JPS5315070A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5315070A
JPS5315070A JP8904176A JP8904176A JPS5315070A JP S5315070 A JPS5315070 A JP S5315070A JP 8904176 A JP8904176 A JP 8904176A JP 8904176 A JP8904176 A JP 8904176A JP S5315070 A JPS5315070 A JP S5315070A
Authority
JP
Japan
Prior art keywords
semiconductor device
bondability
solderability
ductility
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8904176A
Other languages
Japanese (ja)
Other versions
JPS6034267B2 (en
Inventor
Haruka Machitori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8904176A priority Critical patent/JPS6034267B2/en
Publication of JPS5315070A publication Critical patent/JPS5315070A/en
Publication of JPS6034267B2 publication Critical patent/JPS6034267B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: The strength, ductility and particularly solderability and bondability to resins of lead wires mainly composed of copper are improved.
COPYRIGHT: (C)1978,JPO&Japio
JP8904176A 1976-07-28 1976-07-28 semiconductor equipment Expired JPS6034267B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8904176A JPS6034267B2 (en) 1976-07-28 1976-07-28 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8904176A JPS6034267B2 (en) 1976-07-28 1976-07-28 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5315070A true JPS5315070A (en) 1978-02-10
JPS6034267B2 JPS6034267B2 (en) 1985-08-07

Family

ID=13959797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8904176A Expired JPS6034267B2 (en) 1976-07-28 1976-07-28 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6034267B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57109357A (en) * 1980-12-26 1982-07-07 Nippon Mining Co Ltd Copper alloy for semiconductor device lead
JPS58123862A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Manufacture of copper alloy for lead material for semiconductor apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57109357A (en) * 1980-12-26 1982-07-07 Nippon Mining Co Ltd Copper alloy for semiconductor device lead
JPS6213823B2 (en) * 1980-12-26 1987-03-28 Nippon Mining Co
JPS58123862A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Manufacture of copper alloy for lead material for semiconductor apparatus
JPS6058783B2 (en) * 1982-01-20 1985-12-21 日本鉱業株式会社 Method for manufacturing copper alloy for lead material of semiconductor equipment

Also Published As

Publication number Publication date
JPS6034267B2 (en) 1985-08-07

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