JPS55138246A - Manufacture of semicondoctor device - Google Patents
Manufacture of semicondoctor deviceInfo
- Publication number
- JPS55138246A JPS55138246A JP4500879A JP4500879A JPS55138246A JP S55138246 A JPS55138246 A JP S55138246A JP 4500879 A JP4500879 A JP 4500879A JP 4500879 A JP4500879 A JP 4500879A JP S55138246 A JPS55138246 A JP S55138246A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- joint
- inner lead
- lead wire
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To obtain a highly reliable wire joint by a method wherein an inner lead wire containing copper by 90% or over is directly kept in touch with a gold wire, while blowing a non-oxidizing gas against the joint so as to keep the temperature at above 300 deg.C. CONSTITUTION:A semiconductor element 15 is temporarily fixed through the aid of a conductive epoxy adhesive agent 14 to an island of a lead frame 13 having the island 11 and a copper-coated inner lead wire 12, and the element is sent to a heat block so that the adhesive agent is hardened. Next, if a gold wire 17 is connected to the element 15 of the electrode and the inner lead wire 12, while blowing a hot N2 gas against the joint to heat it up at about 320-380 deg.C, a sure connection can be obtainable. Then, epoxy resin 18 is injected into the specified mold in order to seal the joint. By so doing, it is possible to obtain a highly reliable device with sure wire joints.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP4500879A JPS55138246A (en) | 1979-04-13 | 1979-04-13 | Manufacture of semicondoctor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4500879A JPS55138246A (en) | 1979-04-13 | 1979-04-13 | Manufacture of semicondoctor device |
Publications (1)
Publication Number | Publication Date |
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JPS55138246A true JPS55138246A (en) | 1980-10-28 |
Family
ID=12707336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP4500879A Pending JPS55138246A (en) | 1979-04-13 | 1979-04-13 | Manufacture of semicondoctor device |
Country Status (1)
Country | Link |
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JP (1) | JPS55138246A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56103433A (en) * | 1980-01-21 | 1981-08-18 | Toshiba Corp | Wire bonding method |
JPS57166040A (en) * | 1981-04-06 | 1982-10-13 | Sanyo Electric Co Ltd | Wire bonding method for resin substrate |
JPS57183044A (en) * | 1981-05-07 | 1982-11-11 | Oki Electric Ind Co Ltd | Mounting method for lc and ic parts etc. |
JPS58164234A (en) * | 1982-03-25 | 1983-09-29 | Toshiba Corp | Wire bonding device for semiconductor |
JPS5958833A (en) * | 1982-09-28 | 1984-04-04 | Shinkawa Ltd | Semiconductor device |
WO2011118247A1 (en) * | 2010-03-25 | 2011-09-29 | 三洋電機株式会社 | Bonding device and process for production of semiconductor device using same |
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1979
- 1979-04-13 JP JP4500879A patent/JPS55138246A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56103433A (en) * | 1980-01-21 | 1981-08-18 | Toshiba Corp | Wire bonding method |
JPS6349375B2 (en) * | 1980-01-21 | 1988-10-04 | Tokyo Shibaura Electric Co | |
JPS57166040A (en) * | 1981-04-06 | 1982-10-13 | Sanyo Electric Co Ltd | Wire bonding method for resin substrate |
JPS6359536B2 (en) * | 1981-04-06 | 1988-11-21 | ||
JPS57183044A (en) * | 1981-05-07 | 1982-11-11 | Oki Electric Ind Co Ltd | Mounting method for lc and ic parts etc. |
JPS58164234A (en) * | 1982-03-25 | 1983-09-29 | Toshiba Corp | Wire bonding device for semiconductor |
JPH0345539B2 (en) * | 1982-03-25 | 1991-07-11 | Tokyo Shibaura Electric Co | |
JPS5958833A (en) * | 1982-09-28 | 1984-04-04 | Shinkawa Ltd | Semiconductor device |
JPH0141028B2 (en) * | 1982-09-28 | 1989-09-01 | Shinkawa Kk | |
WO2011118247A1 (en) * | 2010-03-25 | 2011-09-29 | 三洋電機株式会社 | Bonding device and process for production of semiconductor device using same |
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