JPS5212573A - Reed frame - Google Patents

Reed frame

Info

Publication number
JPS5212573A
JPS5212573A JP50088299A JP8829975A JPS5212573A JP S5212573 A JPS5212573 A JP S5212573A JP 50088299 A JP50088299 A JP 50088299A JP 8829975 A JP8829975 A JP 8829975A JP S5212573 A JPS5212573 A JP S5212573A
Authority
JP
Japan
Prior art keywords
reed frame
suspender
tab
absorbs
fit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50088299A
Other languages
Japanese (ja)
Inventor
Yoshitake Kogasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50088299A priority Critical patent/JPS5212573A/en
Publication of JPS5212573A publication Critical patent/JPS5212573A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: Fit a buffer part with a part of the tab suspender of a reed frame, which absorbs a change in length due to thermal expansion, and prevent short circuit of a semiconductor pellet and metal piano wire when resin sealing.
COPYRIGHT: (C)1977,JPO&Japio
JP50088299A 1975-07-21 1975-07-21 Reed frame Pending JPS5212573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50088299A JPS5212573A (en) 1975-07-21 1975-07-21 Reed frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50088299A JPS5212573A (en) 1975-07-21 1975-07-21 Reed frame

Publications (1)

Publication Number Publication Date
JPS5212573A true JPS5212573A (en) 1977-01-31

Family

ID=13939036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50088299A Pending JPS5212573A (en) 1975-07-21 1975-07-21 Reed frame

Country Status (1)

Country Link
JP (1) JPS5212573A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118658A (en) * 1981-12-07 1982-07-23 Hitachi Ltd Lead frame
JPS6163047A (en) * 1985-06-28 1986-04-01 Hitachi Ltd Lead frame for resin sealed type semiconductor device
US4803540A (en) * 1986-11-24 1989-02-07 American Telephone And Telegraph Co., At&T Bell Labs Semiconductor integrated circuit packages
US4977442A (en) * 1988-02-24 1990-12-11 Fujitsu Limited Lead frame and method of producing electronic components using such improved lead frame
USRE34269E (en) * 1986-11-24 1993-06-01 At&T Bell Laboratories Semiconductor integrated circuit packages
US5637917A (en) * 1995-09-20 1997-06-10 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly for a semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118658A (en) * 1981-12-07 1982-07-23 Hitachi Ltd Lead frame
JPS6163047A (en) * 1985-06-28 1986-04-01 Hitachi Ltd Lead frame for resin sealed type semiconductor device
US4803540A (en) * 1986-11-24 1989-02-07 American Telephone And Telegraph Co., At&T Bell Labs Semiconductor integrated circuit packages
USRE34269E (en) * 1986-11-24 1993-06-01 At&T Bell Laboratories Semiconductor integrated circuit packages
US4977442A (en) * 1988-02-24 1990-12-11 Fujitsu Limited Lead frame and method of producing electronic components using such improved lead frame
US5094982A (en) * 1988-02-24 1992-03-10 Fujitsu Limited Lead frame and method of producing electronic components using such improved lead frame
US5637917A (en) * 1995-09-20 1997-06-10 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly for a semiconductor device

Similar Documents

Publication Publication Date Title
JPS5239378A (en) Silicon-gated mos type semiconductor device
JPS5212573A (en) Reed frame
JPS53135574A (en) Lead frame
JPS5295173A (en) Lead frame
JPS53105175A (en) Lead frame for resin sealing semiconductor device
JPS5379381A (en) Production of resin seal type semiconductor device and lead frame used forthe same
JPS52172A (en) Semiconductor
JPS52131464A (en) Manufacture of semiconductor device
JPS5348463A (en) Semiconductor integrated circuit support
JPS5315070A (en) Semiconductor device
JPS5323044A (en) Switchboard
JPS5250167A (en) Semiconductor device
JPS5233776A (en) Temperature detecting circuit
JPS5314563A (en) Fixing method of semiconductor pellet to lead frame
JPS5295973A (en) Manufacture of semiconductor unit with heat sink
JPS5375766A (en) Mounting construction for semiconductor element
JPS52149322A (en) Soft starting circuit of commutation circuit
JPS5214351A (en) Semiconductor device
JPS5214354A (en) Semiconductor device
JPS51126066A (en) Resin sealing method of the semi-conductor element
JPS51132767A (en) Formation method of semiconductor device
JPS5214361A (en) Semiconductor device sealed with resin
JPS51142274A (en) Electrode lead for semiconductor device
JPS52127760A (en) Glass-seal type semiconductor unit
JPS52142484A (en) Production of semiconductor device