JPS6459841A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6459841A
JPS6459841A JP21685587A JP21685587A JPS6459841A JP S6459841 A JPS6459841 A JP S6459841A JP 21685587 A JP21685587 A JP 21685587A JP 21685587 A JP21685587 A JP 21685587A JP S6459841 A JPS6459841 A JP S6459841A
Authority
JP
Japan
Prior art keywords
semiconductor element
radiator
jig
hole
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21685587A
Other languages
Japanese (ja)
Other versions
JPH0715963B2 (en
Inventor
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21685587A priority Critical patent/JPH0715963B2/en
Publication of JPS6459841A publication Critical patent/JPS6459841A/en
Publication of JPH0715963B2 publication Critical patent/JPH0715963B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance heat-dissipating efficiency by a method wherein a semiconductor element mounted by using a film carrier system is brought into direct contact with a radiator. CONSTITUTION:Electrodes of a semiconductor element 1 are bonded to a group of leads 11 protruding at a device hole of a film carrier tape 10; the semiconductor element 1 is inserted into a hole 20 of a radiator 12 and is fixed by using a conductive adhesive or the like whose thermal conduction is good. On the other hand, a jig 13 is formed by using Cu, Ni Kovar or the like whose thermal conduction is good, and covers at least a bottom face of the radiator 12; a hole 22' where a collar 22 is to be installed is installed at its four corners. The radiator 12 and the jig 13 are fixed by using a screw 14 via the film tape 10 where the semiconductor element 1 is mounted. During this process, a heat- dissipating material 17 is filled in a gap between the jig 13 and the semiconductor element 1 and dissipates heat from the surface of the semiconductor element 1 positively.
JP21685587A 1987-08-31 1987-08-31 Semiconductor device Expired - Fee Related JPH0715963B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21685587A JPH0715963B2 (en) 1987-08-31 1987-08-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21685587A JPH0715963B2 (en) 1987-08-31 1987-08-31 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6459841A true JPS6459841A (en) 1989-03-07
JPH0715963B2 JPH0715963B2 (en) 1995-02-22

Family

ID=16694962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21685587A Expired - Fee Related JPH0715963B2 (en) 1987-08-31 1987-08-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0715963B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
JPH0866101A (en) * 1991-09-20 1996-03-12 Sugano Noki Kk Colter controlling apparatus for reversible plow
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
WO2003004048A1 (en) 2001-07-05 2003-01-16 Translational Research Ltd. Compositions for nasal administration of insulin
JP2020120084A (en) * 2019-01-28 2020-08-06 日本電気株式会社 Device and assembling method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0866101A (en) * 1991-09-20 1996-03-12 Sugano Noki Kk Colter controlling apparatus for reversible plow
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
WO2003004048A1 (en) 2001-07-05 2003-01-16 Translational Research Ltd. Compositions for nasal administration of insulin
JP2020120084A (en) * 2019-01-28 2020-08-06 日本電気株式会社 Device and assembling method

Also Published As

Publication number Publication date
JPH0715963B2 (en) 1995-02-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees