JPS5731148A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5731148A JPS5731148A JP10586980A JP10586980A JPS5731148A JP S5731148 A JPS5731148 A JP S5731148A JP 10586980 A JP10586980 A JP 10586980A JP 10586980 A JP10586980 A JP 10586980A JP S5731148 A JPS5731148 A JP S5731148A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- collet
- film
- flat
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To perform scribing without damage to a chip, by forming a heat resistance buffer film around the upper surface of the chip, and pressing the lower surface by means of a flat suntion collet. CONSTITUTION:A buffer film 5 with a height of 3-5mum is formed on a chip 1 by Al or a polyimide resin hardened after application. With a lower end surface 2a sucked to a flat collet 2, the film 5 becomes a spacer and the element on the upper surface of the chip and connections and the upper protective film are pressed by the lower surface 2a of the collet and will not be damaged.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10586980A JPS5731148A (en) | 1980-07-31 | 1980-07-31 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10586980A JPS5731148A (en) | 1980-07-31 | 1980-07-31 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5731148A true JPS5731148A (en) | 1982-02-19 |
Family
ID=14418953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10586980A Pending JPS5731148A (en) | 1980-07-31 | 1980-07-31 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5731148A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62118443U (en) * | 1986-01-20 | 1987-07-28 | ||
JPS62254439A (en) * | 1986-04-22 | 1987-11-06 | シ−メンス、アクチエンゲゼルシヤフト | Method of fixing electronic device on board |
US6046715A (en) * | 1996-05-17 | 2000-04-04 | Sharp Kabushiki Kaisha | Liquid crystal array device |
DE10250778B3 (en) * | 2002-10-30 | 2004-03-04 | Infineon Technologies Ag | Semiconductor chip used in flip-chip technology for producing circuit boards has a buffer body with a protective layer made from a damping material arranged between a contact surfaces and above a semiconductor component structures |
-
1980
- 1980-07-31 JP JP10586980A patent/JPS5731148A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62118443U (en) * | 1986-01-20 | 1987-07-28 | ||
JPS62254439A (en) * | 1986-04-22 | 1987-11-06 | シ−メンス、アクチエンゲゼルシヤフト | Method of fixing electronic device on board |
US6046715A (en) * | 1996-05-17 | 2000-04-04 | Sharp Kabushiki Kaisha | Liquid crystal array device |
DE10250778B3 (en) * | 2002-10-30 | 2004-03-04 | Infineon Technologies Ag | Semiconductor chip used in flip-chip technology for producing circuit boards has a buffer body with a protective layer made from a damping material arranged between a contact surfaces and above a semiconductor component structures |
US6906428B2 (en) | 2002-10-30 | 2005-06-14 | Infineon Technologies Ag | Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component |
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