JPS57118658A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS57118658A
JPS57118658A JP19570581A JP19570581A JPS57118658A JP S57118658 A JPS57118658 A JP S57118658A JP 19570581 A JP19570581 A JP 19570581A JP 19570581 A JP19570581 A JP 19570581A JP S57118658 A JPS57118658 A JP S57118658A
Authority
JP
Japan
Prior art keywords
tab
section
lead frame
sections
suspension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19570581A
Other languages
Japanese (ja)
Inventor
Yuji Sano
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19570581A priority Critical patent/JPS57118658A/en
Publication of JPS57118658A publication Critical patent/JPS57118658A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the deformation of a tab suspension section by a method wherein the tab section of the lead frame for IC is positioned a little lower than a plane surface, and at the same time, a deformed part to be used for stress relaxation is provided at the tab suspension section. CONSTITUTION:The tab section 11 of the lead frame 10, to be used for resin sealing IC, which was formed by punching out single plate, is positioned a little below the plane surface of tab suspensions 12 and 13. Deformed sections 12A and 13A, to be used for stress relaxation, consisted of a narrow-width section, is provided on the suspension sections 12 and 13, and the deformation to A direction of the tab suspension sections is prevented. Through these procedures, the wetting property of the soldering material when a pellet is attached and the bondability when a wire bonding is performed can be improved.
JP19570581A 1981-12-07 1981-12-07 Lead frame Pending JPS57118658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19570581A JPS57118658A (en) 1981-12-07 1981-12-07 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19570581A JPS57118658A (en) 1981-12-07 1981-12-07 Lead frame

Publications (1)

Publication Number Publication Date
JPS57118658A true JPS57118658A (en) 1982-07-23

Family

ID=16345602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19570581A Pending JPS57118658A (en) 1981-12-07 1981-12-07 Lead frame

Country Status (1)

Country Link
JP (1) JPS57118658A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232359A (en) * 1986-11-24 1988-09-28 アメリカン　テレフォン　アンド　テレグラフ　カムパニー Semiconductor integrated circuit package
USRE34269E (en) * 1986-11-24 1993-06-01 At&T Bell Laboratories Semiconductor integrated circuit packages
WO2014013848A1 (en) * 2012-07-19 2014-01-23 日産自動車株式会社 Semiconductor device
WO2016110545A1 (en) * 2015-01-09 2016-07-14 Osram Opto Semiconductors Gmbh Lead frame and method for producing a chip housing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104262A (en) * 1975-03-11 1976-09-14 Mitsubishi Electric Corp FUSHIGATAHANDOTAISOCHINOSEIZOHOHO
JPS5212573A (en) * 1975-07-21 1977-01-31 Hitachi Ltd Reed frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104262A (en) * 1975-03-11 1976-09-14 Mitsubishi Electric Corp FUSHIGATAHANDOTAISOCHINOSEIZOHOHO
JPS5212573A (en) * 1975-07-21 1977-01-31 Hitachi Ltd Reed frame

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232359A (en) * 1986-11-24 1988-09-28 アメリカン　テレフォン　アンド　テレグラフ　カムパニー Semiconductor integrated circuit package
USRE34269E (en) * 1986-11-24 1993-06-01 At&T Bell Laboratories Semiconductor integrated circuit packages
WO2014013848A1 (en) * 2012-07-19 2014-01-23 日産自動車株式会社 Semiconductor device
WO2016110545A1 (en) * 2015-01-09 2016-07-14 Osram Opto Semiconductors Gmbh Lead frame and method for producing a chip housing
US10297537B2 (en) 2015-01-09 2019-05-21 Osram Opto Semiconductors Gmbh Lead frame and method of producing a chip housing
DE112016000307B4 (en) 2015-01-09 2023-04-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Lead frame and method for producing a chip housing and method for producing an optoelectronic component

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