JPS54133875A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS54133875A
JPS54133875A JP4167378A JP4167378A JPS54133875A JP S54133875 A JPS54133875 A JP S54133875A JP 4167378 A JP4167378 A JP 4167378A JP 4167378 A JP4167378 A JP 4167378A JP S54133875 A JPS54133875 A JP S54133875A
Authority
JP
Japan
Prior art keywords
lead
film
bump
heat
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4167378A
Other languages
Japanese (ja)
Inventor
Susumu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4167378A priority Critical patent/JPS54133875A/en
Publication of JPS54133875A publication Critical patent/JPS54133875A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To make a connection definite by fixing a lead onto a film carrier using an elastic film of a heat-proof electric insulator and by pressure-welding the electrode terminal of a semiconductor element here over heating.
CONSTITUTION: On mount 24 on which polyimide film 23 is mounted at least at a part made of transparent quartz, polyimide film 23 with lead 22 on its surface is mounted with lead 22 up. Next, bump 21, an electrode terminal provided to semiconductor substrate 20, is made in contact with the end of lead 22 and bonding tool 25 with adsorbing vaccum hole 26 is arranged on substrate 20. In this constitution, bump 21 and lead 22 are fixed by pressure-bonding over heating by using tool 25, but since film 23 is an heat insulation material, a definite connection is possible with a little loss of heat evergy. Further, a load between bump 21 and lead 22 is uniform because of elastic film 23.
COPYRIGHT: (C)1979,JPO&Japio
JP4167378A 1978-04-07 1978-04-07 Manufacture of semiconductor device Pending JPS54133875A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4167378A JPS54133875A (en) 1978-04-07 1978-04-07 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4167378A JPS54133875A (en) 1978-04-07 1978-04-07 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS54133875A true JPS54133875A (en) 1979-10-17

Family

ID=12614913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4167378A Pending JPS54133875A (en) 1978-04-07 1978-04-07 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54133875A (en)

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