085278 A JP14085278 A JP 14085278A JP S5567179 A JPS5567179 A JP S5567179A
- Authority
- JP
- Japan
- Prior art keywords
- led
- paste
- electrode
- display device
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
PURPOSE: To decrease the number of man-hours, and to improve reliability, by using conductive adhesive substance without employing wire bond, in this matrix- like display device making use of a large number of LED.
CONSTITUTION: A gold evaporated film 52 is mounted onto a glass plate 51 as an electrode in the X direction, a LED 53 is placed and both are connected at approximately 260°C. Solder 54 spreads only on the metal portion, and a luminous portion of the LED is not coated. An upper portion of the LED 53 is covered with silver paste 55, a substrate 57 on which an electrode 56 in the Y direction is arranged is stacked so that the electrode 56 fast be sticked to the paste 55 and the paste is hardened. Since the curing temperature of the paste is approximately 100∼150°C, the solder 54 does not melt, and the LED does not move and is not exfoliated. Thus, a process of manufacture is sharply simplified, and reliability is high because the LED is fixed to the substrate with conductive substance.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14085278A JPS5567179A (en) | 1978-11-14 | 1978-11-14 | Luminous display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14085278A JPS5567179A (en) | 1978-11-14 | 1978-11-14 | Luminous display device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5567179A true JPS5567179A (en) | 1980-05-21 |
Family
ID=15278226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14085278A Pending JPS5567179A (en) | 1978-11-14 | 1978-11-14 | Luminous display device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5567179A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4445132A (en) * | 1980-06-13 | 1984-04-24 | Tokyo Shibaura Denki Kabushiki Kaisha | LED Module for a flat panel display unit |
JPS59127253U (en) * | 1983-02-17 | 1984-08-27 | 舶用電球株式会社 | surface light emitter |
JPH0175294U (en) * | 1987-11-09 | 1989-05-22 | ||
EP1787059A2 (en) * | 2004-02-05 | 2007-05-23 | Marpole International, Inc. | Light display structures |
JP2018535451A (en) * | 2015-11-13 | 2018-11-29 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | Module for video wall |
-
1978
- 1978-11-14 JP JP14085278A patent/JPS5567179A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4445132A (en) * | 1980-06-13 | 1984-04-24 | Tokyo Shibaura Denki Kabushiki Kaisha | LED Module for a flat panel display unit |
JPS59127253U (en) * | 1983-02-17 | 1984-08-27 | 舶用電球株式会社 | surface light emitter |
JPH0175294U (en) * | 1987-11-09 | 1989-05-22 | ||
EP1787059A2 (en) * | 2004-02-05 | 2007-05-23 | Marpole International, Inc. | Light display structures |
EP1787059A4 (en) * | 2004-02-05 | 2009-11-11 | Gen Led Inc | Light display structures |
JP2018535451A (en) * | 2015-11-13 | 2018-11-29 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | Module for video wall |
US10553148B2 (en) | 2015-11-13 | 2020-02-04 | Osram Opto Semiconductors Gmbh | Module for a video wall |
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