JPS5315070A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5315070A JPS5315070A JP8904176A JP8904176A JPS5315070A JP S5315070 A JPS5315070 A JP S5315070A JP 8904176 A JP8904176 A JP 8904176A JP 8904176 A JP8904176 A JP 8904176A JP S5315070 A JPS5315070 A JP S5315070A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bondability
- solderability
- ductility
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: The strength, ductility and particularly solderability and bondability to resins of lead wires mainly composed of copper are improved.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8904176A JPS6034267B2 (en) | 1976-07-28 | 1976-07-28 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8904176A JPS6034267B2 (en) | 1976-07-28 | 1976-07-28 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5315070A true JPS5315070A (en) | 1978-02-10 |
JPS6034267B2 JPS6034267B2 (en) | 1985-08-07 |
Family
ID=13959797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8904176A Expired JPS6034267B2 (en) | 1976-07-28 | 1976-07-28 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6034267B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57109357A (en) * | 1980-12-26 | 1982-07-07 | Nippon Mining Co Ltd | Copper alloy for semiconductor device lead |
JPS58123862A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Manufacture of copper alloy for lead material for semiconductor apparatus |
-
1976
- 1976-07-28 JP JP8904176A patent/JPS6034267B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57109357A (en) * | 1980-12-26 | 1982-07-07 | Nippon Mining Co Ltd | Copper alloy for semiconductor device lead |
JPS6213823B2 (en) * | 1980-12-26 | 1987-03-28 | Nippon Mining Co | |
JPS58123862A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Manufacture of copper alloy for lead material for semiconductor apparatus |
JPS6058783B2 (en) * | 1982-01-20 | 1985-12-21 | 日本鉱業株式会社 | Method for manufacturing copper alloy for lead material of semiconductor equipment |
Also Published As
Publication number | Publication date |
---|---|
JPS6034267B2 (en) | 1985-08-07 |
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