JPS568863A - Substrate for semiconductor device - Google Patents

Substrate for semiconductor device

Info

Publication number
JPS568863A
JPS568863A JP8457679A JP8457679A JPS568863A JP S568863 A JPS568863 A JP S568863A JP 8457679 A JP8457679 A JP 8457679A JP 8457679 A JP8457679 A JP 8457679A JP S568863 A JPS568863 A JP S568863A
Authority
JP
Japan
Prior art keywords
hole
section
lead
film
supporting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8457679A
Other languages
Japanese (ja)
Inventor
Miyoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8457679A priority Critical patent/JPS568863A/en
Publication of JPS568863A publication Critical patent/JPS568863A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase the supporting capability of a lead at a film section by providing a lead-supporting member at the sandwiched section between the hole located at the central part of a flexible insulated film and the hole on the outer circumference. CONSTITUTION:On the film section 1 between the hole 3 provided at the central part of a flexible insulated film and the hole 4 provided at the outer circumference of the hole 3, an insulated supporting member 6 is formed. On the substrate constituted as above, a semiconductor element is connected to the hole 3 section by bonding. At this time, due to the temperature and the load applied to the lead 5, a softening and a subsequent deformation can be given to the film section 1a without difficulty. However, as the film section 1a has been reinformed with the supporting member 6, the bonding can be completed without having a confusion on the arrangement of the lead 5.
JP8457679A 1979-07-02 1979-07-02 Substrate for semiconductor device Pending JPS568863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8457679A JPS568863A (en) 1979-07-02 1979-07-02 Substrate for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8457679A JPS568863A (en) 1979-07-02 1979-07-02 Substrate for semiconductor device

Publications (1)

Publication Number Publication Date
JPS568863A true JPS568863A (en) 1981-01-29

Family

ID=13834493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8457679A Pending JPS568863A (en) 1979-07-02 1979-07-02 Substrate for semiconductor device

Country Status (1)

Country Link
JP (1) JPS568863A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466183A (en) * 1982-05-03 1984-08-21 National Semiconductor Corporation Integrated circuit packaging process
JPH0380552A (en) * 1989-08-23 1991-04-05 Nec Corp Tape for mounting integrated circuit
JPH0382047A (en) * 1989-08-24 1991-04-08 Nec Corp Film carrier semicodcutor device
JPH03125440A (en) * 1989-10-09 1991-05-28 Rohm Co Ltd Electronic parts
US5401794A (en) * 1994-06-03 1995-03-28 Shell Oil Company Stabilized polyketone polymer compositions
KR20190070622A (en) * 2017-12-13 2019-06-21 주식회사 엘비루셈 Film for use in COF Package with 2-layer Pattern

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466183A (en) * 1982-05-03 1984-08-21 National Semiconductor Corporation Integrated circuit packaging process
JPH0380552A (en) * 1989-08-23 1991-04-05 Nec Corp Tape for mounting integrated circuit
JPH0382047A (en) * 1989-08-24 1991-04-08 Nec Corp Film carrier semicodcutor device
JPH03125440A (en) * 1989-10-09 1991-05-28 Rohm Co Ltd Electronic parts
US5401794A (en) * 1994-06-03 1995-03-28 Shell Oil Company Stabilized polyketone polymer compositions
KR20190070622A (en) * 2017-12-13 2019-06-21 주식회사 엘비루셈 Film for use in COF Package with 2-layer Pattern

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