JPS5567179A - Luminous display device - Google Patents

Luminous display device

Info

Publication number
JPS5567179A
JPS5567179A JP14085278A JP14085278A JPS5567179A JP S5567179 A JPS5567179 A JP S5567179A JP 14085278 A JP14085278 A JP 14085278A JP 14085278 A JP14085278 A JP 14085278A JP S5567179 A JPS5567179 A JP S5567179A
Authority
JP
Japan
Prior art keywords
led
paste
electrode
display device
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14085278A
Other languages
Japanese (ja)
Inventor
Nobuhide Matsuda
Isamu Akasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14085278A priority Critical patent/JPS5567179A/en
Publication of JPS5567179A publication Critical patent/JPS5567179A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: To decrease the number of man-hours, and to improve reliability, by using conductive adhesive substance without employing wire bond, in this matrix- like display device making use of a large number of LED.
CONSTITUTION: A gold evaporated film 52 is mounted onto a glass plate 51 as an electrode in the X direction, a LED 53 is placed and both are connected at approximately 260°C. Solder 54 spreads only on the metal portion, and a luminous portion of the LED is not coated. An upper portion of the LED 53 is covered with silver paste 55, a substrate 57 on which an electrode 56 in the Y direction is arranged is stacked so that the electrode 56 fast be sticked to the paste 55 and the paste is hardened. Since the curing temperature of the paste is approximately 100∼150°C, the solder 54 does not melt, and the LED does not move and is not exfoliated. Thus, a process of manufacture is sharply simplified, and reliability is high because the LED is fixed to the substrate with conductive substance.
COPYRIGHT: (C)1980,JPO&Japio
JP14085278A 1978-11-14 1978-11-14 Luminous display device Pending JPS5567179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14085278A JPS5567179A (en) 1978-11-14 1978-11-14 Luminous display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14085278A JPS5567179A (en) 1978-11-14 1978-11-14 Luminous display device

Publications (1)

Publication Number Publication Date
JPS5567179A true JPS5567179A (en) 1980-05-21

Family

ID=15278226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14085278A Pending JPS5567179A (en) 1978-11-14 1978-11-14 Luminous display device

Country Status (1)

Country Link
JP (1) JPS5567179A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445132A (en) * 1980-06-13 1984-04-24 Tokyo Shibaura Denki Kabushiki Kaisha LED Module for a flat panel display unit
JPS59127253U (en) * 1983-02-17 1984-08-27 舶用電球株式会社 surface light emitter
JPH0175294U (en) * 1987-11-09 1989-05-22
EP1787059A2 (en) * 2004-02-05 2007-05-23 Marpole International, Inc. Light display structures
JP2018535451A (en) * 2015-11-13 2018-11-29 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Module for video wall

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445132A (en) * 1980-06-13 1984-04-24 Tokyo Shibaura Denki Kabushiki Kaisha LED Module for a flat panel display unit
JPS59127253U (en) * 1983-02-17 1984-08-27 舶用電球株式会社 surface light emitter
JPH0175294U (en) * 1987-11-09 1989-05-22
EP1787059A2 (en) * 2004-02-05 2007-05-23 Marpole International, Inc. Light display structures
EP1787059A4 (en) * 2004-02-05 2009-11-11 Gen Led Inc Light display structures
JP2018535451A (en) * 2015-11-13 2018-11-29 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Module for video wall
US10553148B2 (en) 2015-11-13 2020-02-04 Osram Opto Semiconductors Gmbh Module for a video wall

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