JPS5731148A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5731148A
JPS5731148A JP10586980A JP10586980A JPS5731148A JP S5731148 A JPS5731148 A JP S5731148A JP 10586980 A JP10586980 A JP 10586980A JP 10586980 A JP10586980 A JP 10586980A JP S5731148 A JPS5731148 A JP S5731148A
Authority
JP
Japan
Prior art keywords
chip
collet
film
flat
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10586980A
Other languages
Japanese (ja)
Inventor
Haruo Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10586980A priority Critical patent/JPS5731148A/en
Publication of JPS5731148A publication Critical patent/JPS5731148A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To perform scribing without damage to a chip, by forming a heat resistance buffer film around the upper surface of the chip, and pressing the lower surface by means of a flat suntion collet. CONSTITUTION:A buffer film 5 with a height of 3-5mum is formed on a chip 1 by Al or a polyimide resin hardened after application. With a lower end surface 2a sucked to a flat collet 2, the film 5 becomes a spacer and the element on the upper surface of the chip and connections and the upper protective film are pressed by the lower surface 2a of the collet and will not be damaged.
JP10586980A 1980-07-31 1980-07-31 Manufacture of semiconductor device Pending JPS5731148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10586980A JPS5731148A (en) 1980-07-31 1980-07-31 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10586980A JPS5731148A (en) 1980-07-31 1980-07-31 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5731148A true JPS5731148A (en) 1982-02-19

Family

ID=14418953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10586980A Pending JPS5731148A (en) 1980-07-31 1980-07-31 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5731148A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118443U (en) * 1986-01-20 1987-07-28
JPS62254439A (en) * 1986-04-22 1987-11-06 シ−メンス、アクチエンゲゼルシヤフト Method of fixing electronic device on board
US6046715A (en) * 1996-05-17 2000-04-04 Sharp Kabushiki Kaisha Liquid crystal array device
DE10250778B3 (en) * 2002-10-30 2004-03-04 Infineon Technologies Ag Semiconductor chip used in flip-chip technology for producing circuit boards has a buffer body with a protective layer made from a damping material arranged between a contact surfaces and above a semiconductor component structures

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118443U (en) * 1986-01-20 1987-07-28
JPS62254439A (en) * 1986-04-22 1987-11-06 シ−メンス、アクチエンゲゼルシヤフト Method of fixing electronic device on board
US6046715A (en) * 1996-05-17 2000-04-04 Sharp Kabushiki Kaisha Liquid crystal array device
DE10250778B3 (en) * 2002-10-30 2004-03-04 Infineon Technologies Ag Semiconductor chip used in flip-chip technology for producing circuit boards has a buffer body with a protective layer made from a damping material arranged between a contact surfaces and above a semiconductor component structures
US6906428B2 (en) 2002-10-30 2005-06-14 Infineon Technologies Ag Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component

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