JPS5235580A - Element fixing method of semiconductor device - Google Patents

Element fixing method of semiconductor device

Info

Publication number
JPS5235580A
JPS5235580A JP11130575A JP11130575A JPS5235580A JP S5235580 A JPS5235580 A JP S5235580A JP 11130575 A JP11130575 A JP 11130575A JP 11130575 A JP11130575 A JP 11130575A JP S5235580 A JPS5235580 A JP S5235580A
Authority
JP
Japan
Prior art keywords
semiconductor device
fixing method
element fixing
package
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11130575A
Other languages
Japanese (ja)
Inventor
Katsunao Takehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11130575A priority Critical patent/JPS5235580A/en
Publication of JPS5235580A publication Critical patent/JPS5235580A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To absorb the heat expansion difference between semiconductor element and package, flexible metal foil and metal foil with fusing point under 310°C are used. As a result, fixation of semiconductor element and package is never broken.
COPYRIGHT: (C)1977,JPO&Japio
JP11130575A 1975-09-12 1975-09-12 Element fixing method of semiconductor device Pending JPS5235580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11130575A JPS5235580A (en) 1975-09-12 1975-09-12 Element fixing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11130575A JPS5235580A (en) 1975-09-12 1975-09-12 Element fixing method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5235580A true JPS5235580A (en) 1977-03-18

Family

ID=14557843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11130575A Pending JPS5235580A (en) 1975-09-12 1975-09-12 Element fixing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5235580A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310125A (en) * 1987-06-11 1988-12-19 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310125A (en) * 1987-06-11 1988-12-19 Mitsubishi Electric Corp Semiconductor device

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