JPS55130152A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS55130152A
JPS55130152A JP3687079A JP3687079A JPS55130152A JP S55130152 A JPS55130152 A JP S55130152A JP 3687079 A JP3687079 A JP 3687079A JP 3687079 A JP3687079 A JP 3687079A JP S55130152 A JPS55130152 A JP S55130152A
Authority
JP
Japan
Prior art keywords
lead piece
opening
lead
pellet
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3687079A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3687079A priority Critical patent/JPS55130152A/en
Publication of JPS55130152A publication Critical patent/JPS55130152A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To retain the thickness of a semiconductor device always constant by forming a semiconductor pellet on the opposite side of the insulating film side of a lead piece and coating a resin sealing member between the pellet and the lead piece and on the opening of the lead piece. CONSTITUTION:A plurality of lead pieces 22 are extended from the interior of an opening 21a adhesively supported on an insulating film 21 toward the periphery. A semiconductor pellet 23 is formed on the side end of the opening 21a of the lead pieces 22 to be disposed at the opposite side of the film 21 of the lead piece 22. A resin sealing member 25 is then coated on the surface portion excluding the opposite side surface to the lead piece 22 side of the pellet 23 and on the portion of the interior of the opening 21a of the lead piece 22.
JP3687079A 1979-03-30 1979-03-30 Resin sealed semiconductor device Pending JPS55130152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3687079A JPS55130152A (en) 1979-03-30 1979-03-30 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3687079A JPS55130152A (en) 1979-03-30 1979-03-30 Resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS55130152A true JPS55130152A (en) 1980-10-08

Family

ID=12481810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3687079A Pending JPS55130152A (en) 1979-03-30 1979-03-30 Resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS55130152A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0214621A2 (en) * 1985-09-05 1987-03-18 Nec Corporation A package comprising a substrate and at least one electronic component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5230184A (en) * 1975-09-02 1977-03-07 Sharp Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5230184A (en) * 1975-09-02 1977-03-07 Sharp Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0214621A2 (en) * 1985-09-05 1987-03-18 Nec Corporation A package comprising a substrate and at least one electronic component

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