JPS51144179A - Element fixing method in semiconductor unit - Google Patents

Element fixing method in semiconductor unit

Info

Publication number
JPS51144179A
JPS51144179A JP6840375A JP6840375A JPS51144179A JP S51144179 A JPS51144179 A JP S51144179A JP 6840375 A JP6840375 A JP 6840375A JP 6840375 A JP6840375 A JP 6840375A JP S51144179 A JPS51144179 A JP S51144179A
Authority
JP
Japan
Prior art keywords
fixing method
element fixing
semiconductor unit
metal foil
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6840375A
Other languages
Japanese (ja)
Inventor
Katsunao Takehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6840375A priority Critical patent/JPS51144179A/en
Publication of JPS51144179A publication Critical patent/JPS51144179A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: Element fixing method bearable to temperature variation achieved by bonding semiconductor element to flexible metal foil and partly bonding the opposite face of metal foil to package.
COPYRIGHT: (C)1976,JPO&Japio
JP6840375A 1975-06-05 1975-06-05 Element fixing method in semiconductor unit Pending JPS51144179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6840375A JPS51144179A (en) 1975-06-05 1975-06-05 Element fixing method in semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6840375A JPS51144179A (en) 1975-06-05 1975-06-05 Element fixing method in semiconductor unit

Publications (1)

Publication Number Publication Date
JPS51144179A true JPS51144179A (en) 1976-12-10

Family

ID=13372676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6840375A Pending JPS51144179A (en) 1975-06-05 1975-06-05 Element fixing method in semiconductor unit

Country Status (1)

Country Link
JP (1) JPS51144179A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929091A (en) * 1972-07-13 1974-03-15
JPS4929071A (en) * 1972-07-12 1974-03-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929071A (en) * 1972-07-12 1974-03-15
JPS4929091A (en) * 1972-07-13 1974-03-15

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