JPS6424447A - Semiconductor cooler - Google Patents

Semiconductor cooler

Info

Publication number
JPS6424447A
JPS6424447A JP62180669A JP18066987A JPS6424447A JP S6424447 A JPS6424447 A JP S6424447A JP 62180669 A JP62180669 A JP 62180669A JP 18066987 A JP18066987 A JP 18066987A JP S6424447 A JPS6424447 A JP S6424447A
Authority
JP
Japan
Prior art keywords
flat part
cooling water
diaphragm
spacer
elasticity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62180669A
Other languages
Japanese (ja)
Inventor
Noriyuki Ashiwake
Hisashi Nakayama
Takehiko Yanagida
Takahiro Oguro
Akimine Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62180669A priority Critical patent/JPS6424447A/en
Publication of JPS6424447A publication Critical patent/JPS6424447A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To avoid any defective connection of a solder ball for enhancing the reliability thereof by a method wherein the elasticity and the water pressure of a cooling member are felt by a wiring substrate not to be applied on a semiconductor chip or a package. CONSTITUTION:A spacer 5 is composed of, e.g.) a square flat part 5a bonded onto the lower surface of a diaphragm 3A formed of a heat conductive material and multiple, e.g., three each of holding members 5b erectly formed downward around the flat part 5a. The holding members 5b are pressed against a wiring substrate 8 by the elasticity of the diaphragm 3A and the water pressure of cooling water running in a cooling water channel 6. Besides, specified gap C is set up to be formed between the lower surface of the flat part 5a and the upper surface of the flat part 5A by the spacer 5. This specified gap C is filled with grease 16 as, e.g., a soft conductive material. In such a constitution, the spacer 5 is pressed against the wiring substrate 8 by the pressure of cooling water running in the cooling water channel 6 of a water cooling jacket 2 and the elasticity of the diaphragm 3A.
JP62180669A 1987-07-20 1987-07-20 Semiconductor cooler Pending JPS6424447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62180669A JPS6424447A (en) 1987-07-20 1987-07-20 Semiconductor cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62180669A JPS6424447A (en) 1987-07-20 1987-07-20 Semiconductor cooler

Publications (1)

Publication Number Publication Date
JPS6424447A true JPS6424447A (en) 1989-01-26

Family

ID=16087237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62180669A Pending JPS6424447A (en) 1987-07-20 1987-07-20 Semiconductor cooler

Country Status (1)

Country Link
JP (1) JPS6424447A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03253063A (en) * 1990-03-02 1991-11-12 Hitachi Ltd Cooling device of electronic device
JPH04226058A (en) * 1990-04-27 1992-08-14 Internatl Business Mach Corp <Ibm> Fluid-cooling hat
US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
WO2019049781A1 (en) * 2017-09-07 2019-03-14 株式会社村田製作所 Circuit block assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03253063A (en) * 1990-03-02 1991-11-12 Hitachi Ltd Cooling device of electronic device
JPH04226058A (en) * 1990-04-27 1992-08-14 Internatl Business Mach Corp <Ibm> Fluid-cooling hat
US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
WO2019049781A1 (en) * 2017-09-07 2019-03-14 株式会社村田製作所 Circuit block assembly
JPWO2019049781A1 (en) * 2017-09-07 2019-12-19 株式会社村田製作所 Circuit block assembly

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