JPS5638846A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5638846A
JPS5638846A JP11499679A JP11499679A JPS5638846A JP S5638846 A JPS5638846 A JP S5638846A JP 11499679 A JP11499679 A JP 11499679A JP 11499679 A JP11499679 A JP 11499679A JP S5638846 A JPS5638846 A JP S5638846A
Authority
JP
Japan
Prior art keywords
leads
pieces
insulating body
body pieces
enclosed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11499679A
Other languages
Japanese (ja)
Inventor
Haruo Kojima
Yasunori Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11499679A priority Critical patent/JPS5638846A/en
Publication of JPS5638846A publication Critical patent/JPS5638846A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent unnecessary deformation of leads at the time of the bending work of the leads by fixing the tips of the leads of lead frames to the solid pieces of insulating bodies which are enclosed in the base of a package. CONSTITUTION:In the case leadframes are bent, solid pieces 17 of insulating bodies are fixed to the tips of long leads 15 and 16 which are easily subjected to unnecessary deformation before the bending work. The thickness of the insulating body pieces 17 is equal to the depth of a cavity 12 in which a semiconductor element 30 is enclosed. The insulating body pieces 17 are enclosed in the cavity 12, with the leads 15 and 16 being fixed to the insulating body pieces 17. It is recommended that the bonding agent which fixes the insulating body pieces 17 to the leads 15 and 16 is such that it is not melted at the temperature in cerdip sealing. As insulating body pieces 17, the pieces, to which a conducting film fitting the arrangement of the leads 15 and 16 is deposited, may be used.
JP11499679A 1979-09-07 1979-09-07 Semiconductor device Pending JPS5638846A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11499679A JPS5638846A (en) 1979-09-07 1979-09-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11499679A JPS5638846A (en) 1979-09-07 1979-09-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5638846A true JPS5638846A (en) 1981-04-14

Family

ID=14651718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11499679A Pending JPS5638846A (en) 1979-09-07 1979-09-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5638846A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842259A (en) * 1981-09-04 1983-03-11 Fujitsu Ltd Ceramic package for semiconductor
JPS60141125U (en) * 1984-02-27 1985-09-18 エルメック株式会社 electronic parts equipment
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842259A (en) * 1981-09-04 1983-03-11 Fujitsu Ltd Ceramic package for semiconductor
JPH022289B2 (en) * 1981-09-04 1990-01-17 Fujitsu Ltd
JPS60141125U (en) * 1984-02-27 1985-09-18 エルメック株式会社 electronic parts equipment
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip

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